H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2011
03/17/2011	US20110062567 Leadframe and chip package
03/17/2011	US20110062566 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
03/17/2011	US20110062565 Method for manufacturing a microelectronic package comprising at least one microelectronic device
03/17/2011	US20110062564 Semiconductor die containing lateral edge shapes and textures
03/17/2011	US20110062563 Non-volatile memory with reduced mobile ion diffusion
03/17/2011	US20110062562 Dielectric layer structure
03/17/2011	US20110062553 Semiconductor device and method of manufacturing thereof
03/17/2011	US20110062533 Device package substrate and method of manufacturing the same
03/17/2011	US20110062532 MEMS Chip And Package Method Thereof
03/17/2011	US20110062442 Semiconductor Device Test Structures and Methods
03/17/2011	US20110061847 Heat dissipation device
03/17/2011	DE112009000447T5 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
03/17/2011	DE102009039677A1 Verfahren und Vorrichtung zur Unterstützung von Green-IT und energieautarker Systeme Method and apparatus for supporting Green IT and energy self-sufficient systems
03/17/2011	DE102009039416A1 Abgesenktes Zwischenschichtdielektrikum in einer Metallisierungsstruktur eines Halbleiterbauelements Lowered interlayer in a metallization of a semiconductor device
03/17/2011	DE102009024385B4 Verfahren zur Herstellung eines Leistungshalbleitermoduls und Leistungshalbleitermodul mit einer Verbindungseinrichtung Method for producing a power semiconductor module and power semiconductor module with a connecting device
03/17/2011	DE102005044510B4 Halbleiterbauteil mit Vorderseitenmetallisierung sowie Verfahren zu dessen Herstellung und Leistungsdiode A semiconductor device comprising front-side as well as methods for its production and power diode
03/16/2011	EP2296454A1 Thermal management system
03/16/2011	EP2296451A1 Terminal structure, printed wiring board, module substrate, and electronic device
03/16/2011	EP2296291A2 Wireless transmission system and wireless transmission method
03/16/2011	EP2296178A2 Impedance optimized chip system
03/16/2011	EP2296177A1 Substrate for power module, power module, and method for producing substrate for power module
03/16/2011	EP2295844A2 Light-emitting device and illumination device
03/16/2011	EP2295499A1 Underfill composition and an optical semiconductor device
03/16/2011	EP2294902A1 Cooling system for an led chip array
03/16/2011	EP2294613A1 Planar electrical power electronic modules for high-temperature applications, and corresponding production methods
03/16/2011	EP2294612A1 Stacked electronic device and process for fabricating such an electronic device
03/16/2011	EP2294496A2 Graphics card thermal interposer
03/16/2011	EP2188835B1 Semiconductor device
03/16/2011	EP2095416B1 Method of manufacturing openings in a substrate, in particular of vias through the substrate
03/16/2011	EP1979942B1 Stress buffering package for a semiconductor component
03/16/2011	EP1517364B1 Semiconductor device and its producing method
03/16/2011	CN201766800U Heat dissipation structure
03/16/2011	CN201766794U Heat sink and electronic arithmetic system adopting same
03/16/2011	CN201766769U Radiating structure
03/16/2011	CN201766105U Hall-effect current sensor system, flip semiconductor device and lead frame structure
03/16/2011	CN201766077U Packaging structure with paddle for passive device
03/16/2011	CN201766076U Surface mount rectifier with double crystal grains
03/16/2011	CN201766075U Integrated circuit block
03/16/2011	CN201766074U Lead frame and semi-conductor packaging part adopting same
03/16/2011	CN201766073U Lead frame capable of reinforcing sealing adhesive jointing degree and packaging structure of lead frame
03/16/2011	CN201766072U Diamond particle used for welding material
03/16/2011	CN201766071U Heat dissipation structure of power semiconductor
03/16/2011	CN201766070U Diversion and heat dissipation module in power circuit
03/16/2011	CN201766069U Chip suspension type semiconductor packaging and radiating improved structure
03/16/2011	CN201765799U Array substrate provided with detection circuit layout
03/16/2011	CN1839471B IC package for semiconductor devices with improved electric resistance and inductance
03/16/2011	CN1722022B Endless belt type transferring apparatus and image forming apparatus
03/16/2011	CN1619807B Substrate including integrated circuit chip and integrated circuit on said substrate
03/16/2011	CN101986796A Passive cooling system for photo voltaic modules
03/16/2011	CN101986775A Large-power radiating module
03/16/2011	CN101986429A Chip package and manufacturing method thereof
03/16/2011	CN101986428A Power semiconductor component, power semiconductor assembly including the same and a method for operating the power semiconductor assembly
03/16/2011	CN101986427A Semiconductor wafer having pre-aligning pattern and method for pre-aligning the same
03/16/2011	CN101986426A Manufacturing method of semiconductor device
03/16/2011	CN101986424A Diffusion bonding circuit submount directly to vapor chamber
03/16/2011	CN101986001A Light-emitting diode (LED) lamp
03/16/2011	CN101985513A POSS/epoxy nanometer hybrid material and preparation method and application thereof
03/16/2011	CN101661891B Chip packaging method of resin core column
03/16/2011	CN101651133B Chip wiring method on film for decreasing electromagnetic interference and structure
03/16/2011	CN101644418B Lighting appliance
03/16/2011	CN101611487B Thin-film solar module
03/16/2011	CN101562157B Chip encapsulation structure and support device thereof
03/16/2011	CN101545127B Process for producing electronically-encapsulated metal cover plate
03/16/2011	CN101527297B Alignment apparatus and application thereof
03/16/2011	CN101494259B Non-halation LED base structure
03/16/2011	CN101494209B Conductor frame and chip encapsulation body
03/16/2011	CN101488492B Semiconductor encapsulation structure having substrate identification code and manufacturing method thereof
03/16/2011	CN101482255B High-power LED lamp circuit with fan
03/16/2011	CN101477978B Semiconductor apparatus
03/16/2011	CN101472392B Pad-welding structure and debug method applying the same
03/16/2011	CN101453828B Electromagnetic bandgap structure and printed circuit board
03/16/2011	CN101452920B Light emitting unit
03/16/2011	CN101452919B Multi-wafer intersecting stacking encapsulation construction
03/16/2011	CN101452915B Multi-system module having functional carrier plate
03/16/2011	CN101442040B Encapsulation structure for LED and method of manufacturing the same
03/16/2011	CN101442035B Flat non down-lead encapsulation piece and method for producing the same
03/16/2011	CN101436574B CPU radiator
03/16/2011	CN101419935B Metal line and method for fabricating metal line of the semiconductor device
03/16/2011	CN101409265B Substrate for semiconductor package structure, semiconductor package structure and manufacturing method thereof
03/16/2011	CN101399263B Circuit device
03/16/2011	CN101378058B LCD driver IC and method for manufacturing the same
03/16/2011	CN101373759B Semiconductor-packaged stacking combination and used stacked semiconductor packaging piece thereof
03/16/2011	CN101359650B Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same
03/16/2011	CN101330071B Mounting substrate and manufacturing method thereof
03/16/2011	CN101326646B 单片集成的半导体材料和器件 Monolithically integrated semiconductor materials and devices
03/16/2011	CN101313403B Reticle alignment technique
03/16/2011	CN101305455B Package using array capacitor core
03/16/2011	CN101276807B Semiconductor device and method of manufacturing the same
03/16/2011	CN101266955B Semiconductor device and its making method
03/16/2011	CN101231990B Tape coiling type packaging construction capable of inserting and electronic device using the construction
03/16/2011	CN101212126B Heat spreader and semiconductor device using the same
03/16/2011	CN101207109B Wiring structure of printed wiring board and method for forming the same
03/16/2011	CN101171684B One time programmable memory cell
03/16/2011	CN101091251B Semiconductor-on-insulator structures containing high strain glass/glass-ceramic
03/15/2011	US7907412 Electronic device with improved heat dissipation properties
03/15/2011	US7907390 Circuit device
03/15/2011	US7906860 Semiconductor device
03/15/2011	US7906857 Molded integrated circuit package and method of forming a molded integrated circuit package
03/15/2011	US7906856 Semiconductor device and method for manufacturing semiconductor device
03/15/2011	US7906855 Stacked semiconductor package and method of making same

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