H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2011
03/22/2011	US7911056 Substrate structure having N-SMD ball pads
03/22/2011	US7911055 Semiconductor device and manufacturing method of the same
03/22/2011	US7911054 Semiconductor device
03/22/2011	US7911053 Semiconductor packaging with internal wiring bus
03/22/2011	US7911052 Nanotube based vapor chamber for die level cooling
03/22/2011	US7911051 Electronic circuit arrangement and method for producing an electronic circuit arrangement
03/22/2011	US7911050 Semiconductor device and method for manufacturing the same
03/22/2011	US7911049 Electrically optimized and structurally protected via structure for high speed signals
03/22/2011	US7911048 Wiring substrate
03/22/2011	US7911047 Semiconductor device and method of fabricating the semiconductor device
03/22/2011	US7911046 Integrated circuit packaging system with interposer
03/22/2011	US7911045 Semiconductor element and semiconductor device
03/22/2011	US7911044 RF module package for releasing stress
03/22/2011	US7911043 Wafer level device package with sealing line having electroconductive pattern and method of packaging the same
03/22/2011	US7911042 Package having shield case
03/22/2011	US7911041 Semiconductor device with gold coatings, and process for producing it
03/22/2011	US7911040 Integrated circuit package with improved connections
03/22/2011	US7911039 Component arrangement comprising a carrier
03/22/2011	US7911038 Wiring board, semiconductor device using wiring board and their manufacturing methods
03/22/2011	US7911037 Method and structure for creating embedded metal features
03/22/2011	US7911025 Fuse/anti-fuse structure and methods of making and programming same
03/22/2011	US7911018 Optical device and method of manufacturing the same
03/22/2011	US7911017 Direct glass attached on die optical module
03/22/2011	US7911012 Flexible and elastic dielectric integrated circuit
03/22/2011	US7911009 Nanosensors
03/22/2011	US7911003 Semiconductor integrated circuit device
03/22/2011	US7910999 Method for four direction low capacitance ESD protection
03/22/2011	US7910998 Silicon controlled rectifier device for electrostatic discharge protection
03/22/2011	US7910967 Ferroelectric capacitor having three-dimensional structure, nonvolatile memory device having the same and method of fabricating the same
03/22/2011	US7910960 Semiconductor integrated circuit device with a fuse circuit
03/22/2011	US7910957 Semiconductor device
03/22/2011	US7910952 Power semiconductor arrangement
03/22/2011	US7910951 Low side zener reference voltage extended drain SCR clamps
03/22/2011	US7910948 Light emitting diode package
03/22/2011	US7910947 Panel-shaped semiconductor module
03/22/2011	US7910946 Light emitting apparatus and semiconductor apparatus, and method for manufacturing the same
03/22/2011	US7910945 Nickel tin bonding system with barrier layer for semiconductor wafers and devices
03/22/2011	US7910927 Thin film transistor array panel with common bars of different widths
03/22/2011	US7910922 Semiconductor integrated circuit device and manufacture thereof
03/22/2011	US7910674 Polymerized cycloolefins using transition metal catalyst and end products thereof
03/22/2011	US7910474 Method of manufacturing a semiconductor device
03/22/2011	US7910471 Bumpless wafer scale device and board assembly
03/22/2011	US7910405 Semiconductor device having adhesion increasing film to prevent peeling
03/22/2011	US7910385 Method of fabricating microelectronic devices
03/22/2011	US7910053 Semiconductor device and active matrix display device
03/22/2011	US7909902 Modified hexagonal perforated pattern
03/22/2011	US7909233 Method of manufacturing a semiconductor package with fine pitch lead fingers
03/22/2011	US7908745 Method of manufacturing multi-layer printed circuit board
03/22/2011	US7908738 Apparatus for manufacturing a wireless communication device
03/17/2011	WO2011031858A1 High aspect ratio silicon oxide etch
03/17/2011	WO2011031417A2 Electronic device submounts with thermally conductive vias and light emitting devices including the same
03/17/2011	WO2011030797A1 Method for producing semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device
03/17/2011	WO2011030754A1 Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module
03/17/2011	WO2011030584A1 Active matrix substrate and display device
03/17/2011	WO2011030516A1 Semiconductor device
03/17/2011	WO2011030504A1 Body having electronic component mounted thereon, method for manufacturing same, and interposer
03/17/2011	WO2011029778A1 System for thermally controlling an apparatus
03/17/2011	WO2011029185A1 Semiconductor chip with stair arrangement bump structures
03/17/2011	WO2011029154A1 Improved light emitting diode (led) assembly and method of manufacturing the same
03/17/2011	WO2011000360A3 Electronic device
03/17/2011	US20110067083 Fully Integrated Tuner Architecture
03/17/2011	US20110065285 Dielectric layer structure and manufacturing method thereof
03/17/2011	US20110065241 Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump
03/17/2011	US20110065240 Lead frame and method of forming same
03/17/2011	US20110064105 Silicon carbide on diamond substrates and related devices and methods
03/17/2011	US20110062604 Scratch-resistant coatings for protecting front-side circuitry during backside processing
03/17/2011	US20110062603 Encapsulation architectures for utilizing flexible barrier films
03/17/2011	US20110062602 Integrated circuit packaging system with fan-in package and method of manufacture thereof
03/17/2011	US20110062601 Generating an integrated circuit identifier
03/17/2011	US20110062600 Semiconductor element module and method for manufacturing the same
03/17/2011	US20110062599 Integrated circuit packaging system with package stacking and method of manufacture thereof
03/17/2011	US20110062596 Semiconductor chip stacked structure and method of manufacturing same
03/17/2011	US20110062595 Pattern structures in semiconductor devices
03/17/2011	US20110062594 Through hole electrode substrate, method for manufacturing the through hole electrode substrate, and semiconductor device using the through hole electrode substrate
03/17/2011	US20110062593 Semiconductor packaging substrate and semiconductor device
03/17/2011	US20110062592 Delamination Resistance of Stacked Dies in Die Saw
03/17/2011	US20110062591 Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
03/17/2011	US20110062590 Chip Stacking Device Having Re-Distribution Layer
03/17/2011	US20110062589 Semiconductor device having copper wiring with increased migration resistance
03/17/2011	US20110062588 Semiconductor device and method for manufacturing same
03/17/2011	US20110062587 Large grain size conductive structure for narrow interconnect openings
03/17/2011	US20110062586 Chip for Reliable Stacking on another Chip
03/17/2011	US20110062585 Semiconductor device
03/17/2011	US20110062584 Three-dimensionally integrated semicondutor device and method for manufacturing the same
03/17/2011	US20110062583 Stacked die package for peripheral and center device pad layout device
03/17/2011	US20110062582 Display device
03/17/2011	US20110062581 Semiconductor package
03/17/2011	US20110062580 Protection layer for preventing ubm layer from chemical attack and oxidation
03/17/2011	US20110062579 Group iii nitride based flip-chip integrated circuit and method for fabricating
03/17/2011	US20110062578 Semiconductor device and method of manufacturing the same
03/17/2011	US20110062577 Substrate and package with micro bga configuration
03/17/2011	US20110062576 Integrated circuit package and device
03/17/2011	US20110062575 Semiconductor Device and Method of Forming Cavity in PCB Containing Encapsulant or Dummy Die Having CTE Similar to CTE of Large Array WLCSP
03/17/2011	US20110062574 Integrated circuit packaging system with package-on-package and method of manufacture thereof
03/17/2011	US20110062573 Double-side mountable MEMS package
03/17/2011	US20110062572 Self-aligned silicon carrier for optical device supporting wafer scale methods
03/17/2011	US20110062571 Optical device, integrated circuit device and system
03/17/2011	US20110062570 Isolated stacked die semiconductor packages
03/17/2011	US20110062569 Semiconductor device package with down-set leads
03/17/2011	US20110062568 Folded lands and vias for multichip semiconductor packages

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