H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2011
03/23/2011	CN101990384A Heat conducting structure with coplanar heated parts and manufacturing method thereof, and radiator with heat conducting structure
03/23/2011	CN101989610A Integrated circuit, back side illuminated image sensor and front side illuminated image sensor
03/23/2011	CN101989607A Image sensor package structure
03/23/2011	CN101989604A Memory element
03/23/2011	CN101989600A Semiconductor structure and manufacturing method thereof
03/23/2011	CN101989598A Multi-die package
03/23/2011	CN101989597A Power semiconductor module with a load connection terminal having a symmetrical current distribution
03/23/2011	CN101989596A Thermoelectric module and optical transmission apparatus
03/23/2011	CN101989595A Power device module
03/23/2011	CN101989594A Test structure and test method of semiconductor device
03/23/2011	CN101989593A Packaging substrate as well as manufacturing method and packaging structure thereof
03/23/2011	CN101989592A Packaging substrate as well as manufacturing method and base material thereof
03/23/2011	CN101989591A Semiconductor device and method of manufacturing the same
03/23/2011	CN101989590A New bump structure
03/23/2011	CN101989589A Power device package and method of fabricating the same
03/23/2011	CN101989588A Electrical connecting structure used for packaging substrate and packaging structure thereof
03/23/2011	CN101989587A Electrical connection structure of circuit board and circuit board device
03/23/2011	CN101989586A Metal terminal and construction method thereof
03/23/2011	CN101989585A 微电子封装体 Microelectronic package
03/23/2011	CN101989584A Method for increasing the thermal coupling heat radiation and reliability of a cooling module
03/23/2011	CN101989583A Radiating structure and radiating system employing same
03/23/2011	CN101989582A Packaging substrate embedded with semiconductor chip
03/23/2011	CN101989581A Packaging structure and packaging method
03/23/2011	CN101989580A Image sensor package structure with large air cavity
03/23/2011	CN101989579A Thin film transistor (TFT) array substrate and manufacture method thereof
03/23/2011	CN101989558A Semiconductor device and method of producing the same
03/23/2011	CN101989557A Manufacturing method of semiconductor device and semiconductor device
03/23/2011	CN101989556A Method for forming a semiconductor device and method of forming electrical connections to a semiconductor wafer
03/23/2011	CN101989555A Manufacturing method for molding image sensor package structure and image sensor package structure thereof
03/23/2011	CN101989554A Packaging structure and packaging process
03/23/2011	CN101988655A Street lamp with high-power light-emitting diode (LED) single polycrystalline chip die set
03/23/2011	CN101988625A Novel LED (Light-Emitting Diode) miner lamp
03/23/2011	CN101685843B Method for packaging light emitting diode
03/23/2011	CN101667598B Vertical double-diffused MOS transistor testing structure
03/23/2011	CN101622707B Semiconductor module and inverter apparatus
03/23/2011	CN101621041B Packaging structure with reconfiguration chip and method thereof
03/23/2011	CN101621015B Metal lug surface planarization method
03/23/2011	CN101619842B Light-emitting diode lamp and light engine thereof
03/23/2011	CN101611492B Electronic board and cold plate for said board
03/23/2011	CN101599485B Horizontal type high-power thyristor valve string voltage-sharing transition device
03/23/2011	CN101599479B Electrical fuse, semiconductor device and method of disconnecting electrical fuse
03/23/2011	CN101587858B Semiconductor device interconnected structure and manufacturing method thereof
03/23/2011	CN101587857B Cover layer of semiconductor device interconnected structure and manufacturing method thereof
03/23/2011	CN101567351B Miniature radio frequency module and packaging method thereof
03/23/2011	CN101556951B Photo-thyristor valve body radiating with heat pipe
03/23/2011	CN101552214B Multi-chip stacking method for halving routing procedure and structure thereof
03/23/2011	CN101546751B Electro-migration testing structure capable of improving service life
03/23/2011	CN101483165B Tape carrier package on reel and plasma display device using the same
03/23/2011	CN101471308B Radiating module
03/23/2011	CN101463981B LED module group with cooling structure
03/23/2011	CN101460007B Circuit board
03/23/2011	CN101459137B DRAM unit transistor device and method
03/23/2011	CN101454887B Electronic component, semiconductor package and electronic device
03/23/2011	CN101454878B Method for dry-etching interlayer insulating film
03/23/2011	CN101447498B Electro-static discharge protection device and method for manufacturing the same
03/23/2011	CN101447467B Seed gas bubble micro heat exchanger and seed gas bubble micro heat exchanger system
03/23/2011	CN101431086B Semiconductor package and its forming method
03/23/2011	CN101414588B LED radiator
03/23/2011	CN101413648B LED light fitting with heat radiation structure
03/23/2011	CN101404278B Circuit device, circuit module and outdoor unit
03/23/2011	CN101373805B LED chip with overvoltage protection structure
03/23/2011	CN101369565B Electronic apparatus
03/23/2011	CN101364593B Staggered offset stacking encapsulation construction having multistage omnibus bar in conductive wire support
03/23/2011	CN101356633B Methods of packaging a semiconductor die and package formed by the methods
03/23/2011	CN101350341B Monitoring structure for semiconductor metallic silicides
03/23/2011	CN101330050B Compensating metal oxide semiconductor image sensor and manufacturing method thereof
03/23/2011	CN101330040B Interconnection layer top layer wiring layer of semiconductor device and method for forming the same
03/23/2011	CN101309575B Combination of cooling device and fastener thereof
03/23/2011	CN101295705B Test substrate, test substrate mask and test substrate forming method
03/23/2011	CN101295685B Heat pipe and manufacturing method thereof
03/23/2011	CN101294678B Wind-electricity complementary LED road lamp heat radiating device
03/23/2011	CN101286496B Electrically conductive barrier material for copper wiring and preparing method thereof
03/23/2011	CN101252102B Method of manufacturing photoelectric conversion device
03/23/2011	CN101211909B ESD protection circuit
03/23/2011	CN101207119B Chip electrostatic protection circuit with CMOS output drive
03/23/2011	CN101165892B Method for power block
03/23/2011	CN101140915B Heat radiation substrate
03/23/2011	CN101093853B Organic light emitting diode display and method for manufacturing the same
03/23/2011	CN101009303B Organic light emitting display and method of fabricating the same
03/22/2011	US7913221 Interconnect structure of semiconductor integrated circuit, and design method and device therefor
03/22/2011	US7913212 Method for determining a length of shielding of a semiconductor integrated circuit wiring
03/22/2011	US7911798 Memory heat sink device provided with a larger heat dissipating area
03/22/2011	US7911795 Electronic device including electronic component, heat dissipating member and alloy layer
03/22/2011	US7911792 Direct dipping cooled power module and packaging
03/22/2011	US7911790 Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
03/22/2011	US7911749 Electrostatic discharge protection device for pad and method and structure thereof
03/22/2011	US7911070 Integrated circuit packaging system having planar interconnect
03/22/2011	US7911069 Semiconductor device and layout method thereof
03/22/2011	US7911068 Component and method for producing a component
03/22/2011	US7911067 Semiconductor package system with die support pad
03/22/2011	US7911066 Through-chip via interconnects for stacked integrated circuit structures
03/22/2011	US7911065 Semiconductor package having a stacked wafer level package and method for fabricating the same
03/22/2011	US7911064 Mounted body and method for manufacturing the same
03/22/2011	US7911063 Semiconductor device
03/22/2011	US7911062 Electronic component with varying rigidity leads using Pb-free solder
03/22/2011	US7911061 Semiconductor device
03/22/2011	US7911060 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
03/22/2011	US7911059 High thermal conductivity substrate for a semiconductor device
03/22/2011	US7911058 Semiconductor chip having island dispersion structure and method for manufacturing the same
03/22/2011	US7911057 Bumpless flip-chip assembly with a complaint interposer contractor

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