| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/24/2011 | WO2011033601A1 Method and apparatus for manufacturing three-dimensional integrated circuit |
| 03/24/2011 | WO2011033599A1 Semiconductor device |
| 03/24/2011 | WO2011033554A1 Versatile carbon material and method for producing same |
| 03/24/2011 | WO2011033516A1 Wafer level packaging of electronic devices |
| 03/24/2011 | WO2011033393A1 Geometry of contact sites at brittle inorganic layers in electronic devices |
| 03/24/2011 | WO2011032966A1 Electronic device for switching currents and method for producing the same |
| 03/24/2011 | WO2011032439A1 White light-emitting diode |
| 03/24/2011 | WO2010147759A3 Use of ionomeric silicone thermoplastic elastomers in electronic devices |
| 03/24/2011 | WO2010138897A3 Acousto-optic deflector applications in laser processing of dielectric or other materials |
| 03/24/2011 | US20110070696 Fabrication method of semiconductor integrated circuit device |
| 03/24/2011 | US20110068485 Component and method for producing a component |
| 03/24/2011 | US20110068484 Device and manufacturing method |
| 03/24/2011 | US20110068483 Method of manufacturing a semiconductor device and semiconductor device |
| 03/24/2011 | US20110068482 Semiconductor chip and semiconductor device |
| 03/24/2011 | US20110068481 Package-on-package type semiconductor package and method for fabricating the same |
| 03/24/2011 | US20110068480 Semiconductor device and adhesive sheet |
| 03/24/2011 | US20110068478 Integrated circuit packaging system with package stacking and method of manufacture thereof |
| 03/24/2011 | US20110068477 Through substrate via including variable sidewall profile |
| 03/24/2011 | US20110068476 Semiconductor device and manufacturing method thereof |
| 03/24/2011 | US20110068475 Semiconductor device with low resistance back-side coupling |
| 03/24/2011 | US20110068474 Semiconductor device having metal lines with slits |
| 03/24/2011 | US20110068473 Lead pin for package substrate |
| 03/24/2011 | US20110068472 Semiconductor device |
| 03/24/2011 | US20110068471 Semiconductor device and method of manufacturing semiconductor device |
| 03/24/2011 | US20110068469 Semiconductor package with pre-formed ball bonds |
| 03/24/2011 | US20110068468 Semiconductor Package with Semiconductor Core Structure and Method of Forming the Same |
| 03/24/2011 | US20110068467 Semiconductor device and method of manufacturing same |
| 03/24/2011 | US20110068466 Wafer Backside Interconnect Structure Connected to TSVs |
| 03/24/2011 | US20110068465 Strong interconnection post geometry |
| 03/24/2011 | US20110068464 Integrated circuit packaging system with package-on-package and method of manufacture thereof |
| 03/24/2011 | US20110068463 Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof |
| 03/24/2011 | US20110068462 Semiconductor chip packages having reduced stress |
| 03/24/2011 | US20110068461 Embedded die package and process flow using a pre-molded carrier |
| 03/24/2011 | US20110068460 Integration of smd components in an ic housing |
| 03/24/2011 | US20110068459 Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die |
| 03/24/2011 | US20110068458 Integrated circuit packaging system with a leaded package and method of manufacture thereof |
| 03/24/2011 | US20110068457 Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method |
| 03/24/2011 | US20110068455 Packaging structure and method for manufacturing the same |
| 03/24/2011 | US20110068453 Integrated circuit packaging system with encapsulated via and method of manufacture thereof |
| 03/24/2011 | US20110068452 Low cost die placement |
| 03/24/2011 | US20110068451 Multi-chip semiconductor connector |
| 03/24/2011 | US20110068450 Semiconductor device and manufacturing method of the same |
| 03/24/2011 | US20110068449 Semiconductor package and method of manufacturing the semiconductor package |
| 03/24/2011 | US20110068448 Integrated circuit packaging system with cap layer and method of manufacture thereof |
| 03/24/2011 | US20110068447 Integrated circuit packaging system with circuitry stacking and method of manufacture thereof |
| 03/24/2011 | US20110068446 Semiconductor Chip Attach Configuration Having Improved Thermal Characteristics |
| 03/24/2011 | US20110068445 Chip package and process thereof |
| 03/24/2011 | US20110068444 Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP |
| 03/24/2011 | US20110068443 Thermally Improved Semiconductor QFN/SON Package |
| 03/24/2011 | US20110068442 Resin-sealed semiconductor device and method of manufacturing the same |
| 03/24/2011 | US20110068441 Screened Electrical Device and a Process for Manufacturing the Same |
| 03/24/2011 | US20110068437 Semiconductor Element Having a Conductive Via and Method for Making the Same and Package Having a Semiconductor Element with a Conductive Via |
| 03/24/2011 | US20110068436 Methods and structures for enhancing perimeter-to-surface area homogeneity |
| 03/24/2011 | US20110068435 Semiconductor Chip with Crack Deflection Structure |
| 03/24/2011 | US20110068432 Fuse structure for high integrated semiconductor device |
| 03/24/2011 | US20110068427 Stackable wafer level package and fabricating method thereof |
| 03/24/2011 | US20110068365 Isolated SCR ESD device |
| 03/24/2011 | US20110068364 Bidirectional electrostatic discharge protection structure for high voltage applications |
| 03/24/2011 | US20110067845 Fan shroud assembly |
| 03/24/2011 | DE112005000446B4 Paket mit piezoelektrischem Resonatorelement und piezoelektrischer Resonator Package with piezoelectric resonator and piezoelectric resonator |
| 03/24/2011 | DE10215572B4 Elektrischer Anschluss und elektrisches Bauelement damit Electrical connection and electrical component so |
| 03/24/2011 | DE102010040842A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same |
| 03/24/2011 | DE102010003659A1 Raum- und Kosteneffizientes Einfügen von Spezialpins bei Substraten für integrierte Schaltungen Space and cost efficient insertion of Spezialpins with substrates for integrated circuits |
| 03/24/2011 | DE102009044086A1 Verfahren zur Herstellung eines elektronischen Bauteils und nach diesem Verfahren hergestelltes elektronisches Bauteil A method of manufacturing an electronic component and electronic component manufactured according to this method |
| 03/24/2011 | DE102009042519A1 Vorrichtung zur Kühlung von Halbleitern Device for cooling semiconductor |
| 03/24/2011 | DE102009042518A1 Device for cooling electronic components, has metallic base plate formed as part of holder of component and has cooling element, which is arranged adjacent to base plate |
| 03/24/2011 | DE102009041641A1 Diodenanordnung und Verfahren zur Herstellung einer Diodenanordnung Diode array and method of producing a diode arrangement |
| 03/24/2011 | DE102009041359A1 Schaltungsanordnung mit einer vorgegebenen elektrischen Kapazität Circuit arrangement having a predetermined electric capacity |
| 03/24/2011 | DE102009029447A1 Vorrichtung und Verfahren zur Erfassung von elektromagnetischer THz-Strahlung Apparatus and method for detecting electromagnetic radiation THz- |
| 03/24/2011 | DE102009029283A1 Module, particularly sensor module, has component and housing, where component is partially closed by housing, where partial area is formed in area of contact pins |
| 03/24/2011 | DE102009000888B4 Halbleiteranordnung Semiconductor device |
| 03/24/2011 | DE102006032796B4 Verfahren zum Herstellen eines Halbleiter-Bauelements A method of manufacturing a semiconductor device |
| 03/23/2011 | EP2299489A2 Cooled base plate for electric components |
| 03/23/2011 | EP2299488A1 Heat-dissiping fin assembly with heat-conducting structure |
| 03/23/2011 | EP2299487A2 Protective film and front sheet for solar cell |
| 03/23/2011 | EP2299229A1 Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having such an assembly |
| 03/23/2011 | EP2299122A2 Heat dissipating fan |
| 03/23/2011 | EP2298968A2 Method for growing nanowires |
| 03/23/2011 | EP2298490A1 Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith |
| 03/23/2011 | EP1923426B1 Resin composition and hybrid integrated circuit board making use of the same |
| 03/23/2011 | EP1831918B1 Fabrication of a ferromagnetic inductor core and capacitor electrode in a single photo mask step |
| 03/23/2011 | CN201773840U IGBT (insulated-gate bipolar transistor) power module without bonding wires |
| 03/23/2011 | CN201773838U Improved semiconductor silicon-controlled rectifier |
| 03/23/2011 | CN201773837U Lead frame for high-power MOS device |
| 03/23/2011 | CN201773836U Package lead of integrated circuit device |
| 03/23/2011 | CN201773835U Radiator for loop circuit heat pipe |
| 03/23/2011 | CN201773834U Cooling mechanism of integrated power module |
| 03/23/2011 | CN201773833U Mold core for semiconductor plastic package mold |
| 03/23/2011 | CN201773832U Aluminum-base encapsulated fast-recovery three-phase bridge |
| 03/23/2011 | CN201773831U Metal encapsulating shell of integrated circuit element |
| 03/23/2011 | CN201773830U Cover plate of integrated circuit device |
| 03/23/2011 | CN1976014B Semiconductor device and its production method |
| 03/23/2011 | CN1964048B 半导体集成电路 The semiconductor integrated circuit |
| 03/23/2011 | CN1917156B Encapsulated chip scale package having flip-chip on lead frame structure and method |
| 03/23/2011 | CN1862782B Wire loop, semiconductor device containing same and wire connecting method |
| 03/23/2011 | CN101990709A Stacked power converter structure and method |
| 03/23/2011 | CN101990390A Buckle and heat sink assembly applying same |
| 03/23/2011 | CN101990389A Radiating module |
| 03/23/2011 | CN101990388A Heat-dissipating device |
| 03/23/2011 | CN101990387A Heat sink device |