| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/30/2011 | CN101994918A LED explosion-proof lamp |
| 03/30/2011 | CN101994912A Liquid heat radiation LED (Light Emitting Diode) lamp fitting |
| 03/30/2011 | CN101993537A Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same |
| 03/30/2011 | CN101993031A Protection structure and semiconductor structure of contact pad |
| 03/30/2011 | CN101718406B LED luminous module and heat dissipation method for same |
| 03/30/2011 | CN101599473B Circuit structure and its forming method |
| 03/30/2011 | CN101593734B Flip-chip package and semiconductor chip package |
| 03/30/2011 | CN101567365B Light-emitting chip packaging structure with high-efficiency radiating substrate and method for packaging light-emitting chip |
| 03/30/2011 | CN101563777B Lead frame, method for manufacturing the lead frame, and semiconductor device having the lead frame mounted thereon |
| 03/30/2011 | CN101557697B Heat radiation die set and radiation system applying phase change metal thermal interface foil |
| 03/30/2011 | CN101540305B Semiconductor package and manufacturing methods thereof |
| 03/30/2011 | CN101507374B Semiconductor device and multilayer wiring board |
| 03/30/2011 | CN101499457B Semiconductor device and manufacturing method thereof |
| 03/30/2011 | CN101483167B Conductive wire frame strip, glue sealing method and glue sealing structure thereof |
| 03/30/2011 | CN101471417B Method for manufacturing glass plate containing fluophor and method for manufacturing light-emitting device |
| 03/30/2011 | CN101459157B Semiconductor device and method for fabricating the same |
| 03/30/2011 | CN101452897B Heat radiating device for LED |
| 03/30/2011 | CN101447497B Image sensor and method for manufacturing the same |
| 03/30/2011 | CN101447474B Image sensing wafer package structure and imaging module used by same |
| 03/30/2011 | CN101427370B Improved CMOS diodes with dual gate conductors, and methods for forming the same |
| 03/30/2011 | CN101421841B A circuit lid with a thermocouple |
| 03/30/2011 | CN101420835B Low melting point alloy thermal interface material and radiating module applying same |
| 03/30/2011 | CN101409977B Core member and method of producing the same |
| 03/30/2011 | CN101399242B Power semiconductor module |
| 03/30/2011 | CN101369582B Vertical non-volatile memory and manufacturing method thereof |
| 03/30/2011 | CN101355864B Radiating device |
| 03/30/2011 | CN101257015B Organic electroluminescent device and fabrication method thereof |
| 03/30/2011 | CN101252138B Photoelectric conversion apparatus and image pickup system using photoelectric conversion apparatus |
| 03/30/2011 | CN101252093B Method of manufacturing an electronic component and an electronic device, the electronic component and electronic device |
| 03/30/2011 | CN101246869B Chip upside-down mounting and packaging structure for reducing substrate warping and its production method |
| 03/30/2011 | CN101232013B Organic illuminated display element and manufacturing method thereof |
| 03/30/2011 | CN101213891B Ceramic electronic component and method for manufacturing the same |
| 03/30/2011 | CN101209490B Die casting die for shaping cooling component and method for manufacturing cooling component by the same |
| 03/30/2011 | CN101208001B Fixing device |
| 03/30/2011 | CN101197344B Packaging substrate and its manufacturing method |
| 03/30/2011 | CN101197315B Metal line pattern of semiconductor device and method of forming the same |
| 03/30/2011 | CN101180684B Anti-fuse memory device |
| 03/30/2011 | CN101117558B Gel injection molding material composition for aluminium silicon carbide integrated circuit pipe shell and method for preparing products |
| 03/30/2011 | CN101047157B Conducting pad system and its making method |
| 03/29/2011 | US7916295 Alignment mark and method of getting position reference for wafer |
| 03/29/2011 | US7915747 Substrate for forming semiconductor layer including alignment marks |
| 03/29/2011 | US7915745 Multi-port memory device having serial input/output interface |
| 03/29/2011 | US7915744 Bond pad structures and semiconductor devices using the same |
| 03/29/2011 | US7915743 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device |
| 03/29/2011 | US7915742 Determining the placement of semiconductor components on an integrated circuit |
| 03/29/2011 | US7915741 Solder bump UBM structure |
| 03/29/2011 | US7915739 Method and arrangement for contact-connecting semiconductor chips on a metallic substrate |
| 03/29/2011 | US7915738 Stackable multi-chip package system with support structure |
| 03/29/2011 | US7915737 Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device |
| 03/29/2011 | US7915736 Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
| 03/29/2011 | US7915735 Selective metal deposition over dielectric layers |
| 03/29/2011 | US7915734 Chip structure and process for forming the same |
| 03/29/2011 | US7915733 Semiconductor device |
| 03/29/2011 | US7915732 Production of integrated circuit chip packages prohibiting formation of micro solder balls |
| 03/29/2011 | US7915731 Semiconductor device and manufacturing method thereof |
| 03/29/2011 | US7915730 Packaging conductive structure and method for manufacturing the same |
| 03/29/2011 | US7915729 Load driving semiconductor apparatus |
| 03/29/2011 | US7915728 Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof |
| 03/29/2011 | US7915727 Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same |
| 03/29/2011 | US7915725 Silicon wafer for semiconductor with powersupply system on the backside of wafer |
| 03/29/2011 | US7915724 Integrated circuit packaging system with base structure device |
| 03/29/2011 | US7915723 Transistor array, manufacturing method thereof and image processor |
| 03/29/2011 | US7915722 Information sensing device with electroconductive structure and molded body surrounding each other |
| 03/29/2011 | US7915721 Semiconductor die package including IC driver and bridge |
| 03/29/2011 | US7915720 Semiconductor integrated circuit device and test method thereof |
| 03/29/2011 | US7915719 Semiconductor device |
| 03/29/2011 | US7915718 Apparatus for flip-chip packaging providing testing capability |
| 03/29/2011 | US7915717 Plastic image sensor packaging for image sensors |
| 03/29/2011 | US7915716 Integrated circuit package system with leadframe array |
| 03/29/2011 | US7915715 System and method to provide RF shielding for a MEMS microphone package |
| 03/29/2011 | US7915710 Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate |
| 03/29/2011 | US7915708 Semiconductor device |
| 03/29/2011 | US7915700 Monolithic integrated composite device having silicon integrated circuit and silicon optical device integrated thereon, and fabrication method thereof |
| 03/29/2011 | US7915699 Integrated circuit chip that supports through-chip electromagnetic communication |
| 03/29/2011 | US7915690 Die rearrangement package structure using layout process to form a compliant configuration |
| 03/29/2011 | US7915544 Cable seal apparatus and techniques for outside plant telecommunications housings |
| 03/29/2011 | US7915527 Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings |
| 03/29/2011 | US7915161 Post passivation interconnection schemes on top of IC chip |
| 03/29/2011 | US7915157 Chip structure and process for forming the same |
| 03/29/2011 | US7915151 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices |
| 03/29/2011 | US7915095 Silicide-silicon oxide-semiconductor antifuse device and method of making |
| 03/29/2011 | US7915084 Method for making a stacked package semiconductor module having packages stacked in a cavity in the module substrate |
| 03/29/2011 | US7915083 Method of manufacturing layered chip package |
| 03/29/2011 | US7915060 Grid array connection device and method |
| 03/29/2011 | US7914886 Structural component comprising boron nitride agglomerated powder |
| 03/29/2011 | US7913387 Method of fabricating a thermal spreader having thermal conduits |
| 03/29/2011 | CA2602529C Cu-ni-si-co-cr based copper alloy for electronic material and method for production thereof |
| 03/24/2011 | WO2011034758A1 Semiconductor chip with crack deflection structure |
| 03/24/2011 | WO2011034749A1 Non-volatile memory with reduced mobile ion diffusion |
| 03/24/2011 | WO2011034555A1 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration |
| 03/24/2011 | WO2011034137A1 Module with built-in electronic component |
| 03/24/2011 | WO2011034092A1 Method for forming barrier metal film |
| 03/24/2011 | WO2011034089A1 Film formation method |
| 03/24/2011 | WO2011034075A1 Ceramic circuit board and process for producing same |
| 03/24/2011 | WO2011034066A1 General-purpose carbon material and method for producing same |
| 03/24/2011 | WO2011034025A1 Film for forming spacer, method for manufacturing semiconductor wafer bonded body, semiconductor wafer bonded body, and semiconductor device |
| 03/24/2011 | WO2011033920A1 METHOD FOR FORMING Cu WIRING |
| 03/24/2011 | WO2011033915A1 Semiconductor device and manufacturing method thereof |
| 03/24/2011 | WO2011033817A1 Method for manufacturing wiring board |
| 03/24/2011 | WO2011033676A1 Method for manufacturing semiconductor device |