| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/30/2011 | EP2302327A1 Sensor |
| 03/30/2011 | EP2301906A1 Silicon nitride board, method for manufacturing the silicon nitride board, and silicon nitride circuit board and semiconductor module using the silicon nitride board |
| 03/30/2011 | EP2301314A1 Enclosure with integrated heat wick |
| 03/30/2011 | EP2300953A1 Intrusion protection using stress changes |
| 03/30/2011 | EP2300195A2 Gold-tin-indium solder for processing compatibility with lead-free tin-based solder |
| 03/30/2011 | EP1922753B1 Dry etchback of interconnect contacts |
| 03/30/2011 | EP1849220B1 Foil slot impingement cooler with effective light-trap cavities |
| 03/30/2011 | EP1779202B1 Apparatus for suspending a chip-scale device and atomic clock system |
| 03/30/2011 | EP1743366B1 Wiring structure for integrated circuit with reduced intralevel capacitance |
| 03/30/2011 | EP1632999B1 Battery mounted integrated circuit device |
| 03/30/2011 | EP1055193B1 Data carrier with chip and fully enclosed connection means |
| 03/30/2011 | CN201781729U Aluminum profile for radiator |
| 03/30/2011 | CN201781721U Combined radiator |
| 03/30/2011 | CN201780975U Bonding pad and package chip with same |
| 03/30/2011 | CN201780974U Heat sink of heating electronic component |
| 03/30/2011 | CN201780973U Composite inner passivated layer structure of silicon rectifier |
| 03/30/2011 | CN1989604B Function element and manufacturing method thereof, and function element mounting structure |
| 03/30/2011 | CN1825588B Electrostatic discharge circuit |
| 03/30/2011 | CN1802740B Semiconductor package having filler metal of gold/silver/copper alloy |
| 03/30/2011 | CN1800972B Phase-shift mask for manufacturing semiconductor device |
| 03/30/2011 | CN1702786B Chip-type electronic component |
| 03/30/2011 | CN101999168A Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking |
| 03/30/2011 | CN101999167A Support mounted electrically interconnected die assembly |
| 03/30/2011 | CN101998812A Heat-dissipating module |
| 03/30/2011 | CN101998808A Heat dissipating device |
| 03/30/2011 | CN101998806A Heat dissipating device |
| 03/30/2011 | CN101998801A Radiating device |
| 03/30/2011 | CN101998779A Laminated ceramic electronic component and method for manufacturing same |
| 03/30/2011 | CN101998763A Connection structure of bare chip and printed circuit board, printed circuit board and communication equipment |
| 03/30/2011 | CN101997455A Semiconductor temperature difference power generation device for cold energy recovery power generation |
| 03/30/2011 | CN101997187A Micro electro mechanical system plug and socket connectors, manufacturing method thereof and connector assembly |
| 03/30/2011 | CN101997067A Light emitting diode bracket structure |
| 03/30/2011 | CN101997063A Surface-mount light-emitting diode (LED) component, LED module and manufacturing methods thereof |
| 03/30/2011 | CN101997031A Input/output electrostatic discharge devic and cascade input/output electrostatic discharge device |
| 03/30/2011 | CN101997013A Image sensor module and mehtod of manufacturing the same |
| 03/30/2011 | CN101997010A Digital X-ray detection panel and manufacturing method thereof |
| 03/30/2011 | CN101997008A 像素结构 Pixel structure |
| 03/30/2011 | CN101997007A Semiconductor device and method for manufacturing semiconductor device |
| 03/30/2011 | CN101997006A Semiconductor device and method for manufacturing the same |
| 03/30/2011 | CN101997005A Semiconductor device and method for manufacturing the same |
| 03/30/2011 | CN101997004A Semiconductor device and method for manufacturing the same |
| 03/30/2011 | CN101996998A Integrated circuit structure and memory array |
| 03/30/2011 | CN101996993A Device using single metalized pad |
| 03/30/2011 | CN101996982A Electronic device and method of manufacturing the same |
| 03/30/2011 | CN101996981A Module comprising semiconductor devices and module manufacturing method |
| 03/30/2011 | CN101996980A Power semiconductor module and method for assembling the same |
| 03/30/2011 | CN101996979A Interposer, module and electronic device including the same |
| 03/30/2011 | CN101996978A Chip package body and forming method thereof |
| 03/30/2011 | CN101996977A Contact type test device of integrated circuit and method of manufacturing the same |
| 03/30/2011 | CN101996976A Semiconductor device and method of manufacturing the same |
| 03/30/2011 | CN101996975A Interposer chip and manufacturing method thereof |
| 03/30/2011 | CN101996974A Ball grid array printed circuit board and packaging structure and process thereof |
| 03/30/2011 | CN101996973A Lead frame for carrying out ceramic double in-line package (CDIP) on chips |
| 03/30/2011 | CN101996972A Integrated circuit and conductive tape |
| 03/30/2011 | CN101996971A Semiconductor device and manufacture method thereof |
| 03/30/2011 | CN101996970A Integrated circuit device and electronic equipment |
| 03/30/2011 | CN101996969A Semiconductor device and on-vehicle AC generator |
| 03/30/2011 | CN101996968A Power semiconductor module with circuit holder and load connection element and method for manufacturing same |
| 03/30/2011 | CN101996967A Power bus structure used for multi-power supply chip |
| 03/30/2011 | CN101996966A Nonpolar communication chip design scheme |
| 03/30/2011 | CN101996965A Cooling device and method |
| 03/30/2011 | CN101996964A Evaporator and cooling circuit |
| 03/30/2011 | CN101996963A Heatsink with periodically patterned baseplate structure |
| 03/30/2011 | CN101996962A Electronic component module and radio communications equipment |
| 03/30/2011 | CN101996961A Tourmaline chip |
| 03/30/2011 | CN101996960A Chip encapsulating structure realizing electrical connection without routing and manufacturing method thereof |
| 03/30/2011 | CN101996959A Chip encapsulation structure capable of realizing electrical connection without routing and manufacture method thereof |
| 03/30/2011 | CN101996958A Chip package and fabrication method thereof |
| 03/30/2011 | CN101996957A Semiconductor device having semiconductor chip and metal plate and method for manufacturing the same |
| 03/30/2011 | CN101996956A Semiconductor device and method for production of semiconductor device |
| 03/30/2011 | CN101996955A Chip package and fabrication method thereof |
| 03/30/2011 | CN101996954A 芯片 Chip |
| 03/30/2011 | CN101996953A Chip package and fabrication method thereof |
| 03/30/2011 | CN101996952A Integrated circuit chip |
| 03/30/2011 | CN101996950A Semiconductor device and method of fabricating the same |
| 03/30/2011 | CN101996942A Semiconductor device and production method thereof |
| 03/30/2011 | CN101996940A Semiconductor device and method of manufacturing the same |
| 03/30/2011 | CN101996931A Method for forming semiconductor device |
| 03/30/2011 | CN101996930A Method for making contact joint gasket and semiconductor device |
| 03/30/2011 | CN101996929A Forming method of dual-damascene structure and semiconductor structure |
| 03/30/2011 | CN101996927A Multilayer interconnection structure and forming method thereof |
| 03/30/2011 | CN101996926A Method and structure for self aligned contact of integrated circuit |
| 03/30/2011 | CN101996922A Silicon on insulator (SOI) wafer and formation method thereof |
| 03/30/2011 | CN101996899A Cmos image sensor and manufacturing method thereof |
| 03/30/2011 | CN101996898A Cmos image sensor and manufacturing method thereof |
| 03/30/2011 | CN101996897A Method for fabricating circuit substrate assembly and power electronics module |
| 03/30/2011 | CN101996896A Semiconductor device and method for manufacturing the same |
| 03/30/2011 | CN101996895A Semiconductor device and method for manufacturing the same |
| 03/30/2011 | CN101996894A Semiconductor device and method of forming dam material around periphery of die to reduce warpage |
| 03/30/2011 | CN101996893A Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die |
| 03/30/2011 | CN101996892A System level photoelectric structure and manufacturing method thereof |
| 03/30/2011 | CN101996891A Metal-coated polyimide film and process for producing the same |
| 03/30/2011 | CN101996890A Preparation device and method of carbon nanotube radiators |
| 03/30/2011 | CN101996861A Inductor and forming method thereof |
| 03/30/2011 | CN101996766A 电子部件及其制造方法 An electronic component and its manufacturing method |
| 03/30/2011 | CN101996531A 等离子体显示装置 The plasma display apparatus |
| 03/30/2011 | CN101995182A Uniform temperature plate and manufacturing method thereof |
| 03/30/2011 | CN101995008A Ceramic radiator with conductive circuit |
| 03/30/2011 | CN101995006A Heat dissipation method of light-emitting diode (LED) illuminating device |
| 03/30/2011 | CN101994919A Light emitting diode (LED) lamp with heat dissipation circuit board |