| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/31/2011 | US20110077489 Analyte Monitoring Device and Methods of Use |
| 03/31/2011 | US20110077481 Analyte Monitoring Device and Methods of Use |
| 03/31/2011 | US20110076809 Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings |
| 03/31/2011 | US20110075451 Power Semiconductor Module and Method for Operating a Power Semiconductor Module |
| 03/31/2011 | US20110075393 Semiconductor Die-Based Packaging Interconnect |
| 03/31/2011 | US20110075088 Wiring board and liquid crystal display device |
| 03/31/2011 | US20110074459 Structure and method for semiconductor testing |
| 03/31/2011 | US20110074438 Stacked semiconductor device and method of connection test in the same |
| 03/31/2011 | US20110074369 Semiconductor apparatus and calibration method thereof |
| 03/31/2011 | US20110074049 Method of manufacturing semiconductor device, mask and semiconductor device |
| 03/31/2011 | US20110074048 Semiconductor device and method of manufacturing the same |
| 03/31/2011 | US20110074047 Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die |
| 03/31/2011 | US20110074045 Interposer, semiconductor chip mounted sub-board, and semiconductor package |
| 03/31/2011 | US20110074044 Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication |
| 03/31/2011 | US20110074043 Method of forming vias in semiconductor substrates and resulting structures |
| 03/31/2011 | US20110074042 Electronic device |
| 03/31/2011 | US20110074041 Circuit Board with Oval Micro Via |
| 03/31/2011 | US20110074040 Semiconductor Device And Method For Making Same |
| 03/31/2011 | US20110074039 Reliable interconnect for semiconductor device |
| 03/31/2011 | US20110074038 Methods for forming interconnect structures that include forming air gaps between conductive structures |
| 03/31/2011 | US20110074037 Semiconductor device |
| 03/31/2011 | US20110074035 Semiconductor memory apparatus and method for fabricating the same |
| 03/31/2011 | US20110074034 Method of manufacturing a semiconductor component and structure |
| 03/31/2011 | US20110074033 Crack Stop Trenches |
| 03/31/2011 | US20110074032 Semiconductor device |
| 03/31/2011 | US20110074031 Back side metallization with superior adhesion in high-performance semiconductor devices |
| 03/31/2011 | US20110074030 METHOD FOR PREVENTING Al-Cu BOTTOM DAMAGE USING TiN LINER |
| 03/31/2011 | US20110074029 Flip-chip package covered with tape |
| 03/31/2011 | US20110074028 Semiconductor Device and Method of Dissipating Heat From Thin Package-on-Package Mounted to Substrate |
| 03/31/2011 | US20110074027 Flip chip interconnection with double post |
| 03/31/2011 | US20110074026 Semiconductor Device and Method of Forming Insulating Layer on Conductive Traces for Electrical Isolation in Fine Pitch Bonding |
| 03/31/2011 | US20110074025 Semiconductor module, method of manufacturing semiconductor module, and mobile device |
| 03/31/2011 | US20110074024 Semiconductor Device and Method of Forming Bump-on-Lead Interconnection |
| 03/31/2011 | US20110074023 Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate |
| 03/31/2011 | US20110074022 Semiconductor Device and Method of Forming Flipchip Interconnect Structure |
| 03/31/2011 | US20110074021 Device mounting board, and semiconductor module |
| 03/31/2011 | US20110074020 Semiconductor device and method for mounting semiconductor device |
| 03/31/2011 | US20110074019 Semiconductor device |
| 03/31/2011 | US20110074017 Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure |
| 03/31/2011 | US20110074016 Semiconductor device and manufacturing method therefor |
| 03/31/2011 | US20110074015 Stacked semiconductor device and a method for manufacturing the same |
| 03/31/2011 | US20110074014 Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP |
| 03/31/2011 | US20110074013 Film forming method of silicon oxide film, silicon oxide film, semiconductor device, and manufacturing method of semiconductor device |
| 03/31/2011 | US20110074012 Substrate with built-in semiconductor element, and method of fabricating substrate with built-in semiconductor element |
| 03/31/2011 | US20110074011 Mechanical coupling in a multi-chip module using magnetic components |
| 03/31/2011 | US20110074010 Power module substrate, power module, and method for manufacturing power module substrate |
| 03/31/2011 | US20110074009 Isostress grid array and method of fabrication thereof |
| 03/31/2011 | US20110074008 Semiconductor flip chip package |
| 03/31/2011 | US20110074007 Thermally enhanced low parasitic power semiconductor package |
| 03/31/2011 | US20110074006 Rf transistor packages with internal stability network including intra-capacitor resistors and methods of forming rf transistor packages with internal stability networks including intra-capacitor resistors |
| 03/31/2011 | US20110074005 Semiconductor device, method for fabricating a semiconductor device and lead frame, comprising a bent contact section |
| 03/31/2011 | US20110074004 Package process and package structure |
| 03/31/2011 | US20110074003 Foil based semiconductor package |
| 03/31/2011 | US20110074001 Chip card having a plurality of components |
| 03/31/2011 | US20110074000 Optoelectronic component and method for producing an optoelectronic component |
| 03/31/2011 | US20110073999 Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method |
| 03/31/2011 | US20110073998 Adhesion Promotion Layer For A Semiconductor Device |
| 03/31/2011 | US20110073997 Semiconductor Structure and Method for Making Same |
| 03/31/2011 | US20110073996 Multiple die layout for facilitating the combining of an individual die into a single die |
| 03/31/2011 | US20110073986 Semiconductor integrated circuit device and manufacturing method thereof |
| 03/31/2011 | US20110073985 Method of Generating Uniformly Aligned Well and Isolation Regions in a Substrate and Resulting Structure |
| 03/31/2011 | US20110073981 Semiconductor device and method for manufacturing the same |
| 03/31/2011 | US20110073968 Element array, electromechanical conversion device, and process for producing the same |
| 03/31/2011 | US20110073949 Semiconductor apparatus |
| 03/31/2011 | US20110073948 Semiconductor device |
| 03/31/2011 | US20110073921 Semiconductor device and manufacturing method of the same |
| 03/31/2011 | US20110073914 Semiconductor integrated circuit device |
| 03/31/2011 | US20110073901 Adhesive encapsulating composition and electronic devices made therewith |
| 03/31/2011 | US20110073858 Test Structure for Determination of TSV Depth |
| 03/31/2011 | US20110073289 Low profile blower radial heatsink |
| 03/31/2011 | DE102010030886A1 Organische lichtemmitierende Vorrichtung und Füllmittel zum Abdichten derselben Organic light-emmi animal end device and filler to seal the same |
| 03/31/2011 | DE102010004690A1 Halbleiterbauelement mit Fensteröffnung als Schnittstelle zur Umgebung-Ankopplung A semiconductor device with a window opening as an interface to the surrounding coupling- |
| 03/31/2011 | DE102009050426B3 Method for aligned application of silicon chips with switching structures on e.g. wafer substrate, involves fixing aligned components on substrate by electrostatic force by applying electrical holding voltage above metallization surfaces |
| 03/31/2011 | DE102009047889A1 Optoelektronischer Halbleiterchip und Verfahren zum Anpassen einer Kontaktstruktur zur elektrischen Kontaktierung eines optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method for adjusting a contact structure for the electrical contacting of an optoelectronic semiconductor chip |
| 03/31/2011 | DE102009045214A1 Elektrische Vorrichtung An electrical device |
| 03/31/2011 | DE102009045063A1 Power semiconductor module, has power semiconductor chip arranged on substrate, and heat sink contacting substrate directly and made of plastic-based injection molding compound that exhibits specific heat conductivity |
| 03/31/2011 | DE102009044142A1 Dünnschicht-Bauelement auf Glas, ein Verfahren zu dessen Herstellung und dessen Verwendung Thin-film component on glass, a process for its preparation and its use |
| 03/31/2011 | DE102009043760A1 Befestigungselement für plattenförmige Bauteile aneinander, insbesondere für eine LED-Platine an einem Kühlkörper Fastening element for plate-shaped members to each other, in particular for an LED printed circuit board to a heat sink |
| 03/31/2011 | DE102009042479A1 Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug Method for producing an arrangement with a component on a supporting substrate and assembly and methods of making a semi-finished and semi-finished |
| 03/31/2011 | DE102009042400A1 Arrangement for size-optimized housing shape, has base chip and another chip arranged on main side of base chip and is electrically conducting by contact element |
| 03/31/2011 | DE102009029476A1 Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe An electronic device for switching currents and manufacturing method for the same |
| 03/31/2011 | DE102008047649B4 Platte zum Ausgleichen von Wärme in einer Leiterplatte und zum Abführen von Wärme von einer Leiterplatte und Anordnung einer solchen Platte mit einer Leiterplatte Plate to compensate for heat in a circuit board and for removing heat from a circuit board and arrangement of such a plate with a printed circuit board |
| 03/31/2011 | DE102006039877B4 Chip mit einer vertikalen Dummy-Kontakt-Struktur Chip with a vertical dummy contact structure |
| 03/31/2011 | CA2775716A1 Apparatus for using heat pipes in controlling temperature of an led light unit |
| 03/31/2011 | CA2775032A1 Method for the production of an electronic component and electronic component produced according to this method |
| 03/30/2011 | EP2302987A1 Integration of SMD components in an IC housing |
| 03/30/2011 | EP2302850A1 Signal isolators using micro-transformers |
| 03/30/2011 | EP2302707A1 Led light assembly with active cooling |
| 03/30/2011 | EP2302680A2 Rear illuminated image sensor and manufacturing method for same |
| 03/30/2011 | EP2302676A1 High power semiconductor device |
| 03/30/2011 | EP2302675A1 Electronic circuit with an inductor |
| 03/30/2011 | EP2302674A1 Electrical terminal, electronic circuit module with an electrical terminal and corresponding method of manufacturing thereof |
| 03/30/2011 | EP2302673A2 Semiconductor assembly and method for determining the barrier layer temperature of a semiconductor component |
| 03/30/2011 | EP2302672A2 Semiconductor device with electrode pad and method for manufacturing same |
| 03/30/2011 | EP2302669A1 Encapsulation material for integrated circuits containing carbon nanotubes |
| 03/30/2011 | EP2302667A1 Insulating film for semiconductor device, process and apparatus for producing insulating film for semiconductor device, semiconductor device, and process for producing the semiconductor device |
| 03/30/2011 | EP2302663A2 Method of forming MIM capacitor |
| 03/30/2011 | EP2302555A2 Error correction |
| 03/30/2011 | EP2302539A1 Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, charge pump circuit, layout designing apparatus, and layout designing program |
| 03/30/2011 | EP2302446A2 Pad layout structure of a driver ic chip |