| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/06/2011 | CN101339928B Inter-connecting structure for semiconductor device package and method of the same |
| 04/06/2011 | CN101335249B Semiconductor device |
| 04/06/2011 | CN101335195B Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device form them |
| 04/06/2011 | CN101299421B Semiconductor device including ruthenium electrode and manufacture method thereof |
| 04/06/2011 | CN101295710B 半导体器件 Semiconductor devices |
| 04/06/2011 | CN101295703B Electromigration programmed mode electrical fuse structure |
| 04/06/2011 | CN101286498B Semiconductor structure and semiconductor wafer |
| 04/06/2011 | CN101276840B Semiconductor memory device and method for manufacturing the same |
| 04/06/2011 | CN101233474B IC with on-die power-gating circuit |
| 04/06/2011 | CN101226907B Heat sinking gain type chip sizing level encapsulation body and method for forming the same |
| 04/06/2011 | CN101221941B Substrate and production method for packaging structure |
| 04/06/2011 | CN101216642B Flat-panel display lead wire structure |
| 04/06/2011 | CN101154342B 显示装置和电子装置 Display device and electronic apparatus |
| 04/06/2011 | CN101150139B Organic light emitting display device |
| 04/06/2011 | CN101101905B Semiconductor device mounted with fuse memory |
| 04/06/2011 | CN101097905B Semiconductor and manufacturing method thereof |
| 04/06/2011 | CN101093073B Section bar |
| 04/06/2011 | CN101068010B Semiconductor device |
| 04/06/2011 | CN101034700B Electronic component integrated module and method for fabricating the same |
| 04/06/2011 | CN101017835B Thin film transistor panel and manufacturing method thereof |
| 04/05/2011 | US7921401 Stress analysis method, wiring structure design method, program, and semiconductor device production method |
| 04/05/2011 | US7920030 Multi-phase voltage-control oscillator |
| 04/05/2011 | US7920010 Signal isolators using micro-transformers |
| 04/05/2011 | US7919990 Semiconductor device |
| 04/05/2011 | US7919875 Semiconductor device with recess portion over pad electrode |
| 04/05/2011 | US7919874 Chip package without core and stacked chip package structure |
| 04/05/2011 | US7919873 Structure of high performance combo chip and processing method |
| 04/05/2011 | US7919872 Integrated circuit (IC) carrier assembly with first and second suspension means |
| 04/05/2011 | US7919871 Integrated circuit package system for stackable devices |
| 04/05/2011 | US7919870 Coaxial through chip connection |
| 04/05/2011 | US7919869 Semiconductor device and method of visual inspection and apparatus for visual inspection |
| 04/05/2011 | US7919868 Carrier substrate and integrated circuit |
| 04/05/2011 | US7919867 Chip structure and process for forming the same |
| 04/05/2011 | US7919865 Post passivation interconnection schemes on top of IC chip |
| 04/05/2011 | US7919864 Forming of the last metallization level of an integrated circuit |
| 04/05/2011 | US7919862 Reducing resistivity in interconnect structures of integrated circuits |
| 04/05/2011 | US7919860 Semiconductor device having wafer level chip scale packaging substrate decoupling |
| 04/05/2011 | US7919859 Copper die bumps with electromigration cap and plated solder |
| 04/05/2011 | US7919858 Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposed |
| 04/05/2011 | US7919857 Plastic housing and semiconductor component with said plastic housing |
| 04/05/2011 | US7919856 Package mounted module and package board module |
| 04/05/2011 | US7919855 Topside thermal management of semiconductor devices using boron phosphide contacting a gate terminal |
| 04/05/2011 | US7919854 Semiconductor module with two cooling surfaces and method |
| 04/05/2011 | US7919853 Semiconductor package and fabrication method thereof |
| 04/05/2011 | US7919852 Semiconductor device and insulating substrate utilizing a second conductor with a non-joint area |
| 04/05/2011 | US7919851 Laminate substrate and semiconductor package utilizing the substrate |
| 04/05/2011 | US7919850 Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof |
| 04/05/2011 | US7919849 Package substrate and device for optical communication |
| 04/05/2011 | US7919848 Integrated circuit package system with multiple devices |
| 04/05/2011 | US7919847 Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method |
| 04/05/2011 | US7919845 Formation of a hybrid integrated circuit device |
| 04/05/2011 | US7919844 Tier structure with tier frame having a feedthrough structure |
| 04/05/2011 | US7919843 Semiconductor device and its manufacturing method |
| 04/05/2011 | US7919842 Structure and method for sealing cavity of micro-electro-mechanical device |
| 04/05/2011 | US7919841 Mounting structures for integrated circuit modules |
| 04/05/2011 | US7919840 Integrated non-isolated VRM and microprocessor assembly |
| 04/05/2011 | US7919839 Support structures for on-wafer testing of wafer-level packages and multiple wafer stacked structures |
| 04/05/2011 | US7919838 Integrated circuit package system with encapsulation lock and method of manufacture thereof |
| 04/05/2011 | US7919837 Semiconductor device with sealed semiconductor chip |
| 04/05/2011 | US7919836 Semiconductor device |
| 04/05/2011 | US7919834 Edge seal for thru-silicon-via technology |
| 04/05/2011 | US7919833 Semiconductor package having a crack-propagation preventing unit |
| 04/05/2011 | US7919817 Electrostatic discharge (ESD) protection applying high voltage lightly doped drain (LDD) CMOS technologies |
| 04/05/2011 | US7919816 Electrostatic discharge protection element |
| 04/05/2011 | US7919815 Spinel wafers and methods of preparation |
| 04/05/2011 | US7919787 Semiconductor device with a light emitting semiconductor die |
| 04/05/2011 | US7919775 Semiconductor device and method comprising a high voltage reset driver and an isolated memory array |
| 04/05/2011 | US7919550 Encapsulated semiconductor; diodes; crosslinked polymer; photostability; radiation and heat resistance |
| 04/05/2011 | US7919363 Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof |
| 04/05/2011 | US7919360 Integrated circuit packaging system with circuitry stacking and method of manufacture thereof |
| 04/05/2011 | US7919359 Semiconductor mounting substrate and method for manufacturing the same |
| 04/05/2011 | US7919355 Multi-surface IC packaging structures and methods for their manufacture |
| 04/05/2011 | US7918953 Alignment method and mounting method using the alignment method |
| 04/05/2011 | US7918102 Method and arrangement for cooling a substrate, particularly a semiconductor |
| 04/05/2011 | US7918025 Method of fabricating a thermal spreader having thermal conduits |
| 03/31/2011 | WO2011038336A1 Semiconductor die-based packaging interconnect |
| 03/31/2011 | WO2011038289A1 Forming radio frequency integrated circuits |
| 03/31/2011 | WO2011037534A1 A wafer level package and a method of forming a wafer level package |
| 03/31/2011 | WO2011037373A2 Solar cell module and method of manufacturing the same |
| 03/31/2011 | WO2011037185A1 Mounting substrate, light emitting body, and method for manufacturing mounting substrate |
| 03/31/2011 | WO2011037102A1 Active matrix substrate, method for manufacturing same, and image display device |
| 03/31/2011 | WO2011037101A1 Electronic circuit device |
| 03/31/2011 | WO2011037090A1 Method for forming metal oxide film, method for forming manganese oxide film, and computer-readable storage medium |
| 03/31/2011 | WO2011036840A1 Semiconductor device, semiconductor package, and method for manufacturing semiconductor device |
| 03/31/2011 | WO2011036836A1 Solvent-free and one-pack type cyanic ester/epoxy composite resin composition |
| 03/31/2011 | WO2011036828A1 Method for manufacturing semiconductor device, and semiconductor device manufactured using same |
| 03/31/2011 | WO2011036819A1 Method for manufacturing semiconductor device |
| 03/31/2011 | WO2011036751A1 Electronic device and damage detecting method |
| 03/31/2011 | WO2011036307A1 Circuit arrangement and manufacturing method thereof |
| 03/31/2011 | WO2011036112A2 Method for producing an electronic component and component produced according to said method |
| 03/31/2011 | WO2011036102A1 Lighting apparatus, lamp having the lighting apparatus and method for production of a lighting apparatus |
| 03/31/2011 | WO2011035645A1 Led light bulb with multiple layers of radiating structures |
| 03/31/2011 | WO2011035526A1 High power led lamp |
| 03/31/2011 | WO2011009680A3 Optoelectronic unit, and method for the production of such a unit |
| 03/31/2011 | WO2011008459A3 Structured material substrates for flexible, stretchable electronics |
| 03/31/2011 | WO2011002794A3 Systems and methods of improved heat dissipation with variable pitch grid array packaging |
| 03/31/2011 | WO2011002778A3 Methods and structures for a vertical pillar interconnect |
| 03/31/2011 | WO2010151578A3 Electrical interconnect for die stacked in zig-zag configuration |
| 03/31/2011 | WO2010129172A3 Dual interconnection in stacked memory and controller module |
| 03/31/2011 | US20110077491 Analyte Monitoring Device and Methods of Use |