| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/06/2011 | EP2306513A2 IC chip package with directly connected leads |
| 04/06/2011 | EP2306512A2 Heat radiator and power module |
| 04/06/2011 | EP2306511A1 Packaging device and base member for package |
| 04/06/2011 | EP2306506A1 Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect |
| 04/06/2011 | EP2306503A2 Semiconductor electronic device and method of manufacturing thereof |
| 04/06/2011 | EP2306501A2 Ceramic wiring board and method of manufacturing thereof |
| 04/06/2011 | EP2306438A1 Electronic apparatus, image display, and method of cooling electronic apparatus |
| 04/06/2011 | EP2305755A1 Resin composition |
| 04/06/2011 | EP2305400A1 Aluminum-diamond composite and method for producing the same |
| 04/06/2011 | EP2305108A1 Analyte monitoring device and methods of use |
| 04/06/2011 | EP2305107A1 Analyte monitoring device and methods of use |
| 04/06/2011 | EP2305013A1 Electronic assembly and method for the production thereof |
| 04/06/2011 | EP2304792A1 Active thermal control for stacked ic devices |
| 04/06/2011 | EP2304791A1 A cooling device for cooling a semiconductor die |
| 04/06/2011 | EP2304790A2 Vapor chamber-thermoelectric module assemblies |
| 04/06/2011 | EP2304789A2 Semiconductor device and manufacturing method |
| 04/06/2011 | EP2304782A1 An integrated circuit comprising light absorbing adhesive |
| 04/06/2011 | EP2304339A2 Device for varying the pressure of a pneumatic fluid by displacing drops of liquid and heat pump using such a device |
| 04/06/2011 | EP2303965A1 Curable organopolysiloxane composition and semiconductor device |
| 04/06/2011 | EP2018666B1 Method for fixing an electronic component on a printed circuit board, manufacturing method of a support layer and an interposer layer, and system comprising a printed circuit board and at least one electronic component |
| 04/06/2011 | EP2013907B1 Package-on-package secure module having bga mesh cap |
| 04/06/2011 | EP1726040B1 Integrated circuit chips utilizing carbon nanotube composite interconnection vias |
| 04/06/2011 | EP1656719B1 Pressure contact spring for a contact arrangement in a power semiconductor module |
| 04/06/2011 | EP1534513B1 Laminated glazing panel |
| 04/06/2011 | EP1450401B1 Module comprising a ceramic circuit board |
| 04/06/2011 | EP1211011B1 Method of manufacturing a solder coated material ; corresponding solder coated material |
| 04/06/2011 | CN201789709U Heat radiation module and spring plate bracket thereof |
| 04/06/2011 | CN201788975U Crystal grain and power conversion integrated circuit employing same |
| 04/06/2011 | CN201788968U Rectifier with single-layer lead frame |
| 04/06/2011 | CN201788967U Electronic element packaging structure |
| 04/06/2011 | CN201788966U Non-thermoelectric separated metal substrate and light emitting component with same |
| 04/06/2011 | CN201788965U Stacking structure for material strip of lead frame |
| 04/06/2011 | CN201788964U Electric-power electronic power device gate pole apparatus |
| 04/06/2011 | CN201788963U Copper water cooled radiator |
| 04/06/2011 | CN201788962U Radiating structure of radiator and device adopting radiating structure |
| 04/06/2011 | CN201788961U Combined type heat radiation module |
| 04/06/2011 | CN201788960U Heat radiation structure of semiconductor electronic component |
| 04/06/2011 | CN201788456U Electronic element heat dissipation sheet |
| 04/06/2011 | CN201788341U Array substrate, liquid crystal panel and liquid crystal display |
| 04/06/2011 | CN201787842U Soaking plate |
| 04/06/2011 | CN1996588B A copper-gas media Damascus structure and its making method |
| 04/06/2011 | CN1957465B Semiconductor device and wiring board |
| 04/06/2011 | CN1787223B Local interconnect structure and method for a cmos image sensor |
| 04/06/2011 | CN1750207B Semiconductor device |
| 04/06/2011 | CN102007825A Wiring board and method for manufacturing the same |
| 04/06/2011 | CN102007609A Light-emitting diode package |
| 04/06/2011 | CN102007165A Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device |
| 04/06/2011 | CN102007090A Carbon fiber carbon composite molded body, carbon fiber-reinforced carbon composite material and manufacturing method thereof |
| 04/06/2011 | CN102006761A Heat radiator |
| 04/06/2011 | CN102005956A Power converter |
| 04/06/2011 | CN102005474A Semiconductor device and method for manufacturing the same |
| 04/06/2011 | CN102005456A Semiconductor memory device comprising three-dimensional memory cell array |
| 04/06/2011 | CN102005453A Three dimensional structure memory |
| 04/06/2011 | CN102005442A Power conversion device |
| 04/06/2011 | CN102005440A 集成电路结构及其形成方法 Integrated circuit structure and method of forming |
| 04/06/2011 | CN102005437A Electronic assembly for an image sensing device and wafer-level lens set |
| 04/06/2011 | CN102005436A Measurement calibrating wafer |
| 04/06/2011 | CN102005435A Interconnect layouts for electronic assemblies |
| 04/06/2011 | CN102005434A Printed wiring board and method for manufacturing the same |
| 04/06/2011 | CN102005433A Board with connection terminals |
| 04/06/2011 | CN102005432A Packaging structure with four pin-less sides and packaging method thereof |
| 04/06/2011 | CN102005431A Flip-dual face graphic-chip plating-first and etching-second single encapsulation method |
| 04/06/2011 | CN102005430A Double-sided graphics chip flip-chip module packaging method adopting plating firstly and etching secondly |
| 04/06/2011 | CN102005429A TCP type semiconductor device |
| 04/06/2011 | CN102005428A TCP-type semiconductor device |
| 04/06/2011 | CN102005427A Printed circuit board strip and panel |
| 04/06/2011 | CN102005426A Up-mounted rectangular locking hole and radiating block packaging structure exposing chip on base island |
| 04/06/2011 | CN102005425A Island embedded packaging structure with surface of radiating block normally assembled on chip protruding |
| 04/06/2011 | CN102005424A Packaging structure of resin circuit board and chip for squarely installing heat radiating block with locking hole |
| 04/06/2011 | CN102005423A Resin circuit board chip radiation block encapsulation structure with rectangular locking hole |
| 04/06/2011 | CN102005422A Packaging structure with resin circuit boards and with surface of radiating block normally assembled on chip and provided with locking hole protruding |
| 04/06/2011 | CN102005421A Upright resin circuit board chip package structure with inverted T-shaped locking hole heat dissipation block |
| 04/06/2011 | CN102005420A Full-cladding packaging structure with island exposing chip for inverted T-shape heat dissipation block |
| 04/06/2011 | CN102005419A Power semiconductor device and manufacturing method for the same |
| 04/06/2011 | CN102005418A Semiconductor device and method for manufacturing same |
| 04/06/2011 | CN102005417A Self-aligned protection layer for copper post structure |
| 04/06/2011 | CN102005407A Contact plug and forming method thereof |
| 04/06/2011 | CN102005398A Method for forming a via in a substrate and substrate with a via |
| 04/06/2011 | CN102005396A Bump making method and bump structure |
| 04/06/2011 | CN102005391A Heat-radiating module and assembling method thereof |
| 04/06/2011 | CN102004341A Liquid crystal display device and manufacturing method thereof |
| 04/06/2011 | CN102003690A High-power light-emitting diode (LED) lamp cap with epoxy resin heat conduction pipe added with carbon nano tube material |
| 04/06/2011 | CN102002346A Organic silicon heat conduction composition and organic silicon heat conduction patch |
| 04/06/2011 | CN102002209A Bottom filling glue for packaging inverted chip type semiconductor |
| 04/06/2011 | CN101728350B Efficient energy-saving Schottky diode |
| 04/06/2011 | CN101650001B Spherically encapsulated LED |
| 04/06/2011 | CN101604686B Integrated circuit stacking construction with shimming assembly |
| 04/06/2011 | CN101604683B Air gap structure for interconnection and manufacture method thereof |
| 04/06/2011 | CN101593733B Encapsulation structure |
| 04/06/2011 | CN101581406B Thermotube type high-power LED lamp |
| 04/06/2011 | CN101540330B Active element array mother board |
| 04/06/2011 | CN101517832B Electric connector |
| 04/06/2011 | CN101488538B Light emitting diode apparatus having heat conductive substrate |
| 04/06/2011 | CN101483171B Airgap-containing interconnect structure with patternable low-K material and method of fabricating |
| 04/06/2011 | CN101452926B Hybrid integrated circuit device |
| 04/06/2011 | CN101447480B Integrated circuit wafer structure simplifying test program and testing method thereof |
| 04/06/2011 | CN101436596B Semiconductor device, display device and mobile device |
| 04/06/2011 | CN101436584B Stacked semiconductor package |
| 04/06/2011 | CN101373750B Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers |
| 04/06/2011 | CN101355858B Electronic component-embedded board and method of manufacturing the same |