| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/12/2011 | US7923307 Semiconductor device with fuse and method for fabricating the same |
| 04/12/2011 | US7923306 Semiconductor structure processing using multiple laser beam spots |
| 04/12/2011 | US7923292 Semiconductor device |
| 04/12/2011 | US7923283 Integrated circuit device and method of producing the same |
| 04/12/2011 | US7923273 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing |
| 04/12/2011 | US7923125 Apparatus for solder crack deflection |
| 04/12/2011 | US7923103 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods |
| 04/12/2011 | US7922919 Crossbar-array designs and wire addressing methods that tolerate misalignment of electrical components at wire overlap points |
| 04/12/2011 | US7921903 Heat exchange system |
| 04/07/2011 | WO2011041072A1 Circuit board with oval micro via |
| 04/07/2011 | WO2011041051A2 Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets |
| 04/07/2011 | WO2011040965A2 Coal fine drying method and system |
| 04/07/2011 | WO2011040329A1 Package for containing element and mounted structure |
| 04/07/2011 | WO2011040313A1 Semiconductor module, process for production thereof |
| 04/07/2011 | WO2011040253A1 Structure for cooling electronic component, and electronic apparatus |
| 04/07/2011 | WO2011040129A1 Heat conveying structure for electronic device |
| 04/07/2011 | WO2011040054A1 Insulation circuit board, and power semiconductor device or inverter module using the same |
| 04/07/2011 | WO2011040044A1 Heat sink for electronic device, and process for production thereof |
| 04/07/2011 | WO2011040030A1 Module and process for production thereof |
| 04/07/2011 | WO2011039948A1 Adhesive resin composition for silicon wafers |
| 04/07/2011 | WO2011039898A1 Semiconductor device manufacturing method and semiconductor device |
| 04/07/2011 | WO2011039795A1 Semiconductor device and method for manufacturing same |
| 04/07/2011 | WO2011039167A1 Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect |
| 04/07/2011 | WO2011039078A1 Process for producing an optical element, optical element and optoelectronic component comprising the optical element |
| 04/07/2011 | WO2011013923A3 Package aggregate for manufacturing semiconductor packages |
| 04/07/2011 | WO2011011187A3 Optoelectronic device with heat spreader unit |
| 04/07/2011 | WO2011008562A3 Integrated power amplifier with load inductor located under ic die |
| 04/07/2011 | US20110080765 Programmable antifuse transistor and method for programming thereof |
| 04/07/2011 | US20110080678 Esd protection circuit for a switching power converter |
| 04/07/2011 | US20110080550 Liquid crystal display device, method for fabricating the same, and portable telephone using the same |
| 04/07/2011 | US20110080189 Yield enhancement for stacked chips through rotationally-connecting-interposer |
| 04/07/2011 | US20110080185 Method for testing through-silicon-via and the circuit thereof |
| 04/07/2011 | US20110079929 Kit for optical semiconductor encapsulation |
| 04/07/2011 | US20110079928 Semiconductor integrated circuit and multi-chip module |
| 04/07/2011 | US20110079927 Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part |
| 04/07/2011 | US20110079926 Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same |
| 04/07/2011 | US20110079925 Flip Chip Interconnect Method and Design For GaAs MMIC Applications |
| 04/07/2011 | US20110079924 Vertically Stackable Dies Having Chip Identifier Structures |
| 04/07/2011 | US20110079923 Vertically Stackable Dies Having Chip Identifier Structures |
| 04/07/2011 | US20110079922 Integrated circuit with protective structure, and method of fabricating the integrated circuit |
| 04/07/2011 | US20110079921 Generation of metal holes by via mutation |
| 04/07/2011 | US20110079920 Electrical connection via for the substrate of a semiconductor device |
| 04/07/2011 | US20110079919 Electrical connection via for the substrate of a semiconductor device |
| 04/07/2011 | US20110079918 Plasma-based organic mask removal with silicon fluoride |
| 04/07/2011 | US20110079917 Interposer structure with passive component and method for fabricating same |
| 04/07/2011 | US20110079916 Electronic assemblies including mechanically secured protruding bonding conductor joints |
| 04/07/2011 | US20110079915 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
| 04/07/2011 | US20110079914 Standard cell and semiconductor device including the same |
| 04/07/2011 | US20110079913 Semiconductor device and method of manufacturing the same |
| 04/07/2011 | US20110079912 Connection for Off-Chip Electrostatic Discharge Protection |
| 04/07/2011 | US20110079911 Method for the Connection of Two Wafers, and a Wafer Arrangement |
| 04/07/2011 | US20110079910 Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance |
| 04/07/2011 | US20110079909 Semiconductor device and method for manufacturing semiconductor device |
| 04/07/2011 | US20110079908 Stress buffer to protect device features |
| 04/07/2011 | US20110079907 Semiconductor device having a copper plug |
| 04/07/2011 | US20110079906 Pre-packaged structure |
| 04/07/2011 | US20110079905 Die Stacking System and Method |
| 04/07/2011 | US20110079904 Semiconductor device |
| 04/07/2011 | US20110079903 Chip package and fabrication method thereof |
| 04/07/2011 | US20110079902 Semiconductor device |
| 04/07/2011 | US20110079901 Methods of Forming Back Side Layers For Thinned Wafers and Related Structures |
| 04/07/2011 | US20110079900 Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
| 04/07/2011 | US20110079899 Embedded integrated circuit package system and method of manufacture thereof |
| 04/07/2011 | US20110079898 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 04/07/2011 | US20110079897 Integrated circuit chip and flip chip package having the integrated circuit chip |
| 04/07/2011 | US20110079896 Semiconductor device and semiconductor device fabrication method |
| 04/07/2011 | US20110079895 Bump structure, chip package structure including the same and method of manufacturing the same |
| 04/07/2011 | US20110079894 Template Process for Small Pitch Flip-Flop Interconnect Hybridization |
| 04/07/2011 | US20110079893 Device package and methods for the fabrication and testing thereof |
| 04/07/2011 | US20110079892 Chip package and fabrication method thereof |
| 04/07/2011 | US20110079891 Integrated circuit package system for stackable devices and method for manufacturing thereof |
| 04/07/2011 | US20110079889 Cavity structure comprising an adhesion interface composed of getter material |
| 04/07/2011 | US20110079888 Integrated circuit packaging system with protective coating and method of manufacture thereof |
| 04/07/2011 | US20110079887 Lead frame and method of manufacturing the same |
| 04/07/2011 | US20110079886 Integrated circuit packaging system with pad connection and method of manufacture thereof |
| 04/07/2011 | US20110079885 Integrated circuit packaging system with shaped lead and method of manufacture thereof |
| 04/07/2011 | US20110079877 Mounting circuit substrate |
| 04/07/2011 | US20110079875 Anti-fuse and method for forming the same, unit cell of non volatile memory device with the same |
| 04/07/2011 | US20110079874 Antifuse structure for in line circuit modification |
| 04/07/2011 | US20110079842 Semiconductor device |
| 04/07/2011 | US20110079827 Structure and method to create a damascene local interconnect during metal gate deposition |
| 04/07/2011 | US20110079816 Optical-semiconductor encapsulating material |
| 04/07/2011 | US20110079779 Shape characterization with elliptic fourier descriptor for contact or any closed structures on the chip |
| 04/07/2011 | US20110079649 Sensor |
| 04/07/2011 | US20110079426 Method and apparatus for electrical component physical protection |
| 04/07/2011 | DE202010015502U1 Verschlußstruktur eines plattenförmigen Wärmerohrs Closure structure of a plate-shaped heat pipe |
| 04/07/2011 | DE102010037426A1 Halbleiterstruktur und Verfahren zu deren Herstellung Semiconductor structure and process for their preparation |
| 04/07/2011 | DE102010009452A1 Träger zum elektrischen Verbinden mehrerer Kontakte mindestens eines auf den Träger aufgebrachten Chips und Verfahren zum Herstellen des Trägers Carrier for electrically connecting a plurality of contacts at least one applied to the carrier chip and method of manufacturing of the carrier |
| 04/07/2011 | DE102009049775A1 Vertikal integriertes elektronisches Bauelement, Verfahren zu dessen Herstellung und Finnen-Bipolartransistor Vertically integrated electronic component, to processes for its preparation and fin bipolar transistor |
| 04/07/2011 | DE102009044933A1 Power semiconductor module, has metal foil with section connected with carrier and connecting section spaced from carrier, where metal foil is electrical-conductively connected with another metal foil at connecting section |
| 04/07/2011 | DE102009043740A1 Rückseitenmetallisierung mit besserer Haftung in Hochleistungshalbleiterbauelementen Backside metallization with improved adhesion in high power semiconductor components |
| 04/07/2011 | DE102009038710A1 Halbleiterbauelement Semiconductor device |
| 04/07/2011 | DE102009038709A1 Halbleiterbauelement mit dielektrischem Schichtstapel Semiconductor device with dielectric layer stack |
| 04/07/2011 | DE102006011706B4 Halbleiter-Bauelement, sowie Halbleiter-Bauelement-Test-Verfahren A semiconductor device, and semiconductor device testing method |
| 04/07/2011 | CA2783465A1 Coal fine drying method and system |
| 04/06/2011 | EP2306518A1 Method of protecting an integrated circuit chip against spying by laser attacks |
| 04/06/2011 | EP2306517A1 Indexing of electronic devices using marks distributed on two chips |
| 04/06/2011 | EP2306516A1 Semiconductor device, method for fabricating a semiconductor device and lead frame, comprising a bent contact section |
| 04/06/2011 | EP2306515A2 IC chip package with directly connected leads |
| 04/06/2011 | EP2306514A2 Carbon nanotube bond pad structure and manufacturing method thereof |