Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2014
11/04/2014US8878183 Method and apparatus for monitoring semiconductor fabrication
11/04/2014US8878182 Probe pad design for 3DIC package yield analysis
11/04/2014US8878078 Printed wiring board
11/04/2014US8878070 Wiring board and method of manufacturing a semiconductor device
11/04/2014US8877878 Epoxy resin composition with sulfonium borate complex
11/04/2014US8877877 Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material
11/04/2014US8877851 Graphite filled polyester compositions
11/04/2014US8877849 Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus
11/04/2014US8877645 Integrated circuit structure having selectively formed metal cap
11/04/2014US8877638 ESD/antenna diodes for through-silicon vias
11/04/2014US8877636 Processing of nanostructured devices using microfabrication techniques
11/04/2014US8877633 Methods of forming a barrier system containing an alloy of metals introduced into the barrier system, and an integrated circuit product containing such a barrier system
11/04/2014US8877632 Providing a void-free filled interconnect structure in a layer of package substrate
11/04/2014US8877631 Interconnect arrangement and associated production methods
11/04/2014US8877630 Semiconductor structure having a silver alloy bump body and manufacturing method thereof
11/04/2014US8877629 Semiconductor manufacturing process and structure thereof
11/04/2014US8877621 Low resistivity gate conductor
11/04/2014US8877613 Method of manufacturing a semiconductor device
11/04/2014US8877611 Devices with crack stops
11/04/2014US8877567 Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die
11/04/2014US8877566 Curvilinear heat spreader/lid with improved heat dissipation
11/04/2014US8877563 Microfabricated pillar fins for thermal management
11/04/2014US8877560 Method for assembling heat generating element and heat dissipating element, pressure sensitive element, and power supplying unit
11/04/2014US8877559 Through-silicon via with sidewall air gap
11/04/2014US8877558 Method for making electronic device with liquid crystal polymer and related devices
11/04/2014US8877556 Copper post solder bumps on substrates
11/04/2014US8877555 Flip-chip semiconductor chip packing method
11/04/2014US8877554 Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
11/04/2014US8877552 Method and apparatus for manufacturing electronic integrated circuit chip
11/04/2014US8877523 Recovery method for poor yield at integrated circuit die panelization
11/04/2014US8877323 Semiconductor structures and method for fabricating the same
11/04/2014US8877101 Method of manufacturing a light emitting, power generating or other electronic apparatus
11/04/2014US8876461 Series fan assembling structure
11/04/2014US8876334 Light-mixing multichip package structure
11/04/2014US8876225 Actuator control unit and electric-mechanical brake unit
11/04/2014US8875779 Heat dissipation element with mounting structure
11/04/2014US8875652 Liquid adhesive boundary control
11/04/2014US8875521 Device and method for cooling components using magnetizable phase-change material
10/2014
10/30/2014US20140325150 Wireless apparatus
10/30/2014US20140325105 Memory system components for split channel architecture
10/30/2014US20140322910 Via-free interconnect structure with self-aligned metal line interconnections
10/30/2014US20140322908 Method of making bond pad
10/30/2014US20140322893 Manufacturing method of semiconductor device
10/30/2014US20140322892 Multi-wafer pair anodic bonding apparatus and method
10/30/2014US20140322869 Method for manufacturing chip package structure
10/30/2014US20140322868 Barrier layer on bump and non-wettable coating on trace
10/30/2014US20140322866 Package for Three Dimensional Integrated Circuit
10/30/2014US20140322865 Semiconductor Device and Method of Forming Stacked Semiconductor Die and Conductive Interconnect Structure Through an Encapsulant
10/30/2014US20140322863 Metal Bump Joint Structure and Methods of Forming
10/30/2014US20140321228 Semiconductor device including plural chips stacked to each other
10/30/2014US20140321189 Systems and Methods for Stacked Semiconductor Memory Devices
10/30/2014US20140321186 Stacked memory with redundancy
10/30/2014US20140321063 Directly Cooled Substrates for Semiconductor Modules and Corresponding Manufacturing Methods
10/30/2014US20140319982 Ceramic package
10/30/2014US20140319703 Self-defining, low capacitance wire bond pad
10/30/2014US20140319702 Stackable Package by Using Internal Stacking Modules
10/30/2014US20140319701 Semiconductor chip and a semiconductor package having a package on package (pop) structure including the semiconductor chip
10/30/2014US20140319700 Semiconductor device and method of manufacturing same
10/30/2014US20140319699 Reliable packaging and interconnect structures
10/30/2014US20140319698 Redistribution Layer Contacting First Wafer through Second Wafer
10/30/2014US20140319697 Disabling electrical connections using pass-through 3d interconnects and associated systems and methods
10/30/2014US20140319696 3D Packages and Methods for Forming the Same
10/30/2014US20140319695 Semiconductor Device and Method of Forming Stress-Reduced Conductive Joint Structures
10/30/2014US20140319694 Anticipatory implant for tsv
10/30/2014US20140319693 Semiconductor device and method of forming the same
10/30/2014US20140319692 Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate
10/30/2014US20140319691 Semiconductor device
10/30/2014US20140319689 Contact Pads with Sidewall Spacers and Method of Making Contact Pads with Sidewall Spacers
10/30/2014US20140319688 Protection Layers for Conductive Pads and Methods of Formation Thereof
10/30/2014US20140319686 Semiconductor device and manufacturing method thereof
10/30/2014US20140319685 Hybrid Graphene-Metal Interconnect Structures
10/30/2014US20140319684 Semiconductor device and electronic device having the same
10/30/2014US20140319683 Packaged Semiconductor Devices and Packaging Devices and Methods
10/30/2014US20140319682 Multi-solder techniques and configurations for integrated circuit package assembly
10/30/2014US20140319681 Semiconductor package including solder ball
10/30/2014US20140319680 Semiconductor Device and Method of Forming Bump Structure with Insulating Buffer Layer to Reduce Stress on Semiconductor Wafer
10/30/2014US20140319679 Semiconductor Method and Device of Forming a Fan-Out POP Device with PWB Vertical Interconnect Units
10/30/2014US20140319678 Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier
10/30/2014US20140319677 Submount for electronic, optoelectronic, optical, or photonic components
10/30/2014US20140319675 Semiconductor memory system
10/30/2014US20140319674 Semiconductor cooling device
10/30/2014US20140319673 Semiconductor device
10/30/2014US20140319672 Flow channel member, heat exchanger using same, semiconductor device, and device for manufacturing semiconductor
10/30/2014US20140319671 Semiconductor device and grinding method of semiconductor device
10/30/2014US20140319670 Image sensor package with trench insulator and fabrication method thereof
10/30/2014US20140319669 Power module
10/30/2014US20140319668 High thermal performance 3d package on package structure
10/30/2014US20140319667 Semiconductor apparatus and manufacturing method thereof
10/30/2014US20140319666 Lead frame and semiconductor package manufactured by using the same
10/30/2014US20140319665 Power Semiconductor Package
10/30/2014US20140319664 Quad flat no-lead (qfn) packaging structure and method for manufacturing the same
10/30/2014US20140319663 Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
10/30/2014US20140319662 Semiconductor package
10/30/2014US20140319661 Semiconductor Device and Method of Forming Shielding Layer Over Semiconductor Die Mounted to TSV Interposer
10/30/2014US20140319656 Method and system for height registration during chip bonding
10/30/2014US20140319653 Integrated Switchable Capacitive Device
10/30/2014US20140319652 High quality factor filter implemented in wafer level packaging (wlp) integrated device
10/30/2014US20140319651 Electrical Fuse Structure and Method of Formation
10/30/2014US20140319650 Programmable electrical fuse
10/30/2014US20140319628 Physical quantity detection device and physical quantity detector
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