| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/13/2011 | CN102013423A Semiconductor device and method of manufacturing the same |
| 04/13/2011 | CN102013422A Insulated gate bipolar translator power tube module |
| 04/13/2011 | CN102013421A 集成电路结构 Integrated circuit structure |
| 04/13/2011 | CN102013420A Semiconductor encapsulating structure and encapsulating method thereof |
| 04/13/2011 | CN102013419A Carrier band for packaging minitype radio-frequency module |
| 04/13/2011 | CN102013418A Novel PCB (Printed Circuit Board) carrier tape for SIM card package |
| 04/13/2011 | CN102013417A Novel PCB carrier tape for package of micro radio-frequency module |
| 04/13/2011 | CN102013416A Semiconductor power device packaging adopting two-sided evaporation, cooling and press welding |
| 04/13/2011 | CN102013415A Substrate structure applied to flexible electronic component and manufacture method thereof |
| 04/13/2011 | CN102013410A Inductance element and forming method thereof |
| 04/13/2011 | CN102013403A Wafer level chip size packaging structure and manufacturing method thereof |
| 04/13/2011 | CN102010679A Adhesive for connection of circuit member and semiconductor device using the same |
| 04/13/2011 | CN102010598A Silicone composition and cured product thereof |
| 04/13/2011 | CN102010576A Repairable type epoxy resin encapsulating glue and preparation method thereof |
| 04/13/2011 | CN102010566A Method for preparing epoxy moulding compound for packaging integrated circuit |
| 04/13/2011 | CN101676626B Lamp |
| 04/13/2011 | CN101663756B Solid-state image sensor |
| 04/13/2011 | CN101630657B Integrated circuit chip and manufacturing method for integrated circuit device |
| 04/13/2011 | CN101599474B Integrated circuit module and manufacture method thereof |
| 04/13/2011 | CN101599469B Semiconductor chip encapsulation structure with back surface electricity conductivity and producing method thereof |
| 04/13/2011 | CN101599468B 电子部件 Electronic components |
| 04/13/2011 | CN101592453B Plate type heat exchanger and method of manufacturing the same |
| 04/13/2011 | CN101587869B Reversible leadless package and methods of making and using same |
| 04/13/2011 | CN101582415B Semiconductor device |
| 04/13/2011 | CN101582401B 芯片封装单元 Chip packaging unit |
| 04/13/2011 | CN101562156B Gallium nitride semiconductor element and light emitting diode |
| 04/13/2011 | CN101556940B Semiconductor encapsulating structure with radiation fins |
| 04/13/2011 | CN101552247B 集成电路结构 Integrated circuit structure |
| 04/13/2011 | CN101541683B Inorganic anion exchanger composed of bismuth compound and resin composition for electronic component encapsulation using the same |
| 04/13/2011 | CN101494173B Packaging structure and packaging method for LED chip with crassitude luminous surface |
| 04/13/2011 | CN101488397B Sheet-like electronic component |
| 04/13/2011 | CN101473423B Dual side cooling integrated transistor module and methods of manufacture |
| 04/13/2011 | CN101465346B Semiconductor device and method for manufacturing the device |
| 04/13/2011 | CN101460039B Electronic device |
| 04/13/2011 | CN101459126B Semiconductor device and method of manufacturing the same |
| 04/13/2011 | CN101431093B Organic light emitting device and method of fabricating the same |
| 04/13/2011 | CN101410978B Adjustable on-chip sub-capacitor design |
| 04/13/2011 | CN101390211B Three-dimensional integrated capacitance structure |
| 04/13/2011 | CN101388387B Electronic device and its manufacture method |
| 04/13/2011 | CN101371357B Stress buffering package for a semiconductor component |
| 04/13/2011 | CN101366115B On-chip interconnect-stack cooling using sacrificial interconnect segments |
| 04/13/2011 | CN101361184B Aluminum/silicon carbide composite and heat radiation part making use of the same |
| 04/13/2011 | CN101325201B Array substrate structure of transparent film transistor and manufacturing method thereof |
| 04/13/2011 | CN101322245B Electronic component package with EMI shielding |
| 04/13/2011 | CN101312192B Semiconductor device |
| 04/13/2011 | CN101291769B Cladding material and its fabrication method, method for molding cladding material, and heat sink using cladding material |
| 04/13/2011 | CN101290948B Memory structure and its manufacture method, and manufacture method of memory cell array |
| 04/13/2011 | CN101278383B Electronic circuit device and method for manufacturing same |
| 04/13/2011 | CN101276800B Circuit board and method of manufacturing same |
| 04/13/2011 | CN101257013B Semiconductor device and semiconductor module using the same |
| 04/13/2011 | CN101252112B Semiconductor device and wire bonding method |
| 04/13/2011 | CN101252086B Semiconductor device and method for manufacturing the same |
| 04/13/2011 | CN101228625B Semiconductor package with plated connection |
| 04/13/2011 | CN101211931B Semiconductor device and electronic device |
| 04/13/2011 | CN101211863B Liquid crystal display device and its manufacture method |
| 04/13/2011 | CN101197365B Semiconductor storage device |
| 04/13/2011 | CN101197298B Method for manufacturing semiconductor device and semiconductor device |
| 04/13/2011 | CN101192582B Semiconductor structures and methods for manufacturing same |
| 04/13/2011 | CN101165878B Image sensor and its manufacture method |
| 04/13/2011 | CN101150113B A semiconductor device and a method of increasing a resistance value of an electric fuse |
| 04/13/2011 | CN101106140B Non-volatile memory devices including dummy word lines and related structures and methods |
| 04/12/2011 | US7924592 Semiconductor memory device having improved voltage transmission path and driving method thereof |
| 04/12/2011 | US7924275 Electronic module, methods of manufacturing and driving the same, and electronic instrument |
| 04/12/2011 | US7923852 Semiconductor package structure with protection bar |
| 04/12/2011 | US7923851 Microelectronic assembly with impedance controlled wirebond and conductive reference element |
| 04/12/2011 | US7923849 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 04/12/2011 | US7923848 High performance sub-system design and assembly |
| 04/12/2011 | US7923847 Semiconductor system-in-a-package containing micro-layered lead frame |
| 04/12/2011 | US7923846 Integrated circuit package-in-package system with wire-in-film encapsulant |
| 04/12/2011 | US7923845 Alignment features for proximity communication |
| 04/12/2011 | US7923844 Semiconductor devices including voltage switchable materials for over-voltage protection |
| 04/12/2011 | US7923843 Semiconductor device with a contact plug connected to multiple interconnects formed within |
| 04/12/2011 | US7923842 GaAs integrated circuit device and method of attaching same |
| 04/12/2011 | US7923841 Method for bonding semiconductor structure with substrate and high efficiency photonic device manufactured by using the same method |
| 04/12/2011 | US7923840 Electrically conductive path forming below barrier oxide layer and integrated circuit |
| 04/12/2011 | US7923839 Semiconductor device and method for fabricating semiconductor device |
| 04/12/2011 | US7923836 BLM structure for application to copper pad |
| 04/12/2011 | US7923835 Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing |
| 04/12/2011 | US7923833 Semiconductor module |
| 04/12/2011 | US7923832 Integrated circuit package |
| 04/12/2011 | US7923831 LED-based light source having improved thermal dissipation |
| 04/12/2011 | US7923830 Package-on-package secure module having anti-tamper mesh in the substrate of the upper package |
| 04/12/2011 | US7923829 Bonding pad sharing method applied to multi-chip module and apparatus thereof |
| 04/12/2011 | US7923827 Semiconductor module for a switched-mode power supply and method for its assembly |
| 04/12/2011 | US7923826 Semiconductor device mounted on heat sink having protruded periphery |
| 04/12/2011 | US7923825 Integrated circuit package |
| 04/12/2011 | US7923824 Microelectronic component assemblies and microelectronic component lead frame structures |
| 04/12/2011 | US7923823 Semiconductor device with parylene coating |
| 04/12/2011 | US7923822 Integrated circuit package system including shield |
| 04/12/2011 | US7923821 Semiconductor integrated circuit substrate containing isolation structures |
| 04/12/2011 | US7923820 Method of producing a porous dielectric element and corresponding dielectric element |
| 04/12/2011 | US7923819 Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the same |
| 04/12/2011 | US7923813 Anti-fuse memory device |
| 04/12/2011 | US7923812 Quad memory cell and method of making same |
| 04/12/2011 | US7923811 Electronic fuse cell with enhanced thermal gradient |
| 04/12/2011 | US7923806 Embedded wiring in copper damascene with void suppressing structure |
| 04/12/2011 | US7923783 Semiconductor memory device having resistance element with two conductors |
| 04/12/2011 | US7923760 Dielectric spacers for metal interconnects and method to form the same |
| 04/12/2011 | US7923647 Portable device |
| 04/12/2011 | US7923366 Post passivation interconnection schemes on top of IC chip |