| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/14/2011 | US20110084400 Semiconductor device and manufacturing method thereof |
| 04/14/2011 | US20110084399 Semiconductor device |
| 04/14/2011 | US20110084398 Semiconductor device comprising an electromagnetic waveguide |
| 04/14/2011 | US20110084397 3d integrated circuit layer interconnect |
| 04/14/2011 | US20110084396 Electrical connection for multichip modules |
| 04/14/2011 | US20110084395 Semiconductor package substrate and semiconductor device having the same |
| 04/14/2011 | US20110084394 Semiconductor Structure |
| 04/14/2011 | US20110084393 Method of forming electrodeposited contacts |
| 04/14/2011 | US20110084392 Electronic Structures Including Conductive Layers Comprising Copper and Having a Thickness of at Least 0.5 Micrometers |
| 04/14/2011 | US20110084391 Reducing Device Mismatch by Adjusting Titanium Formation |
| 04/14/2011 | US20110084390 Chip Design with Robust Corner Bumps |
| 04/14/2011 | US20110084389 Semiconductor Device |
| 04/14/2011 | US20110084388 Reducing underfill keep out zone on substrate used in electronic device processing |
| 04/14/2011 | US20110084387 Designs and methods for conductive bumps |
| 04/14/2011 | US20110084386 Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder Mask |
| 04/14/2011 | US20110084385 Semiconductor device and information processing system including the same |
| 04/14/2011 | US20110084384 Semiconductor device and method for manufacturing the same |
| 04/14/2011 | US20110084383 Semiconductor device and manufacturing method thereof |
| 04/14/2011 | US20110084382 Chip package and fabrication method thereof |
| 04/14/2011 | US20110084381 Chip Having A Metal Pillar Structure |
| 04/14/2011 | US20110084379 Semiconductor device having improved heat sink |
| 04/14/2011 | US20110084378 Semiconductor package with integrated interference shielding and method of manufacture thereof |
| 04/14/2011 | US20110084377 System for separating a diced semiconductor die from a die attach tape |
| 04/14/2011 | US20110084376 Modular low stress package technology |
| 04/14/2011 | US20110084375 Semiconductor device package with integrated stand-off |
| 04/14/2011 | US20110084374 Semiconductor package with sectioned bonding wire scheme |
| 04/14/2011 | US20110084373 Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof |
| 04/14/2011 | US20110084372 Package carrier, semiconductor package, and process for fabricating same |
| 04/14/2011 | US20110084371 Modular low stress package technology |
| 04/14/2011 | US20110084370 Semiconductor package and process for fabricating same |
| 04/14/2011 | US20110084369 Device including a semiconductor chip and a carrier and fabrication method |
| 04/14/2011 | US20110084368 Overmolded semiconductor package with a wirebond cage for emi shielding |
| 04/14/2011 | US20110084367 Epitaxial wafer and method of producing the same |
| 04/14/2011 | US20110084366 Epitaxial Wafer and Production Method Thereof |
| 04/14/2011 | US20110084365 Through Silicon Via (TSV) Wire Bond Architecture |
| 04/14/2011 | US20110084364 Wafer and method of manufacturing semiconductor device |
| 04/14/2011 | US20110084359 Semiconductor device |
| 04/14/2011 | US20110084357 Self Aligned Air-Gap in Interconnect Structures |
| 04/14/2011 | US20110084339 Semiconductor device and method of electrostatic discharge protection therefor |
| 04/14/2011 | US20110084335 Semiconductor device with drain voltage protection and manufacturing method thereof |
| 04/14/2011 | US20110084314 System comprising a semiconductor device and structure |
| 04/14/2011 | US20110084296 Light Emitting Diode and Manufacturing Method Thereof |
| 04/14/2011 | US20110083830 Heat dissipation device |
| 04/14/2011 | DE202009016531U1 Leistungselektronische Baugruppe und Wechselrichteranordnung Power electronic module and inverter assembly |
| 04/14/2011 | DE112009001315T5 Vollbrückenmodul mit vier MOSFETs Full-bridge module with four MOSFETs |
| 04/14/2011 | DE112008002823T5 Volloptische schnelle verteilte Entscheidung in einer Computersystemvorrichtung All-optical distributed quick decision in a computer system device |
| 04/14/2011 | DE102010000518A1 Halbleiteranordnung Semiconductor device |
| 04/14/2011 | CA2776932A1 Hermetically sealed high frequency front end |
| 04/13/2011 | EP2309539A1 Indexing of electronic devices using markers with different weights |
| 04/13/2011 | EP2309538A2 Package for semiconductor devices |
| 04/13/2011 | EP2309535A1 Chip package with a chip embedded in a wiring body |
| 04/13/2011 | EP2308909A1 Optical semiconductor sealing resin composition and optical semiconductor device using same |
| 04/13/2011 | EP2308797A2 Structure with a cavity comprising a bonding interface made from a getter material |
| 04/13/2011 | EP2308087A1 Stacking of wafer-level chip scale packages having edge contacts |
| 04/13/2011 | EP2308085A1 Semiconductor package with integrated interference shielding and method of manufacture therof |
| 04/13/2011 | EP2308066A1 Under bump metallization for on-die capacitor |
| 04/13/2011 | EP1114459B1 High voltage shield |
| 04/13/2011 | CN201797689U Circuit board with heat conducting and radiating structure |
| 04/13/2011 | CN201796894U Power transistor with high vibration resistance |
| 04/13/2011 | CN201796886U Metallized plane rectifier |
| 04/13/2011 | CN201796883U Integrated circuit packaging block with resistance to instantaneous electric overload |
| 04/13/2011 | CN201796882U Three terminal regulator |
| 04/13/2011 | CN201796881U Lead frame structure |
| 04/13/2011 | CN201796880U Semi-conductor package |
| 04/13/2011 | CN201796879U Diode for automobile power generator |
| 04/13/2011 | CN201796878U Packaging structure of chip with 20 base pin |
| 04/13/2011 | CN201796877U Encapsulating structure for chip with 64 pins |
| 04/13/2011 | CN201796876U 散热器 Heat sink |
| 04/13/2011 | CN201796875U Proximity sensitive package structure |
| 04/13/2011 | CN201796115U Testing plate for soft error rate acceleration measurement |
| 04/13/2011 | CN1909215B 半导体器件 Semiconductor devices |
| 04/13/2011 | CN1902753B Cooling system for an electronic component |
| 04/13/2011 | CN1901163B Method for fabricating a circuitry component by continuous electroplating and circuitry component structure |
| 04/13/2011 | CN1841859B Contact assembly for use with semiconductor packages |
| 04/13/2011 | CN1830083B Semiconductor device and manufacturing method thereof |
| 04/13/2011 | CN1812095B Low voltage logic operation using higher voltage supply levels |
| 04/13/2011 | CN1812094B Low voltage logic operation using higher voltage supply levels |
| 04/13/2011 | CN102017825A Cooling device for a plurality of power modules |
| 04/13/2011 | CN102017339A Substrate incorporating ESD protection function |
| 04/13/2011 | CN102017193A Semiconductor light-emitting device with double-sided passivation |
| 04/13/2011 | CN102017140A Semiconductor device |
| 04/13/2011 | CN102017139A 3-D integrated circuit lateral heat dissipation |
| 04/13/2011 | CN102017138A Die stacking system and method |
| 04/13/2011 | CN102017137A High-speed memory package |
| 04/13/2011 | CN102017136A Metal frame for electronic components |
| 04/13/2011 | CN102017135A Substrate-mounted circuit module comprising components in a plurality of contact planes |
| 04/13/2011 | CN102017134A Heatsink, cooling module, and coolable electronic board |
| 04/13/2011 | CN102017133A Chip-size double side connection package and method for manufacturing the same |
| 04/13/2011 | CN102017132A Hermetic sealing cap |
| 04/13/2011 | CN102017131A Die substrate with reinforcement structure |
| 04/13/2011 | CN102017112A Electrical bond connection arrangement |
| 04/13/2011 | CN102017105A Hermetically-sealed packages for electronic components having reduced unused areas |
| 04/13/2011 | CN102017099A Method for forming through electrode, and semiconductor device |
| 04/13/2011 | CN102015883A Resin composition and sheet using the same |
| 04/13/2011 | CN102015531A Amorphous siliceous powder, process for production of the same, and use thereof |
| 04/13/2011 | CN102014570A PCB (printed circuit board) carried tape for phone card with non-contact function |
| 04/13/2011 | CN102013673A Electronic static discharge (ESD) protecting device |
| 04/13/2011 | CN102013578A Conductor extraction structure and power module |
| 04/13/2011 | CN102013438A Groove MOSFET (Metal-Oxide Semiconductor Field Effect Transistor) device and making method thereof |
| 04/13/2011 | CN102013425A Semiconductor integrated circuit |