| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/20/2011 | CN101043022B Method for producing semiconductor component and its semiconductor component |
| 04/20/2011 | CN101042946B Silver alloy material, circuit board, electronic device and method of producing circuit board |
| 04/20/2011 | CN101019230B Heat pipe heat sink |
| 04/19/2011 | US7930658 Semiconductor integrated circuit device and fabrication method thereof |
| 04/19/2011 | US7929714 Integrated audio codec with silicon audio transducer |
| 04/19/2011 | US7929296 Fastening device and heat-dissipating module having the same |
| 04/19/2011 | US7928591 Apparatus and method for predetermined component placement to a target platform |
| 04/19/2011 | US7928590 Integrated circuit package with a heat dissipation device |
| 04/19/2011 | US7928589 Semiconductor device |
| 04/19/2011 | US7928588 Circuit signal connection interface, a manufacture method thereof, and an electronic device using the same |
| 04/19/2011 | US7928587 Power semiconductor module |
| 04/19/2011 | US7928586 Semiconductor device with multiple designation marks |
| 04/19/2011 | US7928585 Sprocket opening alignment process and apparatus for multilayer solder decal |
| 04/19/2011 | US7928584 Stacked MEMS device |
| 04/19/2011 | US7928583 Semiconductor device |
| 04/19/2011 | US7928582 Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces |
| 04/19/2011 | US7928581 Semiconductor device having a conductive member including an end face substantially fush with an end face of a wiring board and method of manufacturing the same |
| 04/19/2011 | US7928580 Semiconductor memory device having wiring with lead portions disposed with a pitch larger than pitch of parallel bit lines |
| 04/19/2011 | US7928579 Devices including sloped vias in a substrate and devices including spring-like deflecting contacts |
| 04/19/2011 | US7928578 Electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components |
| 04/19/2011 | US7928577 Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the same |
| 04/19/2011 | US7928576 Post passivation interconnection schemes on top of the IC chips |
| 04/19/2011 | US7928575 Electronic device, method of manufacture of the same, and sputtering target |
| 04/19/2011 | US7928573 Metal thin film for interconnection of semiconductor device |
| 04/19/2011 | US7928572 Composite semiconductor device |
| 04/19/2011 | US7928571 Device having dual etch stop liner and reformed silicide layer and related methods |
| 04/19/2011 | US7928570 Interconnect structure |
| 04/19/2011 | US7928569 Redundant barrier structure for interconnect and wiring applications, design structure and method of manufacture |
| 04/19/2011 | US7928568 Nanowire-based device having isolated electrode pair |
| 04/19/2011 | US7928567 Power supply network |
| 04/19/2011 | US7928566 Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device |
| 04/19/2011 | US7928565 Semiconductor device with a high thermal dissipation efficiency |
| 04/19/2011 | US7928564 Multichip module package and fabrication method |
| 04/19/2011 | US7928563 3-D ICs with microfluidic interconnects and methods of constructing same |
| 04/19/2011 | US7928562 Segmentation of a die stack for 3D packaging thermal management |
| 04/19/2011 | US7928561 Device for thermal transfer and power generation |
| 04/19/2011 | US7928560 Composite multi-layer substrate and module using the substrate |
| 04/19/2011 | US7928559 Semiconductor device, electronic component module, and method for manufacturing semiconductor device |
| 04/19/2011 | US7928558 Production of an electrical component and component |
| 04/19/2011 | US7928557 Stacked package and method for manufacturing the package |
| 04/19/2011 | US7928555 Stack semiconductor package including an interposer chip having an imposed diode or capacitor |
| 04/19/2011 | US7928554 IC chip, antenna, and manufacturing method of the IC chip and the antenna |
| 04/19/2011 | US7928553 Power electronic device |
| 04/19/2011 | US7928552 Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof |
| 04/19/2011 | US7928551 Semiconductor device and method of manufacturing the same |
| 04/19/2011 | US7928550 Flexible interposer for stacking semiconductor chips and connecting same to substrate |
| 04/19/2011 | US7928549 Integrated circuit devices with multi-dimensional pad structures |
| 04/19/2011 | US7928548 Silicon heat spreader mounted in-plane with a heat source and method therefor |
| 04/19/2011 | US7928547 Optical semiconductor device |
| 04/19/2011 | US7928546 Semiconductor device and manufacturing method thereof |
| 04/19/2011 | US7928545 LED package and fabrication method thereof |
| 04/19/2011 | US7928544 Semiconductor chip package assembly with deflection- resistant leadfingers |
| 04/19/2011 | US7928543 Tape wiring substrate and tape package using the same |
| 04/19/2011 | US7928542 Lead frame for semiconductor package |
| 04/19/2011 | US7928541 Copper alloy sheet and QFN package |
| 04/19/2011 | US7928540 Integrated circuit package system |
| 04/19/2011 | US7928539 Semiconductor device |
| 04/19/2011 | US7928538 Package-level electromagnetic interference shielding |
| 04/19/2011 | US7928537 Organic electroluminescent device |
| 04/19/2011 | US7928532 Fuse box including a guard ring electrically connected to the fuse pattern and method of forming the same |
| 04/19/2011 | US7928476 Semiconductor device and method of manufacturing the same |
| 04/19/2011 | US7928459 Light emitting diode package including thermoelectric element |
| 04/19/2011 | US7928455 Semiconductor light-emitting device and method for forming the same |
| 04/19/2011 | US7928435 Interposer chip and multi-chip package having the interposer chip |
| 04/19/2011 | US7928347 Heating unit and method of making the same |
| 04/19/2011 | US7928006 Structure for a semiconductor device and a method of manufacturing the same |
| 04/19/2011 | US7927971 Method for manufacturing semiconductor device |
| 04/19/2011 | US7927927 Semiconductor package and method therefor |
| 04/19/2011 | US7927924 Semi-finished package and method for making a package |
| 04/19/2011 | US7927918 Packaged products, including stacked package modules, and methods of forming same |
| 04/19/2011 | CA2399547C Group iii nitride based fets and hemts with reduced trapping and method for producing the same |
| 04/14/2011 | WO2011044392A1 Three dimensional inductor and transformer |
| 04/14/2011 | WO2011044390A1 Apparatus and method for through silicon via impedance matching |
| 04/14/2011 | WO2011043869A2 Semiconductor device having a copper plug |
| 04/14/2011 | WO2011043493A1 Semiconductor device |
| 04/14/2011 | WO2011043474A1 Curable resin composition and cured products thereof |
| 04/14/2011 | WO2011043441A1 Light-emitting device |
| 04/14/2011 | WO2011043090A1 Urethane resin composition, cured object, and photosemiconductor device using cured object |
| 04/14/2011 | WO2011043058A1 Semiconductor device |
| 04/14/2011 | WO2011043009A1 Semiconductor manufacturing device and method for manufacturing semiconductor device using same |
| 04/14/2011 | WO2011042982A1 Semiconductor device manufacturing method |
| 04/14/2011 | WO2011042667A1 Power module for an automobile |
| 04/14/2011 | WO2011042256A1 Chip package with a chip embedded in a wiring body |
| 04/14/2011 | WO2011042000A1 Hermetically sealed radio-frequency front end |
| 04/14/2011 | WO2011020038A3 Interconnect structure with elements of varying height or different materials that allows a balanced stress to prevent thin die warpage |
| 04/14/2011 | WO2010140804A3 Norbornene resins for encapsulating optical device |
| 04/14/2011 | WO2010093522A3 Display device with desiccant |
| 04/14/2011 | US20110086218 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods |
| 04/14/2011 | US20110085307 Enclosure for a vehicle |
| 04/14/2011 | US20110084412 Indexing of electronic devices with multiple weight markers |
| 04/14/2011 | US20110084411 Semiconductor die |
| 04/14/2011 | US20110084410 Wiring Substrate for a Semiconductor Chip, and Semiconducotor Package Having the Wiring Substrate |
| 04/14/2011 | US20110084409 Semiconductor element mounting board |
| 04/14/2011 | US20110084408 Thermosetting die-bonding film |
| 04/14/2011 | US20110084407 System and method for preventing metal corrosion on bond pads |
| 04/14/2011 | US20110084406 Device and interconnect in flip chip architecture |
| 04/14/2011 | US20110084405 Stacking semiconductor device and production method thereof |
| 04/14/2011 | US20110084403 Pad bonding employing a self-aligned plated liner for adhesion enhancement |
| 04/14/2011 | US20110084402 Packaged semiconductor assemblies and methods for manufacturing such assemblies |
| 04/14/2011 | US20110084401 Package-on-package system with via z-interconnections and method for manufacturing thereof |