| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/20/2011 | CN102024782A Three-dimensional vertical interconnecting structure and manufacturing method thereof |
| 04/20/2011 | CN102024781A 集成电路结构 Integrated circuit structure |
| 04/20/2011 | CN102024780A Electronic device, method of manufacturing electronic device, and electronic equipment |
| 04/20/2011 | CN102024779A Pattern structures in semiconductor devices and method for forming the same |
| 04/20/2011 | CN102024778A 导线架及芯片封装体 Lead frame and chip package |
| 04/20/2011 | CN102024777A Semiconductor chip encapsulation structure and encapsulation method |
| 04/20/2011 | CN102024776A Flip-chip packaging assembly and integrated circuit device |
| 04/20/2011 | CN102024775A Semiconductor structure and manufacturing method thereof |
| 04/20/2011 | CN102024774A Contact pad |
| 04/20/2011 | CN102024773A Resin-sealed semiconductor device and method of manufacturing the same |
| 04/20/2011 | CN102024772A Heat-dissipating substrate and fabricating method thereof |
| 04/20/2011 | CN102024771A Packaging structure and method |
| 04/20/2011 | CN102024770A Semiconductor chip package structure and package method |
| 04/20/2011 | CN102024769A 集成电路元件 IC components |
| 04/20/2011 | CN102024768A Manufacturing method of semiconductor device and semiconductor structure |
| 04/20/2011 | CN102024767A Wafer edge film structure and formation method thereof |
| 04/20/2011 | CN102024755A Cmos image sensor and forming method thereof |
| 04/20/2011 | CN102024748A Method for reducing critical dimension of contact hole |
| 04/20/2011 | CN102024744A Semiconductor device and manufacture method thereof |
| 04/20/2011 | CN102024724A Method of manufacturing semiconductor device and semiconductor device |
| 04/20/2011 | CN102024716A Semiconductor device and method for manufacturing the same |
| 04/20/2011 | CN102024712A Packaging structure and method for manufacturing the same |
| 04/20/2011 | CN102024710A Method for manufacturing photoelectric element, encapsulation structure and encapsulation device thereof |
| 04/20/2011 | CN102024708A 引线框及其形成方法 Leadframe and method for forming |
| 04/20/2011 | CN102024698A Method of manufacturing semiconductor device and mask |
| 04/20/2011 | CN102024696A Opening and forming method thereof |
| 04/20/2011 | CN102024684A Semiconductor device and method of forming integrated passive device |
| 04/20/2011 | CN102023444A Liquid crystal display device and method of fabricating the same |
| 04/20/2011 | CN102023438A Liquid crystal display device, manufacturing method and defect repair method |
| 04/20/2011 | CN102023401A TFT-LCD array substrate and method for manufacturing the same |
| 04/20/2011 | CN102022708A Radiating structure of LED lamp and LED lamp |
| 04/20/2011 | CN102022707A Heat radiating device of light module |
| 04/20/2011 | CN102022630A Space isolation technology for LED and phosphor powder |
| 04/20/2011 | CN102022629A Light emitting device |
| 04/20/2011 | CN102020783A Selection method of fillers for advanced encapsulating material |
| 04/20/2011 | CN102019543A Temperature-equalizing plate and manufacture method thereof |
| 04/20/2011 | CN101651124B Novel carrier tape for packaging mobile phone card |
| 04/20/2011 | CN101651122B 3D conduction structure and manufacturing method thereof |
| 04/20/2011 | CN101649400B Diamond reinforced metal-base composite material for electronic packaging and preparation method thereof |
| 04/20/2011 | CN101626659B High-speed guide hole system for differential signal circuit of circuit board |
| 04/20/2011 | CN101609805B Method for forming chip encapsulating lug structure of flexible convex pad |
| 04/20/2011 | CN101572260B Multi-chip stacking type packaging body |
| 04/20/2011 | CN101566331B Pulse thermal fin plate type radiator |
| 04/20/2011 | CN101553085B Preferential assymmetrical via positioning for printed circuit boards |
| 04/20/2011 | CN101552264B Power module and its manufacture method |
| 04/20/2011 | CN101540316B 集成电路芯片 IC chip |
| 04/20/2011 | CN101515581B Semiconductor element structure and method for making same |
| 04/20/2011 | CN101511158B Radiating module and electronic device using the same |
| 04/20/2011 | CN101510543B Integrated semiconductor device |
| 04/20/2011 | CN101504936B Electric apparatus substrate, image forming control panel and image forming apparatus |
| 04/20/2011 | CN101485002B Lighting device package with frame and optical transmission components |
| 04/20/2011 | CN101477974B Glue sealing method of conductive wire frame strip, and semiconductor encapsulation construction having the conductive wire frame |
| 04/20/2011 | CN101465333B Lead wire frame and producing method thereof |
| 04/20/2011 | CN101465327B Semiconductor element substrate, ink jet head employing semiconductor element substrate, and method for bonding semiconductor element substrate |
| 04/20/2011 | CN101459164B 功率半导体模块及其组合方法 Power semiconductor module and a combination method |
| 04/20/2011 | CN101459147B Heat radiation fin, encapsulation piece comprising the heat radiation fin and encapsulation method |
| 04/20/2011 | CN101454911B Apparatus, system and method for use in mounting electronic elements |
| 04/20/2011 | CN101452907B Vertical interconnecting through-hole for three-dimensional systematic encapsulation, and preparation thereof |
| 04/20/2011 | CN101452862B Encapsulation method with grains reconfigured |
| 04/20/2011 | CN101449376B Contact surrounded by passivation and polymide and method therefor |
| 04/20/2011 | CN101447483B Calibration technique for measuring power device at wafer level and semiconductor wafer |
| 04/20/2011 | CN101442060B Pixel array and method of manufacturing the same |
| 04/20/2011 | CN101425503B Semiconductor device and method for manufacturing the same |
| 04/20/2011 | CN101419984B Semiconductor structure and method for fabricating same |
| 04/20/2011 | CN101415316B Electronic device and manufacturing method thereof |
| 04/20/2011 | CN101414598B Semiconductor contact structure |
| 04/20/2011 | CN101405872B Infrared sensor and method for manufacturing infrared sensor |
| 04/20/2011 | CN101388367B Wafer stage package method and package construction |
| 04/20/2011 | CN101383338B First inter-metal medium capable of improving flash memory performance and preparation thereof |
| 04/20/2011 | CN101377293B Lamp cup of LED light fitting and LED light fitting using the same |
| 04/20/2011 | CN101373751B Electronic device and electronic apparatus |
| 04/20/2011 | CN101371344B 场效应晶体管 FET |
| 04/20/2011 | CN101361185B Mounting device for a semiconductor package |
| 04/20/2011 | CN101359672B Semiconductor structure |
| 04/20/2011 | CN101339957B Power FET with low on-resistance using merged metal layers |
| 04/20/2011 | CN101334679B Temperature sensing device for powered electronic apparatus |
| 04/20/2011 | CN101326213B Epoxy resin composition for encapsulation and electronic component device |
| 04/20/2011 | CN101320725B Parametric testline with increased test pattern areas |
| 04/20/2011 | CN101299418B Semiconductor device and manufacture method thereof |
| 04/20/2011 | CN101290922B System realizing three-dimensional interconnection between multi-systems |
| 04/20/2011 | CN101288351B Printed wiring board and method for manufacturing printed wiring board |
| 04/20/2011 | CN101281906B Standard cell and semiconductor device including the same |
| 04/20/2011 | CN101281903B Multiple encapsulation structure |
| 04/20/2011 | CN101279710B Method for judging wafer backside alignment overlay accuracy and wafer thereof |
| 04/20/2011 | CN101273455B Wafer with scribe lanes comprising active circuits for die testing of complementary signal processing parts |
| 04/20/2011 | CN101262004B Phase change storage unit and method for dual shallow groove separated bipolar transistor selection |
| 04/20/2011 | CN101261987B Electronic-component-mounting board |
| 04/20/2011 | CN101261972B Land grid array module with contact locating features |
| 04/20/2011 | CN101251903B RFID tag |
| 04/20/2011 | CN101232776B Printed circuit board |
| 04/20/2011 | CN101226930B Semiconductor structure with layer or structure identification mark and manufacturing method and application thereof |
| 04/20/2011 | CN101226920B Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection |
| 04/20/2011 | CN101217138B A measurement construction to enhance the electricity thickness measuring stability of an oxide layer of P trap bar |
| 04/20/2011 | CN101188226B Chip package structure and fabricating process thereof |
| 04/20/2011 | CN101131974B Packaging structure and radiator piece thereof |
| 04/20/2011 | CN101128556B Method for felting underlay |
| 04/20/2011 | CN101114633B Interconnection substrate, semiconductor chip package including the same, and display system including the same |
| 04/20/2011 | CN101110433B Semiconductor device and manufacturing method thereof |
| 04/20/2011 | CN101097903B Overlay vernier key and method for fabricating the same |
| 04/20/2011 | CN101043026B Crystalline semiconductor film, semiconductor device and method for manufacturing thereof |