| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/21/2011 | DE112009000383T5 Package-on-Package unter Verwendung eines löthöckerlosen Aufbauschicht (BBUL)-Bausteins Package on package using a löthöckerlosen structure layer (BBUL) -Bausteins |
| 04/21/2011 | DE10356880B4 Verfahren zur Herstellung eines flüssigkeits-, gas- und dampfdichten elektrischen und/oder optischen Bauelements A process for preparing a liquid-, gas- and vapor-tight electrical and / or optical component |
| 04/21/2011 | DE102010037439A1 Bauelement mit einem Halbleiterchip und einem Träger und Fabrikationsverfahren Component having a semiconductor chip and a substrate and fabrication process |
| 04/21/2011 | DE102010037292A1 Anordnung und Herstellungsverfahren Assembly and manufacturing processes |
| 04/21/2011 | DE102009049671A1 Integrierte Schaltung mit ESD Struktur Integrated circuit with ESD structure |
| 04/21/2011 | DE102009049102A1 Halbleiterbauelement mit Durchkontaktierung und Verfahren zur Herstellung einer Durchkontaktierung in einem Halbleiterbauelement A semiconductor device having through-hole plating and method for making a via hole in a semiconductor device |
| 04/21/2011 | DE102009045181A1 Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls The power semiconductor module and method of operating a power semiconductor module |
| 04/21/2011 | DE102009039247A1 Halbleiterkörper mit einer Anschlusszelle Semiconductor body having a connection cell |
| 04/21/2011 | DE102008025451B4 Halbleiterbauelement und Verfahren zum Platzieren von Halbleiterbauelementen A semiconductor device and method for placing semiconductor devices |
| 04/21/2011 | DE102007041266B4 Sensorvorrichtung und deren Herstellungsverfahren Sensor device and its manufacturing method |
| 04/21/2011 | DE102007024355B4 Verfahren zum Herstellen einer Schutzstruktur A method for producing a protective structure |
| 04/20/2011 | EP2312921A1 Interconnect board, printed circuit board unit, and method |
| 04/20/2011 | EP2312920A2 Interconnect board, printed circuit board unit, and method |
| 04/20/2011 | EP2312916A2 Circuit board and semiconductor module |
| 04/20/2011 | EP2312704A1 Connector incorporating electronic component, method for manufacturing connector incorporating electronic component, and apparatus for manufacturing connector incorporating electronic component |
| 04/20/2011 | EP2312661A1 Thermoelectric assembly |
| 04/20/2011 | EP2312630A1 Leadframe and method of manufacturing the same |
| 04/20/2011 | EP2312629A1 Chip lead frame and photoelectric energy transducing module |
| 04/20/2011 | EP2312628A2 Semiconductor device bonding wire |
| 04/20/2011 | EP2312627A2 Semiconductor device and on-vehicle AC generator |
| 04/20/2011 | EP2312626A1 Heat pipe assembly and heat dissipation device having the same |
| 04/20/2011 | EP2312625A2 Optical-semiconductor encapsulating material |
| 04/20/2011 | EP2312623A1 Micro-ball removal method and removal device, and micro-ball batch mounting method and batch mounting device |
| 04/20/2011 | EP2312622A2 Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor |
| 04/20/2011 | EP2312560A1 Active matrix substrate, display panel, display device, and active matrix substrate manufacturing method |
| 04/20/2011 | EP2311096A1 Optical connector and manufacturing method thereof |
| 04/20/2011 | EP2311089A1 Optical signaling for a package-on-package stack |
| 04/20/2011 | EP2311087A1 Integrated circuit structure |
| 04/20/2011 | EP2311086A1 Heat exchange structure and cooling device including such a structure |
| 04/20/2011 | EP2311085A2 Monolithic structurally complex heat sink designs |
| 04/20/2011 | EP2311084A2 Flip chip overmold package |
| 04/20/2011 | EP2310785A1 Vapor vortex heat sink |
| 04/20/2011 | EP2310738A1 Remote cooling by combining heat pipe and resonator for synthetic jet cooling |
| 04/20/2011 | EP1688995B1 Interposer for decoupling integrated circuits on a circuit board |
| 04/20/2011 | EP1597950B1 Industrial ethernet switch |
| 04/20/2011 | CN201805672U Uniform temperature plate with supporting columns |
| 04/20/2011 | CN201805668U Novel aluminum section for radiator |
| 04/20/2011 | CN201805666U Radiating fin for electronic heating component |
| 04/20/2011 | CN201805622U Printed circuit board component and electronic equipment |
| 04/20/2011 | CN201805359U Encapsulated photovoltaic rectifier bridge stack |
| 04/20/2011 | CN201804870U Internal insulation type plastic package semi-conductor device |
| 04/20/2011 | CN201804864U Power device packaging structure |
| 04/20/2011 | CN201804860U Laser diode device |
| 04/20/2011 | CN201804859U 线路板 Board |
| 04/20/2011 | CN201804858U Lead frame for manufacturing transient voltage suppressor |
| 04/20/2011 | CN201804857U Lead frame and package part comprising same |
| 04/20/2011 | CN201804856U Surface-mounted semiconductor element |
| 04/20/2011 | CN201804855U Surface-mounting type semi-conductor device |
| 04/20/2011 | CN201804854U External controlled silicon cooling device |
| 04/20/2011 | CN201804853U Air deflecting structure with radiator and radiating module of air deflecting structure |
| 04/20/2011 | CN201804852U Structure of heat radiator |
| 04/20/2011 | CN201804851U Novel integrated circuit (IC) fixed clip for car amplifier |
| 04/20/2011 | CN201803624U Multichannel parallel-loop pulsating heat pipe |
| 04/20/2011 | CN1973174B Method of assembling a semiconductor component and apparatus therefor |
| 04/20/2011 | CN1925155B 集成电路装置 The integrated circuit device |
| 04/20/2011 | CN1901162B Method for fabricating a circuitry component by continuous electroplating and circuitry component structure |
| 04/20/2011 | CN1881537B Method for manufacturing active matrix display |
| 04/20/2011 | CN102027813A Multilayer ceramic substrate and method for producing the same |
| 04/20/2011 | CN102027605A Device comprising a multilayer board and light-emitting diodes |
| 04/20/2011 | CN102027601A Leadframe receiver package for solar concentrator |
| 04/20/2011 | CN102027595A Pad design for STT-MRAM |
| 04/20/2011 | CN102027594A Regenerative building block and diode bridge rectifier and methods |
| 04/20/2011 | CN102027593A Cooling arrangement comprising two semiconductor components disposed next to one another |
| 04/20/2011 | CN102027592A Substrate for power module, power module, and method for producing substrate for power module |
| 04/20/2011 | CN102027591A Semiconductor module, method for manufacturing semiconductor module and portable apparatus |
| 04/20/2011 | CN102027590A High frequency storing case and high frequency module |
| 04/20/2011 | CN102027585A Circuit module and method of manufacturing the same |
| 04/20/2011 | CN102027584A Semiconductor component fabrication method and semiconductor component |
| 04/20/2011 | CN102027580A Film forming method of silicon oxide film, silicon oxide film, semiconductor device, and manufacturing method of semicomductor device |
| 04/20/2011 | CN102027058A A curable composition and use thereof |
| 04/20/2011 | CN102027057A A curable composition and use thereof |
| 04/20/2011 | CN102027036A Electronic packaging |
| 04/20/2011 | CN102026522A Radiating module |
| 04/20/2011 | CN102026519A Radiating system |
| 04/20/2011 | CN102026498A Method for manufacturing circuit board, circuit board and chip packaging structure |
| 04/20/2011 | CN102025135A ESD protective device |
| 04/20/2011 | CN102024883A Light-emitting diode radiating substrate and preparation method thereof |
| 04/20/2011 | CN102024828A Image sensing module and capsulation method thereof |
| 04/20/2011 | CN102024824A Array field effect transistor |
| 04/20/2011 | CN102024820A Memory cell and manufacture method thereof and memory structure |
| 04/20/2011 | CN102024811A Electrostatic discharge protection circuit |
| 04/20/2011 | CN102024810A Integrated circuit and electronic apparatus |
| 04/20/2011 | CN102024807A Protection device and method for semiconductor apparatus |
| 04/20/2011 | CN102024803A 功率模块 Power Modules |
| 04/20/2011 | CN102024799A 半导体装置 Semiconductor device |
| 04/20/2011 | CN102024798A Packaging structure used for integrating surface adhesive type assembly |
| 04/20/2011 | CN102024797A Protective structure for electronic element |
| 04/20/2011 | CN102024795A Semiconductor device and forming method thereof |
| 04/20/2011 | CN102024794A Semiconductor device and communication apparatus |
| 04/20/2011 | CN102024793A Semiconductor component |
| 04/20/2011 | CN102024792A Semiconductor device for electrostatic discharge protection |
| 04/20/2011 | CN102024791A Semiconductor chip |
| 04/20/2011 | CN102024790A Semiconductor device for interconnection process and manufacturing method thereof |
| 04/20/2011 | CN102024789A Glue layer and forming method thereof |
| 04/20/2011 | CN102024788A Semiconductor device for interconnection process and manufacturing method thereof |
| 04/20/2011 | CN102024787A Polysilicon wire, semiconductor device and memory circuit |
| 04/20/2011 | CN102024786A Semiconductor device for interconnection process and manufacturing method thereof |
| 04/20/2011 | CN102024785A Semiconductor device |
| 04/20/2011 | CN102024784A Block contact plugs for mos devices |
| 04/20/2011 | CN102024783A Semiconductor element for use in interconnection process and manufacturing method thereof |