| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/26/2011 | US7932586 Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof |
| 04/26/2011 | US7932585 Electrical component and film composite laminated on the component and method for production |
| 04/26/2011 | US7932569 Micromechanical device with microfluidic lubricant channel |
| 04/26/2011 | US7932561 Semiconductor apparatus |
| 04/26/2011 | US7932535 Synthetic jet cooling system for LED module |
| 04/26/2011 | US7932517 Semiconductor device comprising circuit substrate with inspection connection pads and manufacturing method thereof |
| 04/26/2011 | US7932466 Nautilus self pressurizing equipment enclosure |
| 04/26/2011 | US7932319 Thermosetting resin composition and semiconductor sealing medium |
| 04/26/2011 | US7932295 Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device |
| 04/26/2011 | US7932174 Method of making a semiconductor device having improved contacts |
| 04/26/2011 | US7932173 Method of fabricating integrated circuitry |
| 04/26/2011 | US7932165 Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base |
| 04/26/2011 | US7932131 Reduction of package height in a stacked die configuration |
| 04/26/2011 | US7931830 Dielectric composition for use in circuitized substrates and circuitized substrate including same |
| 04/26/2011 | US7931063 Transfer assembly for manufacturing electronic devices |
| 04/26/2011 | CA2447978C Thermal interface material and heat sink configuration |
| 04/21/2011 | WO2011047270A1 Method and system for exposing delicate structures of a device encapsulated in a mold compound |
| 04/21/2011 | WO2011047194A1 Edge sealants having balanced properties |
| 04/21/2011 | WO2011047067A2 Prismatic cell system with thermal management features |
| 04/21/2011 | WO2011046844A1 System comprising a semiconductor device and structure |
| 04/21/2011 | WO2011046809A2 Ic package with non-uniform dielectric layer thickness |
| 04/21/2011 | WO2011046769A1 Protective circuit board cover |
| 04/21/2011 | WO2011046673A1 Multiple leadframe package |
| 04/21/2011 | WO2011046483A1 A method to enclose solar cells |
| 04/21/2011 | WO2011046181A1 Resin composition, semiconductor wafer-bonded body, and semiconductor device |
| 04/21/2011 | WO2011046091A1 Magnet device |
| 04/21/2011 | WO2011046090A1 Magnet device |
| 04/21/2011 | WO2011046036A1 Circuit device and production method therefor |
| 04/21/2011 | WO2011046003A1 Semiconductor device and manufacturing method thereof |
| 04/21/2011 | WO2011045929A1 Sensor device and method for producing sensor device |
| 04/21/2011 | WO2011045836A1 Sensor device and method for fabricating sensor device |
| 04/21/2011 | WO2011045153A1 Semiconductor component having a plated through-hole and method for the production thereof |
| 04/21/2011 | WO2011044833A1 Semiconductor device structure and method for manufacturing the same |
| 04/21/2011 | WO2011026218A9 Using interrupted through-silicon-vias in integrated circuits adapted for stacking |
| 04/21/2011 | WO2011011298A3 Method of operating a clamping system of a wire bonding machine |
| 04/21/2011 | WO2010149762A3 Biocompatible packaging |
| 04/21/2011 | WO2010039358A8 Ceramic heat pipe with porous ceramic wick |
| 04/21/2011 | US20110092897 Analyte Monitoring Device and Methods of Use |
| 04/21/2011 | US20110092065 Semiconductor device suitable for a stacked structure |
| 04/21/2011 | US20110092042 Monitor pattern of semiconductor device and method of manufacturing semiconductor device |
| 04/21/2011 | US20110090927 mounted semiconductor device and a method for making the same |
| 04/21/2011 | US20110090605 Semiconductor integrated circuit |
| 04/21/2011 | US20110090004 Reconfiguring through silicon vias in stacked multi-die packages |
| 04/21/2011 | US20110089813 Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same |
| 04/21/2011 | US20110089581 Semiconductor wafer having scribe lane alignment marks for reducing crack propagation |
| 04/21/2011 | US20110089580 Semiconductor device comprising high performance encapsulation resins |
| 04/21/2011 | US20110089579 Multi-chip module |
| 04/21/2011 | US20110089578 Wafer structure |
| 04/21/2011 | US20110089577 Method and structure for bonding flip chip |
| 04/21/2011 | US20110089576 Pad layout structure of a driver ic chip |
| 04/21/2011 | US20110089575 Multichip package and method of manufacturing the same |
| 04/21/2011 | US20110089574 Semiconductor device |
| 04/21/2011 | US20110089573 Semiconductor device and manufacturing method thereof |
| 04/21/2011 | US20110089572 Method for fabricating through substrate vias |
| 04/21/2011 | US20110089571 Semiconductor device, circuit substrate, and electronic device |
| 04/21/2011 | US20110089570 Multi-Layer Connection Cell |
| 04/21/2011 | US20110089569 Multilayer wiring, method for placing dummy wiring in multilayer wiring, semiconductor device, and semiconductor device manufacturing method |
| 04/21/2011 | US20110089568 Power semiconductor device and manufacturing method therefor |
| 04/21/2011 | US20110089567 Production Method and Production Apparatus of Tin or Solder Alloy for Electronic Components, and Solder Alloy |
| 04/21/2011 | US20110089566 Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates |
| 04/21/2011 | US20110089565 Semiconductor Device and Electronic Apparatus Equipped with the Semiconductor Device |
| 04/21/2011 | US20110089564 Adhesive on wire stacked semiconductor package |
| 04/21/2011 | US20110089563 Method for manufacturing semiconductor device and semiconductor device |
| 04/21/2011 | US20110089562 Semiconductor device having wafer-level chip size package |
| 04/21/2011 | US20110089561 Semiconductor package and method of manufacturing the same |
| 04/21/2011 | US20110089560 Non-Uniform Alignment of Wafer Bumps with Substrate Solders |
| 04/21/2011 | US20110089559 Method and installation for producing a semiconductor device, and semiconductor device |
| 04/21/2011 | US20110089558 Semiconductor device and a manufacturing method thereof |
| 04/21/2011 | US20110089557 Area reduction for die-scale surface mount package chips |
| 04/21/2011 | US20110089556 Leadframe packages having enhanced ground-bond reliability |
| 04/21/2011 | US20110089555 Area reduction for surface mount package chips |
| 04/21/2011 | US20110089554 Integrated circuit packaging system with cavity and method of manufacture thereof |
| 04/21/2011 | US20110089553 Stack-type solid-state drive |
| 04/21/2011 | US20110089551 Semiconductor device with double-sided electrode structure and its manufacturing method |
| 04/21/2011 | US20110089550 Production device, production method, test apparatus and integrated circuit package |
| 04/21/2011 | US20110089549 Semiconductor device |
| 04/21/2011 | US20110089548 Semiconductor device and manufacturing method thereof |
| 04/21/2011 | US20110089547 Methods and devices for manufacturing cantilever leads in a semiconductor package |
| 04/21/2011 | US20110089546 Multiple leadframe package |
| 04/21/2011 | US20110089545 Apparatus and method configured to lower thermal stresses |
| 04/21/2011 | US20110089544 Package, manufacturing method thereof, and semiconductor device |
| 04/21/2011 | US20110089543 Semiconductor device with a balun |
| 04/21/2011 | US20110089542 Area reduction for electrical diode chips |
| 04/21/2011 | US20110089541 Area reduction for electrical diode chips |
| 04/21/2011 | US20110089540 Semiconductor die with integrated electro-static discharge device |
| 04/21/2011 | US20110089539 Packaged microelectronic imagers and methods of packaging microelectronic imagers |
| 04/21/2011 | US20110089535 Electrostatic Discharge Protection Device |
| 04/21/2011 | US20110089529 Open Cavity Leadless Surface Mountable Package for High Power RF Applications |
| 04/21/2011 | US20110089528 Semiconductor having optimized insulation structure and process for producing the semiconductor |
| 04/21/2011 | US20110089522 Semiconductor device and method of manufacturing the same |
| 04/21/2011 | US20110089519 Chip Lead Frame and Photoelectric Energy Transducing Module |
| 04/21/2011 | US20110089494 Semiconductor device having fuse and protection circuit |
| 04/21/2011 | US20110089472 Integrated mos sensor having temperature sensor |
| 04/21/2011 | US20110089465 Semiconductor chip assembly with post/base heat spreader with esd protection layer |
| 04/21/2011 | US20110089439 Integrated cmos porous sensor |
| 04/21/2011 | US20110089427 Securities, chip mounting product, and manufacturing method thereof |
| 04/21/2011 | US20110089423 Thin film transistor array panel |
| 04/21/2011 | US20110089088 Method for sorting integrated circuit devices |
| 04/21/2011 | DE202010005878U1 Beleuchtungssystem Lighting system |
| 04/21/2011 | DE19937671B4 Luftgekühlte Stromrichter-Brückenschaltung Air-cooled converter bridge circuit |