| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/27/2011 | CN102034799A Chip package and fabrication method thereof |
| 04/27/2011 | CN102034797A Impedance optimized chip system |
| 04/27/2011 | CN102034796A Chip package and fabrication method thereof |
| 04/27/2011 | CN102034795A Configuration structures of characteristic dimension bar and metal layer identifications |
| 04/27/2011 | CN102034794A Test structure and method for testing semiconductor substrate |
| 04/27/2011 | CN102034793A Relay board and semiconductor device having the relay board |
| 04/27/2011 | CN102034792A Semiconductor device with one-side-contact and method for fabricating the same |
| 04/27/2011 | CN102034791A Semiconductor integrated circuit device and method for manufacturing the same |
| 04/27/2011 | CN102034790A Electric fuse structure and manufacturing method thereof |
| 04/27/2011 | CN102034789A Semiconductor device, method for fabricating a semiconductor device and lead frame, comprising a bent contact section |
| 04/27/2011 | CN102034788A Substrate with built-in semiconductor element and method for manufacturing the same |
| 04/27/2011 | CN102034787A Metal wiring structure comprising electroless nickel plating layer and method of fabricating the same |
| 04/27/2011 | CN102034786A Printed circuit board, stud grid array package and manufacturing method thereof |
| 04/27/2011 | CN102034785A Improved triode lead frame |
| 04/27/2011 | CN102034784A 28K lead frame |
| 04/27/2011 | CN102034783A Seven-pin lead frame |
| 04/27/2011 | CN102034782A Mixed alloy lead frame used for power semiconductors |
| 04/27/2011 | CN102034781A Semiconductor package for printing bonding material on lead frame and wafer and manufacturing method thereof |
| 04/27/2011 | CN102034780A Integrated circuit chip and method of manufacturing the same and flip chip package having the integrated chip and method of manufacturing the same |
| 04/27/2011 | CN102034779A Chip design with robust corner bumps |
| 04/27/2011 | CN102034778A Chip package and fabrication method thereof |
| 04/27/2011 | CN102034777A Semiconductor flip chip package |
| 04/27/2011 | CN102034776A Power semiconductor device with bonding connection between bonding wire and semiconductor chip |
| 04/27/2011 | CN102034775A Semiconductor package with sectioned bonding wire scheme |
| 04/27/2011 | CN102034774A A power-electronic arrangement |
| 04/27/2011 | CN102034773A Configurational tree-shaped heat pipe radiator |
| 04/27/2011 | CN102034772A Diamond-bottom semiconductor device and relevant method thereof |
| 04/27/2011 | CN102034771A Heat sink systems and devices |
| 04/27/2011 | CN102034770A Package board and method for manufacturing thereof |
| 04/27/2011 | CN102034769A 电路基板以及半导体模块 A circuit board and a semiconductor module |
| 04/27/2011 | CN102034768A Embedded-dice-inside type substrate structure with redistribution layer covered on both side and method thereof |
| 04/27/2011 | CN102034767A Mounting circuit substrate |
| 04/27/2011 | CN102034766A Electronic device |
| 04/27/2011 | CN102034765A Mounting structure, electro-optical apparatus, and touch panel |
| 04/27/2011 | CN102034764A Substrate with self-stripping function and method for stripping epitaxial layer |
| 04/27/2011 | CN102034759A Semiconductor device with buried bit lines and fabrication method thereof |
| 04/27/2011 | CN102034750A Array substrate and manufacturing method thereof |
| 04/27/2011 | CN102034749A Array substrate and manufacturing method thereof |
| 04/27/2011 | CN102034748A Integrated circuit device and preparation method thereof |
| 04/27/2011 | CN102034744A Semiconductor device and method for manufacturing semiconductor device |
| 04/27/2011 | CN102034741A Method of manufacturing a semiconductor component and structure |
| 04/27/2011 | CN102034740A Semiconductor device and method for fabricating the same |
| 04/27/2011 | CN102034733A Interconnecting structure and forming method thereof |
| 04/27/2011 | CN102034721A Method for encapsulating chip |
| 04/27/2011 | CN102034718A Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP |
| 04/27/2011 | CN102034688A Method of protecting an integrated circuit chip against spying by laser attacks |
| 04/27/2011 | CN102033423A Device and method for calibrating photoetching tool |
| 04/27/2011 | CN102033371A Array substrate and manufacturing method thereof |
| 04/27/2011 | CN102033370A Liquid crystal display substrate and manufacturing method thereof |
| 04/27/2011 | CN102031546A Electroplating method for lead frame |
| 04/27/2011 | CN102031081A Liquid epoxy encapsulating material and preparation method thereof |
| 04/27/2011 | CN102030968A Epoxy resin composition for encapsulating semiconductor device and preparation method thereof |
| 04/27/2011 | CN102030565A Ceramic wiring board and method of manufacturing thereof |
| 04/27/2011 | CN102030471A Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof |
| 04/27/2011 | CN101661909B Thermosetting die-bonding film |
| 04/27/2011 | CN101651127B Semiconductor device |
| 04/27/2011 | CN101606235B Modifier for low dielectric constant film, and method for production thereof |
| 04/27/2011 | CN101569010B Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| 04/27/2011 | CN101556947B Basal plate for reducing warpage degree and chip packaging structure provided with same |
| 04/27/2011 | CN101556944B Structure and process for the formation of through-silicon-via |
| 04/27/2011 | CN101447491B Thin film transistor array panel |
| 04/27/2011 | CN101419951B Heat radiating device used for semiconductor power module |
| 04/27/2011 | CN101339934B Semiconductor device with welded leads and method of manufacturing the same |
| 04/27/2011 | CN101316498B Heat sink assembly and electronic device using the same |
| 04/27/2011 | CN101299407B Process monitor |
| 04/27/2011 | CN101208796B Heat sink for power module |
| 04/27/2011 | CN101195700B Light emitting diode frame body component and manufacturing method thereof |
| 04/27/2011 | CN101097916B Electrostatic discharge protection device |
| 04/26/2011 | US7933126 Solid state relay with internal heat sink |
| 04/26/2011 | US7932828 Space charge dosimeters for extremely low power measurements of radiation in shipping containers |
| 04/26/2011 | US7932617 Semiconductor package and manufacturing method thereof and encapsulating method thereof |
| 04/26/2011 | US7932616 Semiconductor device sealed in a resin section and method for manufacturing the same |
| 04/26/2011 | US7932615 Electronic devices including solder bumps on compliant dielectric layers |
| 04/26/2011 | US7932614 Method of thinning a semiconductor substrate |
| 04/26/2011 | US7932613 Interconnect structure for a semiconductor device |
| 04/26/2011 | US7932612 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 04/26/2011 | US7932611 Device for alternately contacting two wafers |
| 04/26/2011 | US7932610 Semiconductor integrated circuit having improved power supply wiring |
| 04/26/2011 | US7932609 Semiconductor device having groove-shaped via-hole |
| 04/26/2011 | US7932608 Through-silicon via formed with a post passivation interconnect structure |
| 04/26/2011 | US7932607 Composite conductive film and semiconductor package using such film |
| 04/26/2011 | US7932606 Semiconductor device and a method of manufacturing the same |
| 04/26/2011 | US7932605 Semiconductor device and manufacturing method therefor |
| 04/26/2011 | US7932604 Configuration for multi-layer ball grid array |
| 04/26/2011 | US7932603 Chip structure and process for forming the same |
| 04/26/2011 | US7932602 Metal sealed wafer level CSP |
| 04/26/2011 | US7932601 Enhanced copper posts for wafer level chip scale packaging |
| 04/26/2011 | US7932600 Electrical connecting structure and bonding structure |
| 04/26/2011 | US7932599 Semiconductor component of semiconductor chip size with flip-chip-like external contacts |
| 04/26/2011 | US7932598 Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink |
| 04/26/2011 | US7932597 Semiconductor device and manufacturing method thereof |
| 04/26/2011 | US7932596 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 04/26/2011 | US7932595 Electronic component package comprising fan-out traces |
| 04/26/2011 | US7932594 Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component |
| 04/26/2011 | US7932593 Multipackage module having stacked packages with asymmetrically arranged die and molding |
| 04/26/2011 | US7932591 Stacked semiconductor package having flexible circuit board therein |
| 04/26/2011 | US7932590 Stacked-die electronics package with planar and three-dimensional inductor elements |
| 04/26/2011 | US7932589 Semiconductor device and method for manufacturing the same |
| 04/26/2011 | US7932588 Semiconductor device including a DC-DC converter having a metal plate |
| 04/26/2011 | US7932587 Singulated semiconductor package |