| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/28/2011 | US20110095417 Leadless semiconductor device terminal |
| 04/28/2011 | US20110095416 Package for high power integrated circuits and method for forming |
| 04/28/2011 | US20110095415 Routing layer for mitigating stress in a semiconductor die |
| 04/28/2011 | US20110095414 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same |
| 04/28/2011 | US20110095413 Method and Apparatus for Semiconductor Device Fabrication Using a Reconstituted Wafer |
| 04/28/2011 | US20110095412 Semiconductor device |
| 04/28/2011 | US20110095411 Wirebond-less Semiconductor Package |
| 04/28/2011 | US20110095410 Wafer level semiconductor device connector |
| 04/28/2011 | US20110095409 Method of Attaching an Interconnection Plate to a Semiconductor Die within a Leadframe Package |
| 04/28/2011 | US20110095408 Microelectronic assembly with impedance controlled wirebond and conductive reference element |
| 04/28/2011 | US20110095407 Stackable semiconductor assemblies and methods of manufacturing such assemblies |
| 04/28/2011 | US20110095406 Technology of reducing radiation noise of semiconductor device |
| 04/28/2011 | US20110095405 Lead frame and intermediate product of semiconductor device |
| 04/28/2011 | US20110095404 Semiconductor device and method of manufacturing the same |
| 04/28/2011 | US20110095403 Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded through the Die TSV |
| 04/28/2011 | US20110095373 Semiconductor chip, stack module, and memory card |
| 04/28/2011 | US20110095364 Semiconductor device and method |
| 04/28/2011 | US20110095349 Semiconductor device and method of manufacturing same |
| 04/28/2011 | US20110095289 Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package |
| 04/28/2011 | US20110094723 Combination of fastener and thermal-conducting member |
| 04/28/2011 | US20110094714 Data center cooling |
| 04/28/2011 | DE102010047609A1 Multichipmodul Multi-chip module |
| 04/28/2011 | DE102010045325A1 ESD-Schutzschaltung ESD protection circuit |
| 04/28/2011 | DE102010042979A1 Array aus skalierbaren keramischen Diodenträgern mit LED's Scalable array of diodes ceramic carriers with LED's |
| 04/28/2011 | DE102010042691A1 Halbleitervorrichtung Semiconductor device |
| 04/28/2011 | DE102010037941A1 Verfahren und Vorrichtung zur Halbleiterbauelementfabrikation unter Verwendung eines rekonstituierten Wafer Method and apparatus for semiconductor device fabrication using a reconstituted wafer |
| 04/28/2011 | DE102009045948A1 Method for producing application-specific integrated circuit of layer composite, involves applying conductive material by ink jet printing process or dispensation such that material continuously passes from contact points up to substrate |
| 04/28/2011 | DE102009045184A1 Bondverbindung zwischen einem Bonddraht und einem Leistungshalbleiterchip Bond between a bonding wire and a power semiconductor chip |
| 04/28/2011 | DE102009031111B4 Kontaktoptimierung zur Verbesserung der Verspannungsübertragung in dicht liegenden Transistoren Contact optimization to improve the stress transfer in closely spaced transistors |
| 04/28/2011 | DE102008049673B4 Schaltungsanordnung mit einem Leistungshalbleitermodul und einer außerhalb dessen angeordneten Steuerschaltung Circuit arrangement with a power semiconductor module, and a control circuit arranged outside of which |
| 04/28/2011 | DE102007056952B4 Vorrichtung und Verfahren zur Montage eines Kühlkörpers Device and method for mounting a heat sink |
| 04/28/2011 | DE102006048625B4 Halbleiterbauelement Semiconductor device |
| 04/28/2011 | DE102004025279B4 Anlage für ein Bestücken von Substraten mit Kugelkontakten und Verfahren zum Bestücken von Substraten mit Kugelkontakten System for a loading substrates with ball contacts, and method for loading substrates with ball contacts |
| 04/28/2011 | CA2778319A1 Method of embedding material in a glass substrate |
| 04/27/2011 | EP2315508A1 Collective ceramic substrate, manufacturing method for the substrate, ceramic substrate, and ceramic circuit substrate |
| 04/27/2011 | EP2315347A1 Semiconductor device and power converter using the semiconductor device |
| 04/27/2011 | EP2315255A1 Surge protection device |
| 04/27/2011 | EP2315245A1 Power semiconductor module with a substrate having a three dimensional surface contour and method for producing same |
| 04/27/2011 | EP2315244A1 Liquid-cooled-type cooling device |
| 04/27/2011 | EP2315243A1 Interposer between integrated circuits |
| 04/27/2011 | EP2315242A1 Circuit arrangement and manufacturing method thereof |
| 04/27/2011 | EP2313924A1 Grounding system and apparatus |
| 04/27/2011 | EP2313921A1 Metal wiring structure for integration with through substrate vias |
| 04/27/2011 | EP2313920A1 Concentric vias in electronic substrate |
| 04/27/2011 | EP2313919A1 Through wafer via and method of making same |
| 04/27/2011 | EP2313452A1 Thermosetting composition |
| 04/27/2011 | EP2070017B1 Method of connecting an antenna to a transponder chip and corresponding transponder inlay |
| 04/27/2011 | EP1977476B1 Attachment of deep drawn resonator shell |
| 04/27/2011 | EP1834355B1 Cooling device for cooling a semiconductor component, in particular, an optoelectronic semiconductor component |
| 04/27/2011 | EP1751799B1 Metal interconnects for image sensors |
| 04/27/2011 | EP1680949B1 Method for producing a solder stop barrier |
| 04/27/2011 | EP1636840B1 Micro lead frame substrate and method for its manufacture |
| 04/27/2011 | EP1630128B1 Process for producing a carbon nanotube device |
| 04/27/2011 | CN201813319U Dual-grain rectifier |
| 04/27/2011 | CN201812821U Tellurium-cadmium-mercury long wave infrared photoconductivity detector with electrodes led out from back |
| 04/27/2011 | CN201812820U Compound device of integrated circuit pad and static discharge protective device |
| 04/27/2011 | CN201812819U Schottky dual-cell chip |
| 04/27/2011 | CN201812818U Chip bipolar Schottky diode |
| 04/27/2011 | CN201812817U Adapter substrate of integrated circuit package |
| 04/27/2011 | CN201812816U Ceramic packaging base |
| 04/27/2011 | CN201812815U Rectifier for preventing crystal grains from drifting |
| 04/27/2011 | CN201812814U Rectifier for preventing diode chip from drifting |
| 04/27/2011 | CN201812813U Heat dissipating plate for semiconductor |
| 04/27/2011 | CN201812812U Air-jet impacting cold plate with flow burbling columns |
| 04/27/2011 | CN201812811U Temperature equalizing plate |
| 04/27/2011 | CN201812810U Heat radiation device of electric unit |
| 04/27/2011 | CN201812809U Bottom plate of fast recovery diode module |
| 04/27/2011 | CN201812808U Ceramic packaging base with boss |
| 04/27/2011 | CN201812807U Fast recovery diode module |
| 04/27/2011 | CN201812100U Night-vision safety goggles |
| 04/27/2011 | CN1998079B Module integration integrated circuits |
| 04/27/2011 | CN1930681B Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel |
| 04/27/2011 | CN1926685B Light-emitting diode arrangement, and method for producing a light-emitting diode arrangement |
| 04/27/2011 | CN1898150B Method for containing a device and a corresponding device |
| 04/27/2011 | CN1540692B 镀覆接线端 Plated terminals |
| 04/27/2011 | CN102037798A Heat radiation sheet and heat radiation device |
| 04/27/2011 | CN102037560A Method for making microstructures by converting porous silicon into porous metal or ceramics |
| 04/27/2011 | CN102037370A Method for manufacturing and testing an integrated electronic circuit |
| 04/27/2011 | CN102037306A Vapor vortex heat sink |
| 04/27/2011 | CN102036536A Cooling device |
| 04/27/2011 | CN102036534A Device with heat dissipation element and manufacturing method thereof |
| 04/27/2011 | CN102036531A Necking cover-shaped assembling frame for radiator |
| 04/27/2011 | CN102036467A System and method for reduced thermal resistance between a power electronics printed circuit board and a base plate |
| 04/27/2011 | CN102035194A Electrostatic discharge protection system |
| 04/27/2011 | CN102034864A MOS (metal oxide semiconductor) transistor and preparation method thereof |
| 04/27/2011 | CN102034847A Self-luminous flat-panel display and alignment system for assembling same |
| 04/27/2011 | CN102034834A Semiconductor device, electronic apparatus, and manufacturing methods thereof |
| 04/27/2011 | CN102034830A Memorizer with disabling circuit and method for disabling memorizer |
| 04/27/2011 | CN102034827A Nonvolatile memory and arrangement thereof |
| 04/27/2011 | CN102034823A Layout and bonding pad floor planning for power transistor with favorable SPU (Short-to-Plus Unpowered) and STOG (Short-to-Open circuit Grounded) performance |
| 04/27/2011 | CN102034821A Metal oxide half-field effect transistor layout structure and method |
| 04/27/2011 | CN102034816A Plasma induced damage test device and method for producing test device |
| 04/27/2011 | CN102034810A Array base plate and manufacturing method thereof |
| 04/27/2011 | CN102034809A ESD (Electrostatic Discharge) protective circuit |
| 04/27/2011 | CN102034808A ESD (Electronic Static Discharge) protection device |
| 04/27/2011 | CN102034807A Method and device for protecting grid electrode |
| 04/27/2011 | CN102034806A Electrostatic-discharge protecting device and electrostatic-discharge protecting element therein |
| 04/27/2011 | CN102034805A Package integrating thermoelectric component with chip |
| 04/27/2011 | CN102034803A Semiconductor apparatus and control method of the same |
| 04/27/2011 | CN102034801A Semiconductor package structure |