Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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05/04/2011 | CN101246874B Structure for interconnection and manufacture method |
05/04/2011 | CN101227811B Vacuum super thermal conduction heat radiator |
05/04/2011 | CN101218724B High current electrical switch and method |
05/04/2011 | CN101179920B Apparatus and method for cooling heat-generating device |
05/04/2011 | CN101159251B Microelectronic cooling assemblies and its manufacture method, and microelectronic cooling system |
05/04/2011 | CN101047148B Manufacturing method of semiconductor device corresponding to loop back test |
05/04/2011 | CN101001515B Plate radiating pipe and manufacturing method thereof |
05/03/2011 | USRE42318 Semiconductor module with serial bus connection to multiple dies |
05/03/2011 | US7937105 Semiconductor device and electronic device |
05/03/2011 | US7936563 On-chip interconnect-stack cooling using sacrificial interconnect segments |
05/03/2011 | US7936270 Space charge dosimeters for extremely low power measurements of radiation in shipping containers |
05/03/2011 | US7936075 Semiconductor device and semiconductor device manufacturing method |
05/03/2011 | US7936074 Programmable system in package |
05/03/2011 | US7936073 Semiconductor device and method of manufacturing the same |
05/03/2011 | US7936072 Semiconductor device having dual damascene structure |
05/03/2011 | US7936071 Semiconductor device having a specified terminal layout pattern |
05/03/2011 | US7936070 Semiconductor device and method for fabricating semiconductor device |
05/03/2011 | US7936069 Semiconductor device with a line and method of fabrication thereof |
05/03/2011 | US7936068 Semiconductor device having an interconnect structure and a reinforcing insulating film |
05/03/2011 | US7936067 Backend interconnect scheme with middle dielectric layer having improved strength |
05/03/2011 | US7936065 Semiconductor devices and method of manufacturing them |
05/03/2011 | US7936063 Carrier assembly for an integrated circuit |
05/03/2011 | US7936062 Wafer level chip packaging |
05/03/2011 | US7936060 Reworkable electronic device assembly and method |
05/03/2011 | US7936059 Lead frame packaging technique with reduced noise and cross-talk |
05/03/2011 | US7936058 Stacked package and method for forming stacked package |
05/03/2011 | US7936057 High bandwidth package |
05/03/2011 | US7936056 Airtight package comprising a pressure adjustment unit |
05/03/2011 | US7936055 Integrated circuit package system with interlock |
05/03/2011 | US7936054 Multi-chip package |
05/03/2011 | US7936053 Integrated circuit package system with lead structures including a dummy tie bar |
05/03/2011 | US7936048 Power transistor and power semiconductor device |
05/03/2011 | US7936045 Integrated circuit with multi-stage matching circuit |
05/03/2011 | US7936030 Methods of operating semiconductor memory devices including magnetic films having electrochemical potential difference therebetween |
05/03/2011 | US7936023 High voltage diode |
05/03/2011 | US7936020 Dual-directional electrostatic discharge protection device |
05/03/2011 | US7935998 Self-aligned body contact for a semiconductor-on-insulator trench device and method of fabricating same |
05/03/2011 | US7935991 Semiconductor components with conductive interconnects |
05/03/2011 | US7935965 Test structures and methods for electrical characterization of alignment of line patterns defined with double patterning |
05/03/2011 | US7935953 Nonvolatile memory device, array of nonvolatile memory devices, and methods of making the same |
05/03/2011 | US7935899 Circuit device and method of manufacturing the same |
05/03/2011 | US7935627 Forming low dielectric constant dielectric materials |
05/03/2011 | US7935623 Semiconductor device and method for fabricating the same |
05/03/2011 | US7935622 Support with solder ball elements and a method for populating substrates with solder balls |
05/03/2011 | US7935616 Dynamic p-n junction growth |
05/03/2011 | US7935572 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
05/03/2011 | US7935569 Components, methods and assemblies for stacked packages |
05/03/2011 | US7935561 Method of forming shielded gate FET with self-aligned features |
05/03/2011 | US7935430 Bonding structure of substrate and component and method of manufacturing the same |
05/03/2011 | US7935408 Substrate anchor structure and method |
05/03/2011 | CA2580031C System and method for assembling components in an electronic device |
04/28/2011 | WO2011050132A1 Improved microelectronic thermal interface |
04/28/2011 | WO2011050073A1 Self-aligned barrier and capping layers for interconnects |
04/28/2011 | WO2011049963A2 Method of embedding material in a glass substrate |
04/28/2011 | WO2011049959A2 Methods and devices for manufacturing cantilever leads in a semiconductor package |
04/28/2011 | WO2011049764A2 Leadframe packages having enhanced ground-bond reliability |
04/28/2011 | WO2011049710A2 Stacked semiconductor device |
04/28/2011 | WO2011049585A1 Esd/antenna diodes for through-silicon vias |
04/28/2011 | WO2011049479A1 Composite material having high thermal conductivity and process of fabricating same |
04/28/2011 | WO2011049128A1 Semiconductor device and method for manufacturing semiconductor device |
04/28/2011 | WO2011049067A1 Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module |
04/28/2011 | WO2011048858A1 Device mounting structure and device mounting method |
04/28/2011 | WO2011048800A1 Semiconductor device and process for production thereof |
04/28/2011 | WO2011048765A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device, and release agent |
04/28/2011 | WO2011048580A1 Surge protection device |
04/28/2011 | WO2011047792A1 Method for producing vias |
04/28/2011 | WO2011047479A1 A routing layer for mitigating stress in a semiconductor die |
04/28/2011 | WO2011047470A1 Reconfiguring through silicon vias in stacked multi-die packages |
04/28/2011 | WO2011028348A3 Die location compensation |
04/28/2011 | WO2011014434A3 Bond and probe pad distribution and package architecture |
04/28/2011 | US20110098937 Integrated mos wireless sensor |
04/28/2011 | US20110097848 Method for Connecting a Die Assembly to a Substrate in an Integrated Circuit and a Semiconductor Device Comprising a Die Assembly |
04/28/2011 | US20110097826 Device and method for detecting stress migration properties |
04/28/2011 | US20110097609 Method and apparatus for integrated-circuit battery devices |
04/28/2011 | US20110097478 Scalable lead zirconium titanate (pzt) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
04/28/2011 | US20110096604 Semiconductor memory device including alternately arranged contact members |
04/28/2011 | US20110095441 Microelectronic assemblies having compliant layers |
04/28/2011 | US20110095440 Semiconductor package including flip chip controller at bottom of die stack |
04/28/2011 | US20110095439 Integrated circuit package system with through semiconductor vias and method of manufacture thereof |
04/28/2011 | US20110095438 Methods and apparatus for layout of three dimensional matrix array memory for reduced cost patterning |
04/28/2011 | US20110095437 Interface plate between integrated circuits |
04/28/2011 | US20110095436 Through silicon via with dummy structure and method for forming the same |
04/28/2011 | US20110095435 Coaxial through-silicon via |
04/28/2011 | US20110095434 Apparatus and methods of forming memory lines and structures using double sidewall patterning for four times half pitch relief patterning |
04/28/2011 | US20110095433 Conductive film, method of manufacturing the same, semiconductor device and method of manufacturing the same |
04/28/2011 | US20110095432 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument |
04/28/2011 | US20110095431 Thermo-compression bonded electrical interconnect structure |
04/28/2011 | US20110095430 Semiconductor device |
04/28/2011 | US20110095429 Methods for fabricating and filling conductive vias and conductive vias so formed |
04/28/2011 | US20110095428 Small area, robust silicon via structure and process |
04/28/2011 | US20110095427 Low-resistance interconnects and methods of making same |
04/28/2011 | US20110095426 Hybrid Package |
04/28/2011 | US20110095425 Ball grid array substrate, semiconductor chip package and method of manufacturing the same |
04/28/2011 | US20110095424 Semiconductor package structure |
04/28/2011 | US20110095423 Semiconductor device mounted structure and its manufacturing method |
04/28/2011 | US20110095422 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
04/28/2011 | US20110095421 Flip chip package and method of manufacturing the same |
04/28/2011 | US20110095420 Semiconductor device and method of manufacturing semiconductor device |
04/28/2011 | US20110095419 Conductive film, method of manufacturing the same, semiconductor device and method of manufacturing the same |
04/28/2011 | US20110095418 Semiconductor package and method for fabricating the same |