| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/04/2011 | CN102047411A Semiconductor device and method for manufacturing the same |
| 05/04/2011 | CN102047403A Electronic device and method of manufacturing an electronic device |
| 05/04/2011 | CN102047402A Method for manufacturing an electronic device |
| 05/04/2011 | CN102047398A Bonded structure and bonding method for bonded structure |
| 05/04/2011 | CN102047395A Method of producing silylated porous insulating film, method of producing semiconductor device, and silylated material |
| 05/04/2011 | CN102046700A Fixing material comprising silane compound polymer and photonic device sealed body |
| 05/04/2011 | CN102046690A Optical semiconductor sealing resin composition and optical semiconductor device using same |
| 05/04/2011 | CN102046548A Semiconductor encapsulation material and method for encapsulating semiconductor using the same |
| 05/04/2011 | CN102046528A Graphite complex and manufacturing method thereof |
| 05/04/2011 | CN102045990A Radiating device |
| 05/04/2011 | CN102045989A Heat pipe radiating module |
| 05/04/2011 | CN102045988A Radiating device |
| 05/04/2011 | CN102045983A Radiating module and manufacturing method thereof |
| 05/04/2011 | CN102045939A Metal layer structure of flexible multilayer base plate and preparation method thereof |
| 05/04/2011 | CN102044769A Chip on board (COB) storage device |
| 05/04/2011 | CN102044549A Solid state image capture device and method for manufacturing same |
| 05/04/2011 | CN102044540A Semiconductor element and operating method thereof |
| 05/04/2011 | CN102044539A Semiconductor chip, seal ring structure and manufacturing method thereof |
| 05/04/2011 | CN102044538A Semiconductor chip, seal ring structure and manufacturing method thereof |
| 05/04/2011 | CN102044536A Photoelectric energy conversion device |
| 05/04/2011 | CN102044533A Multichip package and method of manufacturing the same |
| 05/04/2011 | CN102044532A Wireless communication module and manufacturing method thereof |
| 05/04/2011 | CN102044531A Apparatus and method for vertically-structured passive components |
| 05/04/2011 | CN102044530A System packaging structure and manufacture method thereof |
| 05/04/2011 | CN102044528A Stacked packaging member and manufacturing method thereof |
| 05/04/2011 | CN102044527A Overlapped packaging structure and manufacturing method thereof |
| 05/04/2011 | CN102044526A Electromigration monitoring structure |
| 05/04/2011 | CN102044525A Low-K dielectric layer structure, semiconductor device structure and formation method thereof |
| 05/04/2011 | CN102044524A Interconnecting structure and forming method thereof |
| 05/04/2011 | CN102044523A Semiconductor device structure and manufacturing method thereof |
| 05/04/2011 | CN102044522A Multi-chip stacking structure |
| 05/04/2011 | CN102044521A Semiconductor component with through guide hole, manufacturing method of semiconductor component and packaging structure of semiconductor component with through guide hole |
| 05/04/2011 | CN102044520A Package carrier plate, package structure and manufacturing process of package carrier plate |
| 05/04/2011 | CN102044519A Packaging structure and packaging substrate thereof |
| 05/04/2011 | CN102044518A Low temperature co-fired ceramic substrate structure |
| 05/04/2011 | CN102044517A Super-high-power IC chip package and production method thereof |
| 05/04/2011 | CN102044516A Chip lead rack and photoelectric energy conversion module |
| 05/04/2011 | CN102044515A Package carrier, package structure, and process for fabricating same |
| 05/04/2011 | CN102044514A Chip lead bonding region and semiconductor device using same |
| 05/04/2011 | CN102044513A Semiconductor component |
| 05/04/2011 | CN102044512A Integrated circuit and multi-chip module stacked in three dimensions |
| 05/04/2011 | CN102044511A Semiconductor chip packaging structure and semiconductor chip |
| 05/04/2011 | CN102044510A Chip packaging body |
| 05/04/2011 | CN102044509A Package structure with embedded inner pins, chip, inverted locking hole, radiating block, convex column and external radiator |
| 05/04/2011 | CN102044508A Package structure with resin printed circuit board (PCB), chip, upright locking hole, radiating block, convex column and external radiator |
| 05/04/2011 | CN102044507A Printed circuit board chip flip external radiator packaging structure |
| 05/04/2011 | CN102044506A Package structure with embedded inner pins, chip, inverted radiating block and external radiator |
| 05/04/2011 | CN102044505A Packaging structure with exposed inner pin, inverted chip and cooling block |
| 05/04/2011 | CN102044504A Radiating block packaging structure with inside pin embedded in chip upside-down mounting band |
| 05/04/2011 | CN102044503A Packaging structure with printed circuit board, chip and upright heat dissipation block with locking hole |
| 05/04/2011 | CN102044502A Substrate and packaging structure using the same |
| 05/04/2011 | CN102044501A 集成电路结构 Integrated circuit structure |
| 05/04/2011 | CN102044500A Chip carrier plate as well as encapsulating structure and method thereof |
| 05/04/2011 | CN102044488A Dual-damascene structure and production method thereof |
| 05/04/2011 | CN102044487A Tungsten dual-damascene process |
| 05/04/2011 | CN102044475A Interconnecting structure and forming method thereof |
| 05/04/2011 | CN102044471A Interconnecting structure and forming method thereof |
| 05/04/2011 | CN102044457A Method for manufacturing metal bonding pad and corresponding metal bonding pad structure |
| 05/04/2011 | CN102044456A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
| 05/04/2011 | CN102044455A Salient point and forming method thereof |
| 05/04/2011 | CN102044454A Salient point and formation method thereof |
| 05/04/2011 | CN102044452A Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof |
| 05/04/2011 | CN102044449A Semiconductor package and method of manufacturing the same |
| 05/04/2011 | CN102044447A Packaging technology and packaging structure |
| 05/04/2011 | CN102044427A Forming method of copper interconnecting wire and electroplating device |
| 05/04/2011 | CN102044414A Semiconductor structure and manufacturing method thereof |
| 05/04/2011 | CN102042574A Improved heat dissipation structure of LED lamp |
| 05/04/2011 | CN102042509A Heat radiator and application thereof in high-power LED (Light Emitting Diode) lamp |
| 05/04/2011 | CN102042507A Light-emitting diode (LED) residential lamp adopting cooling fin and heat pipe for heat conduction |
| 05/04/2011 | CN101789413B Mixed small-channel cooler |
| 05/04/2011 | CN101728347B Package structure and manufacture method thereof |
| 05/04/2011 | CN101675515B Circuit and method for interconnecting stacked integrated circuit dies |
| 05/04/2011 | CN101667578B Novel integrated circuit resisting NMOS element total dose radiation |
| 05/04/2011 | CN101587890B Layout method of static discharge protective structure |
| 05/04/2011 | CN101584041B 半导体装置 Semiconductor device |
| 05/04/2011 | CN101577267B 芯片封装结构 Chip package structure |
| 05/04/2011 | CN101566284B LED lamp tube |
| 05/04/2011 | CN101556122B Heat dissipating device and heat transferring element thereof |
| 05/04/2011 | CN101552253B Array package substrate |
| 05/04/2011 | CN101515589B Pixel structure, display panel, optoelectronic device and method for forming same |
| 05/04/2011 | CN101499456B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 05/04/2011 | CN101471334B Light-emitting device and manufacturing method thereof |
| 05/04/2011 | CN101459165B Electronic component wafer module, manufacturing method thereof and electronic information device |
| 05/04/2011 | CN101447482B Calibration technique for measuring gate resistance of power mos gate device at wafer level |
| 05/04/2011 | CN101442046B Dynamic detection electrostatic protection circuit structure |
| 05/04/2011 | CN101438404B Manufacturing reliable vias contact for inteconnection application |
| 05/04/2011 | CN101431068B 半导体封装模块 The semiconductor package module |
| 05/04/2011 | CN101429324B Encapsulating epoxy resin composition, and electronic parts device using the same |
| 05/04/2011 | CN101414591B Island-shaped loading plate and preparation method thereof |
| 05/04/2011 | CN101383295B Process for producing optical semiconductor device and slice used in same process |
| 05/04/2011 | CN101375391B Multiple chip module and package stacking method for storage devices |
| 05/04/2011 | CN101369579B Method for manufacturing active matrix substrate and film element |
| 05/04/2011 | CN101359652B Coil type chip encapsulation construction |
| 05/04/2011 | CN101325186B Insulating sheet and method for producing it, and power module comprising the insulating sheet |
| 05/04/2011 | CN101322243B Magnetic self-assembly for integrated circuit packages |
| 05/04/2011 | CN101310038B Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film |
| 05/04/2011 | CN101276809B Semiconductor device and method of manufacturing the same |
| 05/04/2011 | CN101276796B Carbon nanotube-reinforced solder caps, methods of assembling same and chip packages and systems containing same |
| 05/04/2011 | CN101275734B High-power LED heat radiating device |
| 05/04/2011 | CN101262739B Substrate for carrying element, method for manufacturing the same, and semiconductor module |