Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2014
11/06/2014US20140327151 Through substrate via structures and methods of forming the same
11/06/2014US20140327150 Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
11/06/2014US20140327149 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
11/06/2014US20140327148 Chip on film package including distributed via plugs
11/06/2014US20140327147 Semiconductor device and method for fabricating the same
11/06/2014US20140327146 Methods for improving double patterning route efficiency
11/06/2014US20140327145 Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
11/06/2014US20140327144 Complex Semiconductor Packages and Methods of Fabricating the Same
11/06/2014US20140327143 Semiconductor device having groove-shaped via-hole
11/06/2014US20140327141 Copper interconnect structure and method for forming the same
11/06/2014US20140327140 Integrated circuits and methods for fabricating integrated circuits with improved contact structures
11/06/2014US20140327139 Contact liner and methods of fabrication thereof
11/06/2014US20140327138 Semiconductor device
11/06/2014US20140327137 Semiconductor device and method of manufacturing the same
11/06/2014US20140327136 Semiconductor device having under-bump metallization (ubm) structure and method of forming the same
11/06/2014US20140327135 Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces
11/06/2014US20140327134 Metal bump structure for use in driver ic and method for forming the same
11/06/2014US20140327133 Metal bump structure for use in driver ic and method for forming the same
11/06/2014US20140327132 TSV Backside Reveal Structure and Exposing Process
11/06/2014US20140327131 Package structure and fabrication method thereof
11/06/2014US20140327130 Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
11/06/2014US20140327129 Package on package device and method of manufacturing the same
11/06/2014US20140327128 Cooling System for Molded Modules and Corresponding Manufacturing Methods
11/06/2014US20140327127 Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
11/06/2014US20140327126 Cooling integrated circuit packages from below
11/06/2014US20140327125 Semiconductor package structure and fabrication method thereof
11/06/2014US20140327124 Power transistor with heat dissipation and method therefore
11/06/2014US20140327123 Packaged ic having printed dielectric adhesive on die pad
11/06/2014US20140327122 Micro lead frame structure having reinforcing portions and method
11/06/2014US20140327121 Semiconductor Device and Method for Manufacturing Same
11/06/2014US20140327120 Differential excitation of ports to control chip-mode mediated crosstalk
11/06/2014US20140327119 Integrated circuit having shielding structure
11/06/2014US20140327115 Multiple seal-ring structure for the design, fabrication, and packaging of integrated circuits
11/06/2014US20140327113 3d integrated heterostructures having low-temperature bonded interfaces with high bonding energy
11/06/2014US20140327108 Noise cancellation for a magnetically coupled communication link utilizing a lead frame
11/06/2014US20140327105 Electrostatic discharge diode
11/06/2014US20140327077 Semiconductor-on-Insulator Integrated Circuit with Reduced Off-State Capacitance
11/06/2014US20140327071 Method of Manufacturing a Semiconductor Device
11/06/2014US20140327050 Standard cell having cell height being non-integral multiple of nominal minimum pitch
11/06/2014US20140327049 Methods of manufacturing the gallium nitride based semiconductor devices
11/06/2014US20140327018 Power semiconductor device, method of manufacturing the device and bonding wire
11/06/2014US20140327014 III-Nitride Rectifier Package
11/06/2014US20140327005 Apparatus and Methods for De-Embedding Through Substrate Vias
11/06/2014US20140326856 Integrated circuit stack with low profile contacts
11/06/2014US20140326778 Ultrasonic wire bonding wedge with multiple bonding wire slots
11/06/2014US20140326490 Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part
11/06/2014US20140326488 Microelectronic devices and microelectronic support devices, and associated assemblies and methods
11/04/2014USRE45232 Method of forming a contact plug for a semiconductor device
11/04/2014US8881087 Power routing with integrated decoupling capacitance
11/04/2014US8881086 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
11/04/2014US8881083 Methods for improving double patterning route efficiency
11/04/2014US8880165 Biocompatible bonding method and electronics package suitable for implantation
11/04/2014US8880137 Analyte monitoring device and methods of use
11/04/2014US8879261 Heat-dissipating device for electronic apparatus
11/04/2014US8879260 Heat transfer system
11/04/2014US8879259 Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle
11/04/2014US8879258 Liquid cooling system for modular electronic systems
11/04/2014US8879256 Electric power conversion apparatus
11/04/2014US8879254 Methods and apparatus for compact active cooling
11/04/2014US8879170 Condensing lens and lighting device equipped with said condensing lens
11/04/2014US8878551 Semiconductor integrated circuit device
11/04/2014US8878371 Semiconductor device
11/04/2014US8878370 Bond pad structure
11/04/2014US8878369 Low power/high speed TSV interface design
11/04/2014US8878368 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
11/04/2014US8878367 Substrate structure with through vias
11/04/2014US8878366 Contact pad
11/04/2014US8878365 Semiconductor device having a conductive layer reliably formed under an electrode pad
11/04/2014US8878364 Method for fabricating semiconductor device and semiconductor device
11/04/2014US8878363 Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same
11/04/2014US8878362 Copper interconnects having a titanium—titanium nitride assembly between copper and compound semiconductor
11/04/2014US8878361 Leadless package system having external contacts
11/04/2014US8878360 Stacked fan-out semiconductor chip
11/04/2014US8878359 Semiconductor device and method of forming insulating layer around semiconductor die
11/04/2014US8878358 Semiconductor device
11/04/2014US8878357 Electronic component device, method of manufacturing the same and wiring substrate
11/04/2014US8878356 Package structure having micro-electro-mechanical system element and method of fabrication the same
11/04/2014US8878355 Semiconductor bonding structure and process
11/04/2014US8878354 Method and apparatus for supplying power to a system on a chip (SOC)
11/04/2014US8878353 Structure for microelectronic packaging with bond elements to encapsulation surface
11/04/2014US8878351 Semiconductor device
11/04/2014US8878350 Semiconductor device having a buffer material and stiffener
11/04/2014US8878349 Semiconductor chip and stacked semiconductor package having the same
11/04/2014US8878348 Semiconductor device and method of assembling same
11/04/2014US8878347 Power module
11/04/2014US8878346 Molded SiP package with reinforced solder columns
11/04/2014US8878339 Chip-component structure and method of producing same
11/04/2014US8878336 Fuse
11/04/2014US8878335 Method and system for providing fusing after packaging of semiconductor devices
11/04/2014US8878333 Semiconductor device having improved RF characteristics and moisture resistance and method for manufacturing the same
11/04/2014US8878311 Integrated circuit having raised source drains devices with reduced silicide contact resistance and methods to fabricate same
11/04/2014US8878297 ESD protection circuit
11/04/2014US8878296 Electrostatic discharge protection circuitry
11/04/2014US8878293 Semiconductor device having DC structure
11/04/2014US8878274 Multi-resistive integrated circuit memory
11/04/2014US8878257 Methods and apparatus for an ISFET
11/04/2014US8878254 Semiconductor memory device
11/04/2014US8878250 Electronic device and method for producing electronic device
11/04/2014US8878229 Light emitting device package including a substrate having at least two recessed surfaces
11/04/2014US8878210 Light-emitting device
1 ... 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 ... 2262