| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/05/2011 | US20110101528 Semiconductor device and method of fabricating the same |
| 05/05/2011 | US20110101527 Mechanisms for forming copper pillar bumps |
| 05/05/2011 | US20110101526 Copper Bump Joint Structures with Improved Crack Resistance |
| 05/05/2011 | US20110101525 Semiconductor device with trench-like feed-throughs |
| 05/05/2011 | US20110101524 Semiconductor Device with Bump Interconnection |
| 05/05/2011 | US20110101523 Pillar bump with barrier layer |
| 05/05/2011 | US20110101522 Multichip semiconductor device, chip therefor and method of formation thereof |
| 05/05/2011 | US20110101521 Post passivation interconnect with oxidation prevention layer |
| 05/05/2011 | US20110101520 Semiconductor Die Contact Structure and Method |
| 05/05/2011 | US20110101519 Robust Joint Structure for Flip-Chip Bonding |
| 05/05/2011 | US20110101518 Semiconductor Device and Method of Forming Column Interconnect Structure to Reduce Wafer Stress |
| 05/05/2011 | US20110101517 Molded semiconductor package having a filler material |
| 05/05/2011 | US20110101516 Microelectronic package and method of manufacturing same |
| 05/05/2011 | US20110101515 Power module assembly with reduced inductance |
| 05/05/2011 | US20110101514 Vertical surface mount assembly and methods |
| 05/05/2011 | US20110101513 Chip on film type semiconductor package |
| 05/05/2011 | US20110101511 Power semiconductor package |
| 05/05/2011 | US20110101510 Board on chip package substrate and manufacturing method thereof |
| 05/05/2011 | US20110101509 Wafer Integrated With Permanent Carrier and Method Therefor |
| 05/05/2011 | US20110101507 Method and structure for reworking antireflective coating over semiconductor substrate |
| 05/05/2011 | US20110101506 Stress Memorization Technique Using Silicon Spacer |
| 05/05/2011 | US20110101505 Semiconductor Die Separation Method |
| 05/05/2011 | US20110101496 Four-terminal antifuse structure having integrated heating elements for a programmable circuit |
| 05/05/2011 | US20110101495 Fuse box for semiconductor device and method of forming same |
| 05/05/2011 | US20110101494 Semiconductor memory device |
| 05/05/2011 | US20110101493 Electrical Fuse Structure and Method of Formation |
| 05/05/2011 | US20110101492 Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same |
| 05/05/2011 | US20110101491 Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate |
| 05/05/2011 | US20110101489 SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME |
| 05/05/2011 | US20110101487 Crack resistant circuit under pad structure and method of manufacturing the same |
| 05/05/2011 | US20110101445 Substrate structures including buried wiring, semiconductor devices including substrate structures, and method of fabricating the same |
| 05/05/2011 | US20110101444 Electrostatic protection device |
| 05/05/2011 | US20110101409 LED Lamp Package with Integral Driver |
| 05/05/2011 | US20110101349 Semiconductor package, method of evaluating same, and method of manufacturing same |
| 05/05/2011 | US20110101347 Interconnect Sensor for Detecting Delamination |
| 05/05/2011 | US20110100707 Miniature Housing and Support Arrangement Having at Least One Miniature Housing |
| 05/05/2011 | US20110100700 Multilayer printed wiring board |
| 05/05/2011 | US20110100606 Heat dissipating cavity |
| 05/05/2011 | DE112009000351T5 Mikroelektronischer Baustein, der Siliziumpatches für Zwischenverbindungen hoher Dichte enthält, und Verfahren zum Herstellen desselben Of the same microelectronic module containing silicon patches for intermediates high density and methods for preparing |
| 05/05/2011 | DE112005000975B4 Kühlkörper mit Sockel-Betätigungsvorrichtung Heat sink with pedestal actuator |
| 05/05/2011 | DE112004002678B4 Elektrisch programmierbares 2-Transistoren-Sicherungselement mit einfacher Polysiliziumschicht und elektrisch programmierbare Transistor-Sicherungszelle Electrically programmable 2-transistor fuse element with simple polysilicon layer and electrically programmable fuse transistor cell |
| 05/05/2011 | DE10339924B4 ESD-Testanordnung und Verfahren ESD test arrangement and method |
| 05/05/2011 | DE102010060194A1 Kopplungsstruktur mit hoher Spannungsfestigkeit Coupling structure with high electric strength |
| 05/05/2011 | DE102010045073A1 Electrical fuse structure for use in semiconductor device in semiconductor industry, has cathode connectors coupled with cathode, where parameters of are connectors equal to or greater than two times of characteristic parameter of contact |
| 05/05/2011 | DE102010036702A1 Electrostatic discharge clamp for use in integrated circuit to couple nodes, has voltage threshold circuit triggered to turn-off clam circuit when voltage between nodes decreases to threshold voltage that is less than another voltage |
| 05/05/2011 | DE102009051943A1 Interconnection unit for rear side contacting of solar cells for converting solar energy into electrical energy, has metal film, where circumference of each opening in carrier film is larger than circumference of each opening in metal film |
| 05/05/2011 | DE102009051864A1 Kühlvorrichtung Cooler |
| 05/05/2011 | DE102009046858B3 Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls The power semiconductor module and method of operating a power semiconductor module |
| 05/05/2011 | DE102009046403A1 Leistungshalbleitermodul The power semiconductor module |
| 05/05/2011 | DE102009046172A1 Metallic cooling element i.e. metal plate, for use in circuit housing of printed circuit board, has outer side whose portion is covered with thin layer formed from plastic material, where outer side of layer provides radiation surface |
| 05/05/2011 | DE102009044368A1 Kühlanordnung Cooling arrangement |
| 05/05/2011 | DE102008046862B4 Halbleiterstruktur mit Halbleiterchip und mit Induktionsspule und Verfahren zum Ausbilden einer solchen Semiconductor structure with the semiconductor chip and with the induction coil and method for forming such a |
| 05/05/2011 | DE102008019599B4 Verfahren zur Herstellung eines Bauelementes durch lokales Erwärmen einer oder mehrerer Metallisierungsschichten und mittels selektiven Ätzens, Bauelemente gemäß den Verfahren und Kaskodenschaltung mit einem Bauelement gemäß dem Verfahren A method for producing a component by locally heating one or more metal layers and by means of selective etching, components according to the methods and cascode circuit with a device according to the method |
| 05/05/2011 | DE102007004844B4 Verfahren zur Herstellung eines Bauteils und Bauteil A method for producing a component and component |
| 05/05/2011 | DE102004059232B4 Halbleiterbauteil mit einem Kunststoffgehäuse, einem Halbleiterchip und einer Zwischenplatte, Verfahren zur Herstellung desselben sowie Verwendung einer Moldform bei diesen Verfahren A semiconductor device with a plastic housing, a semiconductor chip and an intermediate plate, method for producing the same as well as use of a Moldform in these processes |
| 05/05/2011 | DE102004021075B4 Halbleiterbauelement mit anisotrop thermisch leitender Radiatorbasis und Verfahren zu seiner Herstellung A semiconductor device comprising anisotropically thermally conductive radiator base, and process for its preparation |
| 05/04/2011 | EP2317550A1 Three-layered cold/hot controller |
| 05/04/2011 | EP2317549A2 Direct bonded substrate for a power semiconductor device. |
| 05/04/2011 | EP2317548A1 Heat-conductive noise suppression sheet |
| 05/04/2011 | EP2317547A1 Kit for optical semiconductor encapsulation |
| 05/04/2011 | EP2317544A1 Semiconductor device |
| 05/04/2011 | EP2317460A1 Card-type peripheral apparatus |
| 05/04/2011 | EP2317272A2 Thermal conduction device having a layered structure with different thermal characteristics of the layers |
| 05/04/2011 | EP2317267A2 Vapor augmented heatsink with multi-wick structure |
| 05/04/2011 | EP2316870A1 Poly(phenylene ether) - polyvinyl thermosetting resin |
| 05/04/2011 | EP2316785A1 Interconnection structure in a cavity having one or more contact rises on the walls of the cavity, and manufacturing method |
| 05/04/2011 | EP2316784A1 Interconnection structure in a cavity having one or more contact rises on the walls of the cavity, and manufacturing method |
| 05/04/2011 | EP2316163A1 Integrated circuit with parallel sets of transistor amplifiers having different turn on power levels |
| 05/04/2011 | EP2316129A2 Enhanced reliability for semiconductor devices using dielectric encasement |
| 05/04/2011 | EP2316128A1 Power electronics device |
| 05/04/2011 | EP2315719A1 Method for packaging semiconductors at a wafer level |
| 05/04/2011 | EP1854819B1 Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| 05/04/2011 | EP1726419B1 Process for producing a ceramic sheet |
| 05/04/2011 | EP1659629B1 Semiconductor device and its manufacturing method |
| 05/04/2011 | EP1444731B1 Controlled impedance transmission lines in a redistribution layer |
| 05/04/2011 | EP1421837B1 Electrically isolated module |
| 05/04/2011 | CN201821625U Fixing mechanism for fixing radiating module on bottom plate and electronic device |
| 05/04/2011 | CN201821253U Inverter double-cavity heat sink based on semiconductor refrigeration |
| 05/04/2011 | CN201820754U Chip type bridge rectifier modulated band filter (MBF) packaging structure |
| 05/04/2011 | CN201820753U Multi-chip encapsulation module for electronic equipments under coal mine |
| 05/04/2011 | CN201820752U Internal structure of large-current field-effect pipe |
| 05/04/2011 | CN201820751U Passive device capsulation structure of single-ring pin with multiple exposed base islands |
| 05/04/2011 | CN201820750U Packaging structure of high-power tube |
| 05/04/2011 | CN201820749U Improved IC fixing elastic sheet of automobile power amplifier |
| 05/04/2011 | CN201820748U Heat conduction structure of heating element |
| 05/04/2011 | CN201820747U Highly-reliable embedded-type photoelectric self-adaptive switching and reinforcing device |
| 05/04/2011 | CN201820746U Soft ceramic composite metal substrate |
| 05/04/2011 | CN201819599U Parallel connection type multiple-evaporator loop heat pipe |
| 05/04/2011 | CN1901149B Semiconductor device and method of manufacturing the same |
| 05/04/2011 | CN1834175B Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device |
| 05/04/2011 | CN1697187B Semiconductor integrated circuit, semiconductor device, and method of manufacturing semiconductor integrated circuit |
| 05/04/2011 | CN1536763B Surface acoustic wave device and its manufacture method |
| 05/04/2011 | CN102047419A Four MOSFET full bridge module |
| 05/04/2011 | CN102047418A Die stacking with an annular via having a recessed socket |
| 05/04/2011 | CN102047417A Enhanced thermal dissipation ball grid array package |
| 05/04/2011 | CN102047416A Refrigeration apparatus |
| 05/04/2011 | CN102047415A Vapor chamber-thermoelectric module assemblies |
| 05/04/2011 | CN102047414A Power semiconductor circuit device and method for manufacturing the same |
| 05/04/2011 | CN102047413A Substrate for power module, power module, and method for producing substrate for power module |
| 05/04/2011 | CN102047412A Three-dimensional semiconductor device structures and methods |