| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/10/2011 | USRE42332 Integrated circuit package, ball-grid array integrated circuit package |
| 05/10/2011 | US7941672 Regeneration of a secret quantity from an intergrated circuit identifier |
| 05/10/2011 | US7939950 Chip package structure |
| 05/10/2011 | US7939949 Semiconductor device with copper wirebond sites and methods of making same |
| 05/10/2011 | US7939948 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads |
| 05/10/2011 | US7939947 Semiconductor package structure |
| 05/10/2011 | US7939946 Chip with a vertical contact structure |
| 05/10/2011 | US7939944 Semiconductor die having a redistribution layer |
| 05/10/2011 | US7939943 Nitride semiconductor device including an electrode in ohmic contact with a P-type nitride semiconductor contact layer |
| 05/10/2011 | US7939942 Semiconductor devices and methods of manufacturing thereof |
| 05/10/2011 | US7939941 Formation of through via before contact processing |
| 05/10/2011 | US7939939 Stable gold bump solder connections |
| 05/10/2011 | US7939938 Functional device package with metallization arrangement for improved bondability of two substrates |
| 05/10/2011 | US7939937 Chip housing having reduced induced vibration |
| 05/10/2011 | US7939936 Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit |
| 05/10/2011 | US7939935 Electronic device substrate, electronic device and methods for fabricating the same |
| 05/10/2011 | US7939934 Microelectronic packages and methods therefor |
| 05/10/2011 | US7939933 Semiconductor device |
| 05/10/2011 | US7939932 Packaged chip devices with atomic layer deposition protective films |
| 05/10/2011 | US7939931 Semiconductor device |
| 05/10/2011 | US7939930 Crosstalk reduction in electrical interconnects using differential signaling |
| 05/10/2011 | US7939929 Semiconductor laser device and method of fabricating semiconductor laser device |
| 05/10/2011 | US7939928 Method and apparatus for stacked die package with insulated wire bonds |
| 05/10/2011 | US7939927 Semiconductor memory apparatus |
| 05/10/2011 | US7939926 Via first plus via last technique for IC interconnects |
| 05/10/2011 | US7939925 Semiconductor device and manufacturing method thereof |
| 05/10/2011 | US7939924 Stack type ball grid array package and method for manufacturing the same |
| 05/10/2011 | US7939923 Memory card and method for manufacturing memory card |
| 05/10/2011 | US7939922 Forming compliant contact pads for semiconductor packages |
| 05/10/2011 | US7939921 Leadframe |
| 05/10/2011 | US7939920 Multiple die integrated circuit package |
| 05/10/2011 | US7939918 Chip packages with covers |
| 05/10/2011 | US7939917 Tape structures, and methods and apparatuses for separating a wafer using the same |
| 05/10/2011 | US7939916 Wafer level CSP packaging concept |
| 05/10/2011 | US7939915 Contact etch stop film |
| 05/10/2011 | US7939914 Dual wired integrated circuit chips |
| 05/10/2011 | US7939913 Semiconductor device |
| 05/10/2011 | US7939907 Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device |
| 05/10/2011 | US7939906 Preparation method for an electron tomography sample with embedded markers and a method for reconstructing a three-dimensional image |
| 05/10/2011 | US7939905 Electrostatic discharge protection method and device for semiconductor device including an electrostatic discharge protection element providing a discharge path of a surge current |
| 05/10/2011 | US7939893 Semiconductor device and its manufacturing method |
| 05/10/2011 | US7939892 Test circuit and method for multilevel cell flash memory |
| 05/10/2011 | US7939830 Display device |
| 05/10/2011 | US7939824 Test structure |
| 05/10/2011 | US7939823 Method and structures for accelerated soft-error testing |
| 05/10/2011 | US7939768 Crystal unit |
| 05/10/2011 | US7939383 Method for fabricating semiconductor package free of substrate |
| 05/10/2011 | US7939380 Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure |
| 05/10/2011 | US7939378 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 05/10/2011 | US7939373 Manufacturing method for semiconductor device containing stacked semiconductor chips |
| 05/10/2011 | US7937824 Method for manufacturing nonreciprocal circuit device and method for manufacturing composite electronic component |
| 05/10/2011 | CA2560697C Embedded toroidal transformers in ceramic substrates |
| 05/05/2011 | WO2011053981A2 Package configurations for low emi circuits |
| 05/05/2011 | WO2011053396A1 High impedance electrical connection via |
| 05/05/2011 | WO2011052746A1 Element mounting substrate, semiconductor module, and portable apparatus |
| 05/05/2011 | WO2011052744A1 Element mounting substrate, method for manufacturing element mounting substrate, semiconductor module, and portable apparatus |
| 05/05/2011 | WO2011052480A1 Electronic component device and package substrate |
| 05/05/2011 | WO2011052471A1 Wiring layer, semiconductor device, and liquid crystal display device using semiconductor device |
| 05/05/2011 | WO2011052211A1 Circuit board, and semiconductor device having component mounted on circuit board |
| 05/05/2011 | WO2011052157A1 Resin composition for semiconductor encapsulation and semiconductor device using the resin composition |
| 05/05/2011 | WO2011052104A1 Semiconductor device and method for manufacturing same |
| 05/05/2011 | WO2011051854A1 Semiconductor devices with screening coating to inhibit dopant deactivation |
| 05/05/2011 | WO2011051785A2 Routing method for flip chip package and apparatus using the same |
| 05/05/2011 | WO2011051456A1 Antenna arrangement for transmitting signals |
| 05/05/2011 | WO2011051310A1 Array of scalable ceramic diode carriers having leds |
| 05/05/2011 | WO2011051200A1 Device for cooling a medium-voltage apparatus using heat pipes under voltage |
| 05/05/2011 | WO2011051196A1 Device for cooling a medium-voltage apparatus using insulated heat pipes |
| 05/05/2011 | WO2011051195A1 Method and device for cooling a jacketed medium-voltage electrical installation |
| 05/05/2011 | WO2011050711A1 Formation method of fuse structure |
| 05/05/2011 | WO2011050642A1 Led street lamp |
| 05/05/2011 | WO2011019562A3 Fin anti-fuse with reduced programming voltage |
| 05/05/2011 | WO2011017202A3 Packaged semiconductor device for high performance memory and logic |
| 05/05/2011 | WO2011012976A8 Method and device for temperature conditioning of an element |
| 05/05/2011 | WO2011006101A3 Devices and methods providing for intra-die cooling structure reservoirs |
| 05/05/2011 | WO2011003948A3 Electrically conductive adhesives |
| 05/05/2011 | US20110106287 Wiring forming system and wiring forming method for forming wiring on wiring board |
| 05/05/2011 | US20110105637 Adhesive encapsulating composition and electronic devices made therewith |
| 05/05/2011 | US20110103438 Flexible interconnect pattern on semiconductor package |
| 05/05/2011 | US20110103127 And-type one time programmable memory cell |
| 05/05/2011 | US20110103030 Packages and Methods for Mitigating Plating Stub Effects |
| 05/05/2011 | US20110103020 Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices |
| 05/05/2011 | US20110102011 Method and device for testing tsvs in a 3d chip stack |
| 05/05/2011 | US20110101546 System and Method for Directional Grinding on Backside of a Semiconductor Wafer |
| 05/05/2011 | US20110101545 Integrated circuit packaging system with bond pad and method of manufacture thereof |
| 05/05/2011 | US20110101544 Semiconductor device and method for manufacturing the same |
| 05/05/2011 | US20110101543 Connecting material and semiconductor device |
| 05/05/2011 | US20110101542 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof |
| 05/05/2011 | US20110101541 Semiconductor device |
| 05/05/2011 | US20110101540 Integrated chip carrier with compliant interconnects |
| 05/05/2011 | US20110101539 Semiconductor device and manufacturing method of semiconductor device |
| 05/05/2011 | US20110101538 Creation of vias and trenches with different depths |
| 05/05/2011 | US20110101537 Hybrid bonding interface for 3-dimensional chip integration |
| 05/05/2011 | US20110101536 Methods For Discretized Formation of Masking and Capping Layers on a Substrate |
| 05/05/2011 | US20110101535 Microelectronic assembly with impedance controlled wirebond and conductive reference element |
| 05/05/2011 | US20110101534 Automated short length wire shape strapping and methods of fabricting the same |
| 05/05/2011 | US20110101533 Integrated (multilayer) circuits and process of producing the same |
| 05/05/2011 | US20110101532 Device fabricated using an electroplating process |
| 05/05/2011 | US20110101531 Thermo-mechanical stress in semiconductor wafers |
| 05/05/2011 | US20110101530 Semiconductor device and method of manufacture thereof |
| 05/05/2011 | US20110101529 Barrier layer for copper interconnect |