| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/11/2011 | CN102054815A Condensation component and photoelectric element |
| 05/11/2011 | CN102054814A Non-core layer package substrate and manufacturing method thereof |
| 05/11/2011 | CN102054813A Encapsulation substrate unit bodies with plated through holes and manufacturing method thereof |
| 05/11/2011 | CN102054812A Device and manufacturing method |
| 05/11/2011 | CN102054811A Integrated circuit structure |
| 05/11/2011 | CN102054810A Chip with metal column structures |
| 05/11/2011 | CN102054809A Re-distribution mechanism |
| 05/11/2011 | CN102054808A Liquid-cooled-type cooling device |
| 05/11/2011 | CN102054807A Chip on film type semiconductor package |
| 05/11/2011 | CN102054806A Thermal conductive substrate and manufacturing method thereof |
| 05/11/2011 | CN102054805A Packaging structure of flip resin circuit board chip with circumscribed radiator |
| 05/11/2011 | CN102054804A Cu/Mo/Cu heat sink material and preparation method thereof |
| 05/11/2011 | CN102054803A External radiator packaging structure for matrix island-exposed chip face-up radiating block |
| 05/11/2011 | CN102054802A Packaging structure of external heat radiator of pyramid lock hole heat radiation block of base island exposed chip |
| 05/11/2011 | CN102054801A Capsulation structure with inner pin embedded in flip-chip locking hole and radiator externally connected on radiating block |
| 05/11/2011 | CN102054800A Encapsulating structure with inner pin exposed, chip fipped and heat radiating block externally connected for heat radiator |
| 05/11/2011 | CN102054799A Encapsulating structure with exposed inner pin, inverted chip and radiating block provided with lock hole and externally connected with radiator through projecting post |
| 05/11/2011 | CN102054798A External heat radiator packaging structure of upright heat radiating block of chip in resin circuit board |
| 05/11/2011 | CN102054797A Packaging structure of printed circuit board, chip, flip lock hole radiating block and external radiator |
| 05/11/2011 | CN102054796A Dry type automatic circulating radiator |
| 05/11/2011 | CN102054795A Flip chip package and method of manufacturing the same |
| 05/11/2011 | CN102054794A Electronic device and fabrication method thereof |
| 05/11/2011 | CN102054793A Substrate member, module, electric equipment, and manufacturing method of modules |
| 05/11/2011 | CN102054792A Carrier tape for tab-package and manufacturing method thereof |
| 05/11/2011 | CN102054791A Electronic device, method of producing the same, and semiconductor device |
| 05/11/2011 | CN102054790A Semiconductor element and method for forming the same |
| 05/11/2011 | CN102054789A Semiconductor device and method of manufacturing semiconductor device |
| 05/11/2011 | CN102054788A Circuitry component |
| 05/11/2011 | CN102054787A Stack type package structure and manufacture method thereof |
| 05/11/2011 | CN102054766A Semiconductor device and method for manufacturing the same |
| 05/11/2011 | CN102054762A Semiconductor structure and method for forming dual-damascene structure |
| 05/11/2011 | CN102054761A Semiconductor structure and method for forming dual-damascene structure |
| 05/11/2011 | CN102054756A Copper interconnection structure and formation method thereof |
| 05/11/2011 | CN102054755A Interconnecting structure and formation method thereof |
| 05/11/2011 | CN102054751A Dual-inlay structure and forming method thereof |
| 05/11/2011 | CN102054749A Semiconductor device and manufacturing method thereof |
| 05/11/2011 | CN102054719A Method and structure for measuring circuit offset by using circuit substrate |
| 05/11/2011 | CN102054717A 半导体芯片栅格阵列封装及其制造方法 Grid array semiconductor chip package and a method of manufacturing |
| 05/11/2011 | CN102054716A Method and structure for molding leadframe strip |
| 05/11/2011 | CN102054715A Method of fabricating backside-illuminated image sensor |
| 05/11/2011 | CN102054710A Coreless layer capsulation substrate and manufacturing method thereof |
| 05/11/2011 | CN102054708A Method for forming window ball grid array encapsulated pre-substrate |
| 05/11/2011 | CN102054667A Method for applying photoresist lifting-off technology to protect photoetching alignment marks |
| 05/11/2011 | CN102053682A Heat radiation device |
| 05/11/2011 | CN102053430A Liquid crystal display device |
| 05/11/2011 | CN102052577A LED (Light Emitting Diode) lighting device |
| 05/11/2011 | CN102052576A Illumination device |
| 05/11/2011 | CN102051148A Single-component environmentally-friendly electronic glue and application thereof |
| 05/11/2011 | CN102051147A Single-component environmentally-friendly organic silicon-acrylate electronic glue and application thereof |
| 05/11/2011 | CN102051143A Adhesive for connection of circuit member and semiconductor device using the same |
| 05/11/2011 | CN102051142A Adhesive for connection of circuit member and semiconductor device using the same |
| 05/11/2011 | CN102051141A Adhesive for connection of circuit member and semiconductor device using the same |
| 05/11/2011 | CN102050950A Isocyanuric ring-containing polysiloxane having vinyl groups at the terminals |
| 05/11/2011 | CN102050948A Composition for thermoplastic silicone resin |
| 05/11/2011 | CN101771036B Capacitor and manufacture method thereof |
| 05/11/2011 | CN101752343B Integrated circuit structure |
| 05/11/2011 | CN101740417B Method for producing stackable dies |
| 05/11/2011 | CN101718897B Optical receiving assembly for hundred trillion-grade 850nm optical communication and preparation method thereof |
| 05/11/2011 | CN101630676B Novel isolated gate bipolar transistor module distributed with direct coated copper base plates |
| 05/11/2011 | CN101630658B Method for interconnecting image sensors |
| 05/11/2011 | CN101630647B Welding method and welding structure of conductive terminals |
| 05/11/2011 | CN101625993B Dual-damascene structure and manufacturing method thereof |
| 05/11/2011 | CN101604666B Sapphire substrate and polishing method and application thereof |
| 05/11/2011 | CN101594764B Heat radiating device and manufacturing method thereof |
| 05/11/2011 | CN101582427B Semiconductor device |
| 05/11/2011 | CN101577261B Connection point structure as well as forming method and connecting structure thereof |
| 05/11/2011 | CN101567357B Electronic device provided with wiring board, and wiring board for such electronic device |
| 05/11/2011 | CN101542719B Connection structure for flip-chip semiconductor package, buildup layer material, sealing resin composition and circuit board |
| 05/11/2011 | CN101525702B Copper alloy sheet superior in dicing workability for use in QFN package and QFC package |
| 05/11/2011 | CN101501842B Semiconductor package and manufacturing method thereof |
| 05/11/2011 | CN101499448B 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 05/11/2011 | CN101488481B Light-emitting device and electronic apparatus |
| 05/11/2011 | CN101483160B 电子部件 Electronic components |
| 05/11/2011 | CN101477984B Semiconductor device used for alleviating micro-loading effect |
| 05/11/2011 | CN101473431B Cooling and shielding of high voltage current changer |
| 05/11/2011 | CN101472447B Electronic device |
| 05/11/2011 | CN101472440B Radiating device |
| 05/11/2011 | CN101466239B Radiating module and electronic device applying the same |
| 05/11/2011 | CN101416310B Multi-die semiconductor package |
| 05/11/2011 | CN101386930B Method of preparing linking copper wire |
| 05/11/2011 | CN101365314B Heat radiating device and fan fixing rack thereof |
| 05/11/2011 | CN101336062B Combination of cooling device |
| 05/11/2011 | CN101329055B Heat radiator |
| 05/11/2011 | CN101304016B All-purpose test encapsulation structure and method |
| 05/11/2011 | CN101295688B Redistribution structure and production method thereof, redistribution convex point and production method thereof |
| 05/11/2011 | CN101290929B Stack type chip packaging structure |
| 05/11/2011 | CN101283016B Thermosetting epoxy resin composition and semiconductor device |
| 05/11/2011 | CN101256999B Interposer and manufacturing method for the same |
| 05/11/2011 | CN101236965B Semiconductor integrated circuit device |
| 05/11/2011 | CN101221921B Semiconductor integrated circuit and process for forming same |
| 05/11/2011 | CN101221898B Method for manufacturing metallic substrate with high quality surface |
| 05/11/2011 | CN101216877B Sliding type fingerprint sensing element and its method of preparation |
| 05/11/2011 | CN101212881B Heat radiator |
| 05/11/2011 | CN101203115B Liquid cooling dissipating heat system and heat absorbing element thereof |
| 05/11/2011 | CN101136428B Organic electroluminescence device, manufacturing method therefor, and electronic apparatus |
| 05/11/2011 | CN101114629B Resin molded semiconductor device and method of manufacturing the same |
| 05/11/2011 | CN101110443B Display substrate, method of manufacturing and display device comprising the substrate |
| 05/11/2011 | CN101030557B Semiconductor device and process for producing the same |
| 05/11/2011 | CN101005055B Film type semiconductor package and test method, test device and semiconductor device |
| 05/10/2011 | USRE42349 Wafer treating method for making adhesive dies |