| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/12/2011 | US20110108849 Tft-lcd pixel unit and method for manufacturing the same |
| 05/12/2011 | US20110108311 Multilayer printed wiring board |
| 05/12/2011 | DE202011002488U1 Kühlmodul Cooling module |
| 05/12/2011 | DE202011000048U1 Radiales Kühlgerät Radial cooling device |
| 05/12/2011 | DE202010013223U1 Polysymmetrischer Kühlkörper mit darin angeordneter Wärmerohrgruppe Polysymmetrischer heatsink with heat pipe disposed therein group |
| 05/12/2011 | DE10238051B4 Integrierte Flip-Chip-Halbleiterschaltung Integrated flip-chip semiconductor circuit |
| 05/12/2011 | DE10237871B4 Baugruppensystem Assembly system |
| 05/12/2011 | DE102010047806A1 Integrierte Schaltkreise und Verfahren zum Ausbilden der integrierten Schaltkreise Integrated circuits and methods of forming the integrated circuits |
| 05/12/2011 | DE102010042905A1 Halbleiterbauelement mit Detektion thermisch bedingter Fehler Semiconductor device with detection of thermally induced errors |
| 05/12/2011 | DE102010038154A1 Laminatelektronikbauteil und Verfahren zu seiner Herstellung Laminated electronic component and method for its preparation |
| 05/12/2011 | DE102009052160A1 Smartcard-Modul mit Flip-Chip montiertem Halbleiterchip Smart card module fitted with flip-chip semiconductor chip |
| 05/12/2011 | DE102009046606A1 Schutzelement für elektronische Schaltungen Element for protecting electronic circuits |
| 05/12/2011 | DE102009046446A1 Elektronisches Bauelement Electronic component |
| 05/12/2011 | DE102008018221B4 System mit Schutz für Schaltungsplatinen System with protection circuit boards |
| 05/12/2011 | DE102007045418B4 Herstellungsverfahren für eine Anordnung zum Kühlen eines elektrischen Bauelements A method for manufacturing an arrangement for cooling of an electrical component |
| 05/12/2011 | DE102005014513B4 Vorrichtung und Verfahren zum Temperieren eines Substrats, sowie Verfahren zur Herstellung der Vorrichtung Apparatus and method for controlling the temperature of a substrate, and to processes for producing the device |
| 05/12/2011 | DE102004015546B4 Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung A semiconductor integrated circuit chip and method for securing a semiconductor integrated circuit |
| 05/11/2011 | EP2320718A1 Circuit module and method for manufacturing same |
| 05/11/2011 | EP2320458A1 Semiconductor device |
| 05/11/2011 | EP2320457A2 Carrier body for components or circuits |
| 05/11/2011 | EP2320344A2 Key generation |
| 05/11/2011 | EP2320338A2 Semiconductor integrated circuit, and method of manufacturing therefor |
| 05/11/2011 | EP2319081A2 Method and apparatus for forming i/o clusters in integrated circuits |
| 05/11/2011 | EP2319078A1 High q transformer disposed at least partly in a non-semiconductor substrate |
| 05/11/2011 | EP2319076A1 Substrate for an electronic or electromechanical component and nano-elements |
| 05/11/2011 | EP2319075A1 Through silicon via and method of fabricating same |
| 05/11/2011 | EP2319055A1 Inductor structure |
| 05/11/2011 | EP2075839B1 Method for evaluating soi wafer |
| 05/11/2011 | EP1732118B1 Heater, reflow apparatus with such heater |
| 05/11/2011 | EP1346613B1 Via-in-pad with off-center geometry |
| 05/11/2011 | EP1305829B1 Solder bar for high power flip chips |
| 05/11/2011 | EP1195810B1 Method for producing an aluminum-silicon carbide semiconductor substrate the same |
| 05/11/2011 | CN201830606U 散热片 Fins |
| 05/11/2011 | CN201829494U Parallel LED chip packaging structure |
| 05/11/2011 | CN201829493U Hybrid integrated circuit with highly reliable power |
| 05/11/2011 | CN201829492U Through silicon via connecting structure |
| 05/11/2011 | CN201829491U Plastic-packaged reinforced triode lead frame |
| 05/11/2011 | CN201829490U Chip area punching integrated circuit lead frame |
| 05/11/2011 | CN201829489U Chip area blank-pressing integrated circuit lead frame |
| 05/11/2011 | CN201829488U Lead frame of selectively plated triode |
| 05/11/2011 | CN201829487U Triode lead frame |
| 05/11/2011 | CN201829486U Dot type electroplating audion lead frame |
| 05/11/2011 | CN201829485U Dot-type electroplating lead frame |
| 05/11/2011 | CN201829484U Spot type electroplating triode lead frame |
| 05/11/2011 | CN201829483U Lead frame and packaging structure of flipchip thin quad flat non-leaded package (FCTQFN) |
| 05/11/2011 | CN201829482U Chip size package structure of flip chip without base plate |
| 05/11/2011 | CN201829481U Fan-out-type output end flip chip packaging structure without base plate |
| 05/11/2011 | CN201829480U Wind-cooling radiator |
| 05/11/2011 | CN201829479U Pressing component of semiconductor element |
| 05/11/2011 | CN201829478U Heat radiation fin assembly for electronic products |
| 05/11/2011 | CN201829477U Plastic biserial collinear packaging plastic package body, plastic package body array and packaging device |
| 05/11/2011 | CN201829476U Straight-side metal cover semiconductor package |
| 05/11/2011 | CN201829475U Semiconductor chip interconnection structure and semiconductor encapsulating element adopting the same |
| 05/11/2011 | CN201828951U Smart card module based on aluminum wire bonding |
| 05/11/2011 | CN201828746U Liquid crystal display substrate and liquid crystal display |
| 05/11/2011 | CN201827835U Circuit board facilitating heat dissipation of low-power LED |
| 05/11/2011 | CN1983573B Semiconductor device and method for fabricating the same |
| 05/11/2011 | CN1956640B Radiator fastener and radiator device assembly |
| 05/11/2011 | CN1913747B Using rows/columns of micro-vias in a BGA interconnect grid to create improved PCB routing channels |
| 05/11/2011 | CN1866492B System and method for identification of a reference integrated circuit for a pick-and-place equipment |
| 05/11/2011 | CN102057501A Sealing material and solar battery module wherein same is used |
| 05/11/2011 | CN102057485A Foil based semiconductor package |
| 05/11/2011 | CN102057484A Semiconductor device mounting substrate |
| 05/11/2011 | CN102057483A Multilayer wiring board |
| 05/11/2011 | CN102057482A Wiring board and liquid crystal display device |
| 05/11/2011 | CN102057481A Package with power and ground through via |
| 05/11/2011 | CN102057000A Ink composition for forming an insulating film and an insulating film formed from said ink composition |
| 05/11/2011 | CN102056700A Heat exchange plate manufacturing method and heat exchange plate |
| 05/11/2011 | CN102056467A Liquid-cooled heat radiator |
| 05/11/2011 | CN102056463A Heat radiating device |
| 05/11/2011 | CN102056461A Heat dissipating device |
| 05/11/2011 | CN102056460A Combination of protective cover and heat radiating device |
| 05/11/2011 | CN102056459A Liquid-cooling heat radiating device |
| 05/11/2011 | CN102056458A Buckle, radiation device using buckle, and electronic device |
| 05/11/2011 | CN102056457A Water-cooling type radiating device |
| 05/11/2011 | CN102056456A Heat dissipating device |
| 05/11/2011 | CN102056454A Heat radiating device with foolproof structure and electronic device with same |
| 05/11/2011 | CN102056453A Heat radiation device |
| 05/11/2011 | CN102056407A Electronics component embedded PCB |
| 05/11/2011 | CN102055886A Integrated module including image sensor, focusing drive device and drive circuit |
| 05/11/2011 | CN102054865A MOS (Metal Oxide Semiconductor) transistor used as electrostatic protection structure and manufacturing method thereof |
| 05/11/2011 | CN102054861A Bidirectional silicon-controlled rectifier (SCR) and electrostatic protection circuit |
| 05/11/2011 | CN102054860A Bidirectional silicon-controlled rectifier (SCR) and electrostatic protection circuit |
| 05/11/2011 | CN102054845A Radio frequency laterally diffused metal oxide semiconductor (LDMOS) device based on silicon on insulator (SOI) and method for injecting device |
| 05/11/2011 | CN102054840A Static discharge protection device |
| 05/11/2011 | CN102054839A Metal oxide semiconductor (MOS) field effect transistor (FET) structure and preparation method thereof |
| 05/11/2011 | CN102054838A Bidirectional silicon-controlled rectifier (SCR) and electrostatic protection circuit |
| 05/11/2011 | CN102054837A Bidirectional thyristor and electrostatic protection circuit |
| 05/11/2011 | CN102054836A Thyristor for electrostatic discharge |
| 05/11/2011 | CN102054835A Thyristor for electrostatic discharge |
| 05/11/2011 | CN102054833A 薄膜晶体管基板及其制造方法 The thin film transistor substrate and a method of manufacturing |
| 05/11/2011 | CN102054830A Power semiconductor module and method for driving the same |
| 05/11/2011 | CN102054826A Novel baseplate-free power module |
| 05/11/2011 | CN102054822A Integrated circuits |
| 05/11/2011 | CN102054821A Packaging structure with internal shield and manufacturing method thereof |
| 05/11/2011 | CN102054820A Semiconductor device with buried bit lines and method for fabricating the same |
| 05/11/2011 | CN102054819A Semiconductor device with buried gates and buried bit lines and method for fabricating the same |
| 05/11/2011 | CN102054818A Interconnection structure and manufacture method thereof |
| 05/11/2011 | CN102054817A Antifuse and method of making the antifuse |
| 05/11/2011 | CN102054816A Fusing method for fuse wire |