| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 05/18/2011 | CN102064175A Semiconductor structure and manufacturing method thereof |
| 05/18/2011 | CN102064173A Electrostatic protective device for silicon controlled rectifier |
| 05/18/2011 | CN102064163A Stack package assembly |
| 05/18/2011 | CN102064162A Stacked package structure, package structure thereof and manufacture method of the package structure |
| 05/18/2011 | CN102064161A Optimized power package structure of intelligent power module |
| 05/18/2011 | CN102064160A Power module containing special power terminal |
| 05/18/2011 | CN102064158A Compact power module |
| 05/18/2011 | CN102064157A System encapsulation module of wireless local area network |
| 05/18/2011 | CN102064156A Poly-crystal type LED (light emitting diode) package structure for generating quasi-circular light-emitting effect |
| 05/18/2011 | CN102064155A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 05/18/2011 | CN102064154A 集成电路结构 Integrated circuit structure |
| 05/18/2011 | CN102064153A Semiconductor device and method of manufacturing the semiconductor device |
| 05/18/2011 | CN102064152A Stainless steel substrate and making method thereof |
| 05/18/2011 | CN102064151A Lead frame for manufacturing discrete semiconductor and manufacturing method thereof |
| 05/18/2011 | CN102064150A Lead frame |
| 05/18/2011 | CN102064149A Semiconductor device with through guide hole, packaging structure thereof and manufacturing method of packaging structure |
| 05/18/2011 | CN102064148A Magnetic thermal cycling system |
| 05/18/2011 | CN102064147A Assembling structure of diode of rectifier and heat-radiating plate for automotive |
| 05/18/2011 | CN102064146A Cooling structure of chip |
| 05/18/2011 | CN102064145A High efficiency composite radiator and preparation method |
| 05/18/2011 | CN102064144A Quad flat non-lead package and manufacturing method thereof |
| 05/18/2011 | CN102064143A Optical module and manufacturing method thereof |
| 05/18/2011 | CN102064142A Semiconductor device and method of manufacturing the semiconductor device |
| 05/18/2011 | CN102064141A Semiconductor device package for shielding electromagnetic interference |
| 05/18/2011 | CN102064140A Packaging structure and making process thereof |
| 05/18/2011 | CN102064139A Semiconductor chip package |
| 05/18/2011 | CN102064138A Semiconductor chip package with mold locks and mold lock for the same |
| 05/18/2011 | CN102064137A Semiconductor structure with metal frame |
| 05/18/2011 | CN102064136A Integrated circuit structure |
| 05/18/2011 | CN102064135A Chip with metal post and encapsulating structure of chip with metal post |
| 05/18/2011 | CN102064118A Method and packaging mould for manufacturing semiconductor packaging piece |
| 05/18/2011 | CN102064115A Electronic device including a packaging substrate having a trench |
| 05/18/2011 | CN102064114A Electronic device including a packaging substrate and an electrical conductor within a via and a process of forming the same |
| 05/18/2011 | CN102064113A No-wire bonding packaging method and finished products of power semiconductor chip |
| 05/18/2011 | CN102063952A Anisotropic conductive film excellent in connection reliability, and circuit connecting structure using the same |
| 05/18/2011 | CN102063584A Chip attack protection |
| 05/18/2011 | CN102062983A Electrochromic rearview mirror assembly incorporating a display/signal light |
| 05/18/2011 | CN102061136A Adhesive tape for resin-encapsulating and method of manufacture of resin-encapsulated semiconductor device |
| 05/18/2011 | CN101728344B Signal connection circuit capable of compensating difference of transmission time delay of routing signal |
| 05/18/2011 | CN101710582B Layout structure for promoting pixel defection detectivity of thin film transistor substrate |
| 05/18/2011 | CN101673744B Transistor structure, dynamic random access memory structure and manufacturing method thereof |
| 05/18/2011 | CN101644866B Film transistor array substrate |
| 05/18/2011 | CN101622706B Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package |
| 05/18/2011 | CN101621198B Effective electrostatic discharge protection circuit |
| 05/18/2011 | CN101615583B Chip stacking structure forming method |
| 05/18/2011 | CN101593747B A semiconductor device assembly and a method of establishing electric connection in the semiconductor device assembly |
| 05/18/2011 | CN101577249B Semiconductor device with channel of fin structure and method for manufacturing the same |
| 05/18/2011 | CN101562174B LED chip encapsulating structure for backlight module and preparing method thereof |
| 05/18/2011 | CN101540304B Semiconductor chip package |
| 05/18/2011 | CN101533833B Busbar assembly with integrated cooling |
| 05/18/2011 | CN101479847B Hinged leadframe assembly for an electrical connector |
| 05/18/2011 | CN101447495B Image sensor and method of manufacturing the same |
| 05/18/2011 | CN101442877B Novel interconnection structure and method for creating electric through-hole |
| 05/18/2011 | CN101399244B Circuit structure, photo mask for defining the circuit structure |
| 05/18/2011 | CN101393910B Semiconductor integrated circuit |
| 05/18/2011 | CN101356641B Semiconductor mounting wiring board and method for manufacturing same, and wiring board assembly |
| 05/18/2011 | CN101355066B Packaging structure and manufacturing method thereof |
| 05/18/2011 | CN101350362B Light emitting device and manufacturing method thereof |
| 05/18/2011 | CN101313402B Double-faced electrode package, and its manufacturing method |
| 05/18/2011 | CN101312628B Heat radiator having bent spring plate |
| 05/18/2011 | CN101312183B Semiconductor device |
| 05/18/2011 | CN101271892B Semiconductor device and manufacturing method of the same |
| 05/18/2011 | CN101261964B Functional device package |
| 05/18/2011 | CN101237755B Disorderly current heat radiation top cover of heating part and heat radiation assembly with this top cover |
| 05/18/2011 | CN101231975B Chip packaging body and method of manufacturing the same |
| 05/18/2011 | CN101179050B Method of fabricating semiconductor integrated circuit device and semiconductor integrated circuit device by the same |
| 05/18/2011 | CN101060119B An integral circuit structure and its manufacture method |
| 05/18/2011 | CN101047177B Semiconductor device |
| 05/18/2011 | CN101009251B Thin film transistor substrate and method for manufacturing the same and liquid crystal display having the same |
| 05/18/2011 | CN101000905B Semiconductor device and manufacturing method of semiconductor device |
| 05/17/2011 | USRE42363 Stackable electronic assembly |
| 05/17/2011 | US7945791 Protected storage of a datum in an integrated circuit |
| 05/17/2011 | US7945231 Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same |
| 05/17/2011 | US7945169 Optical transceiver with a plurality of optical subassemblies electrically connected by integrated FPC board with a substrate |
| 05/17/2011 | US7945062 Microelectromechanical microphone packaging system |
| 05/17/2011 | US7944694 Liquid cooling apparatus and method for cooling blades of an electronic system chassis |
| 05/17/2011 | US7944688 Heat dissipating structure including a position-adjusting unit |
| 05/17/2011 | US7944656 Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit |
| 05/17/2011 | US7944124 MEMS structure having a stress-inducer temperature-compensated resonator member |
| 05/17/2011 | US7944064 Semiconductor device having alignment post electrode and method of manufacturing the same |
| 05/17/2011 | US7944063 Application of 2-dimensional photonic crystals in alignment devices |
| 05/17/2011 | US7944062 Air cavity package for a semiconductor die and methods of forming the air cavity package |
| 05/17/2011 | US7944061 Semiconductor device having through contacts through a plastic housing composition and method for the production thereof |
| 05/17/2011 | US7944060 Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device |
| 05/17/2011 | US7944059 Semiconductor device having a probing region |
| 05/17/2011 | US7944058 Semiconductor device and process for fabricating the same |
| 05/17/2011 | US7944057 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices |
| 05/17/2011 | US7944056 Hillock-free aluminum layer and method of forming the same |
| 05/17/2011 | US7944055 Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures |
| 05/17/2011 | US7944054 Semiconductor device and method for fabricating semiconductor device |
| 05/17/2011 | US7944053 Semiconductor device and method of manufacturing the same |
| 05/17/2011 | US7944052 Semiconductor device |
| 05/17/2011 | US7944051 Semiconductor device having external connection terminals and method of manufacturing the same |
| 05/17/2011 | US7944050 Integrated circuit device and a method of making the integrated circuit device |
| 05/17/2011 | US7944049 Semiconductor device and manufacturing method thereof |
| 05/17/2011 | US7944048 Chip scale package for power devices and method for making the same |
| 05/17/2011 | US7944047 Method and structure of expanding, upgrading, or fixing multi-chip package |
| 05/17/2011 | US7944046 Heat spreader for a multi-chip package |
| 05/17/2011 | US7944045 Semiconductor module molded by resin with heat radiation plate opened outside from mold |
| 05/17/2011 | US7944044 Semiconductor package structure having enhanced thermal dissipation characteristics |