H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2011
05/19/2011	US20110115076 Semiconductor device, electronic component, and fabrication process thereof
05/19/2011	US20110115075 Bumping free flip chip process
05/19/2011	US20110115074 Wafer bumping using printed under bump metalization
05/19/2011	US20110115073 Pad structure for semiconductor devices
05/19/2011	US20110115071 Integrated circuit micro-module
05/19/2011	US20110115070 Semiconductor Device and Method of Forming Protective Material Between Semiconductor Die Stacked on Semiconductor Wafer to Reduce Defects During Singulation
05/19/2011	US20110115069 Electronic device including a packaging substrate and an electrical conductor within a via and a process of forming the same
05/19/2011	US20110115068 Power Semiconductor Module and Method for Operating a Power Semiconductor Module
05/19/2011	US20110115067 Semiconductor chip package with mold locks
05/19/2011	US20110115066 Semiconductor device packages with electromagnetic interference shielding
05/19/2011	US20110115065 Integrated circuit packaging system with interconnect and method of manufacture thereof
05/19/2011	US20110115064 Hybrid Package Construction With Wire Bond And Through Silicon Vias
05/19/2011	US20110115063 Integrated Circuit Packaging with Split Paddle
05/19/2011	US20110115062 Semiconductor device and method of manufacturing the same
05/19/2011	US20110115061 Electronic device including a packaging substrate having a trench
05/19/2011	US20110115060 Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding
05/19/2011	US20110115059 Semiconductor Device Packages with Electromagnetic Interference Shielding
05/19/2011	US20110115058 Devices with crack stops
05/19/2011	US20110115057 Design structure for integrated circuit alignment
05/19/2011	US20110115048 Method of forming an isolation structure
05/19/2011	US20110115045 Substrate for manufacturing semiconductor device and manufacturing method thereof
05/19/2011	US20110115036 Device packages and methods of fabricating the same
05/19/2011	US20110115035 General strength and sensitivity enhancement method for micromachined device
05/19/2011	US20110114951 Semiconductor device and method for producing the same
05/19/2011	US20110114949 Test chiplets for devices
05/19/2011	US20110114893 Circuit-connecting material and circuit terminal connected structure and connecting method
05/19/2011	US20110114840 Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
05/19/2011	US20110114383 Potted electronic component and method for its manufacture
05/19/2011	US20110114295 Heat dissipation module
05/19/2011	US20110114294 Heat removal in compact computing systems
05/19/2011	DE202011003157U1 Befestigungsgestell Mounting frame
05/19/2011	DE102010060272A1 Bauelement und Verfahren zur Herstellung eines Bauelements mittels eines Elektroplattierungsprozesses Device and method for producing a component by means of an electroplating process
05/19/2011	DE102010016565A1 Vorrichtung zur Umwandlung elektrischer Leistung für Fahrzeuge An apparatus for converting electric power for vehicles
05/19/2011	DE102009053065A1 Hochvolttransistor, ESD-Schutzschaltung und Verwendung eines Hochvolttransistors in einer ESD-Schutzschaltung High-voltage transistor, the ESD protection circuit and use of a high-voltage transistor in an ESD protection circuit
05/19/2011	DE102009053064A1 Dünnfilm-Halbleiterbauelement mit Schutzdiodenstruktur und Verfahren zur Herstellung eines Dünnfilm-Halbleiterbauelements A thin film semiconductor device with protective diode structure and method of manufacturing a thin film semiconductor device
05/19/2011	DE102009046800A1 Verfahren zur Herstellung einer Vielzahl von Dünnchips und entsprechend gefertigter Dünnchip A method of manufacturing a plurality of thin chips and fabricated according to thin chip
05/19/2011	DE102009046687A1 Mikromechanisches Verfahren und entsprechende Anordnung zum Bonden von Halbleitersubstraten sowie entsprechender gebondeter Halbleitechip The micromechanical methods and corresponding apparatus for bonding semiconductor substrates and corresponding bonded semiconductor single chip
05/19/2011	DE102008031231A1 Planare elektrische Leistungselektronik-Module für Hochtemperatur-Anwendungen und entsprechende Herstellungsverfahren Planar electric power electronics modules for high temperature applications and appropriate methods of preparation
05/19/2011	DE102005045059B4 Integrierte Schaltungsanordnung mit mehreren Leitstrukturlagen und Spule sowie Verfahren zur Herstellung An integrated circuit device having a plurality of conductive structure and coil and methods for preparing
05/18/2011	EP2323465A1 Electrical circuit with heat sink
05/18/2011	EP2323178A2 Light-emitting device, method for manufacturing same, molded body and sealing member
05/18/2011	EP2323177A1 Photodiode chip having a high cutoff frequency
05/18/2011	EP2323163A2 Cooling module
05/18/2011	EP2323142A1 Magnetic radiofrequency device with variable response
05/18/2011	EP2323079A2 Electrical device manufacturing techniques
05/18/2011	EP2323077A1 Electronic device including a semi-conductor component integrating an antenna.
05/18/2011	EP2322469A1 Getter with two activation temperatures and structure comprising said getter
05/18/2011	EP2322316A1 Au-Ga-In BRAZING FILLER METAL
05/18/2011	EP2321849A1 Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
05/18/2011	EP2321846A2 Electrostatic chuck assembly
05/18/2011	EP1869724B1 Circuitry module
05/18/2011	EP1724299B1 Modifier for resin and resin composition using the same and formed article
05/18/2011	CN201838593U Rapid recovery diode module
05/18/2011	CN201838587U Single-phase rectifying bridge
05/18/2011	CN201838585U Stackable chip packaging structure and base plate thereof
05/18/2011	CN201838584U Encapsulated triode
05/18/2011	CN201838583U Surface mount type lead pair
05/18/2011	CN201838582U Lead frame structure with big top and small bottom of metal foot of integrated circuit or discrete device
05/18/2011	CN201838581U Encapsulation structure without pin around
05/18/2011	CN201838580U Single packaging structure for inverted mounting of chip with double-sided graphics
05/18/2011	CN201838579U Module packaging structure for direct arranging of chip with double-sided graphics
05/18/2011	CN201838578U Single packaging structure for mounting of plating-to-carving chip with double-sided graphics
05/18/2011	CN201838577U Module packaging structure for inverted mounting of chip with double-sided graphics
05/18/2011	CN201838576U Single packaging structure for direct arranging of chip with double-sided graphics
05/18/2011	CN201838575U Flipchip thin-small outline packaged lead frame and package structure thereof
05/18/2011	CN201838574U DIP (dual in-line) package chip lead frame and packaging mold thereof
05/18/2011	CN201838573U Multi-row integrated circuit lead frame
05/18/2011	CN201838572U Novel semiconductor conducting wire jumper structure
05/18/2011	CN201838571U Novel thyristor water-cooling radiator
05/18/2011	CN201838570U Novel diode
05/18/2011	CN1944236B Semiconductor device, method for manufacturing the same and method for inspecting the same
05/18/2011	CN1930226B Modifier for resin and resin composition using the same and formed article
05/18/2011	CN1897789B Circuit board and connection structure
05/18/2011	CN1846307B Methods of processing thick ILD layers using spray coating or lamination
05/18/2011	CN1603300B Cyclohexanetricarboxylic monoester and its use
05/18/2011	CN102067336A Light-emitting device based on strain-adjustable InGaAlN film
05/18/2011	CN102067320A Method of producing flexible semiconductor device
05/18/2011	CN102067310A Stacking of wafer-level chip scale packages having edge contacts
05/18/2011	CN102067308A Active thermal control for stacked ic devices
05/18/2011	CN102067306A Integrated circuit inductors with reduced magnetic coupling
05/18/2011	CN102067305A Concentric vias in electronic substrate
05/18/2011	CN102067304A Cooling system, in particular for electronic structural units
05/18/2011	CN102067296A Jig for aligning leadframe
05/18/2011	CN102067293A Semiconductor device and method for manufacturing the same
05/18/2011	CN102067248A Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications
05/18/2011	CN102067144A Intrusion protection using stress changes
05/18/2011	CN102066864A Heat pipe, method of manufacturing heat pipe, and circuit board with heat pipe function
05/18/2011	CN102066863A Thermal transport device producing method and thermal transport device
05/18/2011	CN102066514A Resin composition, resin-containing carrier material, multi-layered printed circuit board, and semiconductor device
05/18/2011	CN102066493A Curable organopolysiloxane composition and semiconductor device
05/18/2011	CN102066492A Curable organopolysiloxane composition and semiconductor device
05/18/2011	CN102066254A Amorphous siliceous powder, process for production thereof, resin composition, and semiconductor encapsulation material
05/18/2011	CN102066045A Gold-tin-indium solder for processing compatibility with lead-free tin-based solder
05/18/2011	CN102066043A Lead-free solder alloy suppressed in occurrence of shrinkage cavity
05/18/2011	CN102065671A Method for combining evaporating ends of parallel heat pipes to fixed seat at same level
05/18/2011	CN102065668A Heat dissipating device
05/18/2011	CN102065665A Radiator and fan assembly
05/18/2011	CN102065663A Fastener and cooling device using same
05/18/2011	CN102065639A Capacitor loading structure with integrity-improved system-level packaged signals
05/18/2011	CN102065632A Electromagnetic bandgap structure and printed circuit board comprising the same

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