H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2011
05/24/2011	US7948756 Heat dissipation device
05/24/2011	US7948096 Semiconductor using specific contact angle for immersion lithography
05/24/2011	US7948095 Semiconductor package and method of making the same
05/24/2011	US7948094 Semiconductor device
05/24/2011	US7948093 Memory IC package assembly having stair step metal layer and apertures
05/24/2011	US7948091 Mounting structure for semiconductor element
05/24/2011	US7948090 Capillary-flow underfill compositions, packages containing same, and systems containing same
05/24/2011	US7948089 Chip stack package and method of fabricating the same
05/24/2011	US7948088 Semiconductor device
05/24/2011	US7948087 Electronic circuit with repetitive patterns formed by shadow mask vapor deposition and a method of manufacturing an electronic circuit element
05/24/2011	US7948086 Semiconductor device and a method of manufacturing the same and designing the same
05/24/2011	US7948084 Dielectric material with a reduced dielectric constant and methods of manufacturing the same
05/24/2011	US7948082 Method of fabricating a patterned nanoscopic article
05/24/2011	US7948081 Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device
05/24/2011	US7948080 Display device and manufacturing method of the same
05/24/2011	US7948078 Semiconductor device
05/24/2011	US7948077 Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement
05/24/2011	US7948076 Semiconductor chip assembly with post/base heat spreader and vertical signal routing
05/24/2011	US7948075 Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same
05/24/2011	US7948073 Three-dimensional package
05/24/2011	US7948072 Wafer-to-wafer stacking
05/24/2011	US7948071 Integrated circuit with re-route layer and stacked die assembly
05/24/2011	US7948070 Semiconductor package having impedance matching device
05/24/2011	US7948069 Surface mountable hermetically sealed package
05/24/2011	US7948067 Coil transducer isolator packages
05/24/2011	US7948066 Integrated circuit package system with lead locking structure
05/24/2011	US7948065 Integrated circuit having increased radiation hardness and reliability
05/24/2011	US7948064 System on a chip with on-chip RF shield
05/24/2011	US7948063 Semiconductor device with stress control film utilizing film thickness
05/24/2011	US7948062 Semiconductor device and method for manufacturing semiconductor device
05/24/2011	US7948060 Integrated circuit structure
05/24/2011	US7948059 Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate
05/24/2011	US7948046 Optoelectronic component
05/24/2011	US7948039 Semiconductor device and method for fabricating the same
05/24/2011	US7948036 I/O and power ESD protection circuits by enhancing substrate-bias in deep-submicron CMOS process
05/24/2011	US7948035 Decoding system capable of charging protection for flash memory devices
05/24/2011	US7948016 Off-center deposition of organic semiconductor in an organic semiconductor device
05/24/2011	US7948007 Power semiconductor module with flush terminal elements
05/24/2011	US7948006 Photodiode with high ESD threshold
05/24/2011	US7948001 LED lighting fixture
05/24/2011	US7948000 Method and system for hermetically sealing packages for optics
05/24/2011	US7947979 Semiconductor device
05/24/2011	US7947978 Semiconductor chip with bond area
05/24/2011	US7947779 Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
05/24/2011	US7947598 Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
05/24/2011	US7947593 Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure
05/24/2011	US7947375 Interlayer dielectric film
05/24/2011	US7947111 Methods and materials for the reduction and control of moisture and oxygen in OLED devices
05/24/2011	US7946763 Multi-layered thermal sensor for integrated circuits and other layered structures
05/19/2011	WO2011059569A1 Microelectronic device and method of manufacturing same
05/19/2011	WO2011059448A1 PARALLELIZED CHECK POINTING USING MATs AND THROUGH SILICON VIAs (TSVs)
05/19/2011	WO2011059070A1 Substrate for light-emitting elements and light-emitting device
05/19/2011	WO2011059036A1 Semiconductor device manufacturing method
05/19/2011	WO2011059035A1 Semiconductor device manufacturing method
05/19/2011	WO2011058977A1 Semiconductor device and method for manufacturing semiconductor device
05/19/2011	WO2011058879A1 Substrate with built-in functional element, manufacturing method of substrate with built-in functional element, and circuit board
05/19/2011	WO2011058720A1 Semiconductor device
05/19/2011	WO2011058718A1 Semiconductor apparatus
05/19/2011	WO2011058712A1 Semiconductor device and method for manufacturing semiconductor device
05/19/2011	WO2011058692A1 Transmission line and high-frequency device
05/19/2011	WO2011058688A1 Semiconductor device and noise suppression method
05/19/2011	WO2011058680A1 Semiconductor device
05/19/2011	WO2011058622A1 Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling device
05/19/2011	WO2011058607A1 Insulating structure and method for manufacturing same
05/19/2011	WO2011057538A1 Non-polarity 485 chip
05/19/2011	WO2011057433A1 Light emitting diode lamp bar and manufacture method thereof, light emitting diode lamp tube
05/19/2011	WO2011036112A3 Method for producing an electronic component and component produced according to said method
05/19/2011	WO2011013966A3 Method for manufacturing a heat-dissipating substrate for an led, and structure thereof
05/19/2011	WO2011008894A3 Semiconductor-on-insulator with back side support layer
05/19/2011	WO2010122437A3 Multilevel interconnection system
05/19/2011	US20110117716 Programmable capacitor associated with an input/output pad
05/19/2011	US20110117365 Single-walled carbon nanotube and aligned single-walled carbon nanotube bulk structure, and their production process, production apparatus and application use
05/19/2011	US20110117232 Semiconductor chip package with mold locks
05/19/2011	US20110116299 Semiconductor device
05/19/2011	US20110116247 Semiconductor package having multi pitch ball land
05/19/2011	US20110115498 Detection and Mitigation of Particle Contaminants in MEMS Devices
05/19/2011	US20110115101 Electronic circuit
05/19/2011	US20110115100 Semiconductor device
05/19/2011	US20110115099 Flip-chip underfill
05/19/2011	US20110115098 Integrated circuit package system with dual side connection and method for manufacturing thereof
05/19/2011	US20110115097 Area efficient through-hole connections
05/19/2011	US20110115096 Electrodepositing a metal in integrated circuit applications
05/19/2011	US20110115095 Method for manufacturing a plurality of thin chips and correspondingly manufactured thin chip
05/19/2011	US20110115094 STRUCTURES AND METHODS FOR PHOTO-PATTERNABLE LOW-k (PPLK) INTEGRATION
05/19/2011	US20110115093 Semiconductor device and method of forming the same
05/19/2011	US20110115092 Semiconductor device and method of manufacturing same
05/19/2011	US20110115091 Semiconductor device having groove-shaped via-hole
05/19/2011	US20110115090 Interconnect structure including a modified photoresist as a permanent interconnect dielectric and method of fabricating same
05/19/2011	US20110115089 Semiconductor device, production method for the same, and substrate
05/19/2011	US20110115088 Interconnect with flexible dielectric layer
05/19/2011	US20110115086 Metal nonoparticle compositions
05/19/2011	US20110115085 Semiconductor device and method of fabricating the same
05/19/2011	US20110115084 Lead-free solder connection structure and solder ball
05/19/2011	US20110115083 Semiconductor Package Assembly Systems and Methods using DAM and Trench Structures
05/19/2011	US20110115082 Configurable interposer
05/19/2011	US20110115081 Multilayer semiconductor device and electronic equipment
05/19/2011	US20110115080 Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
05/19/2011	US20110115079 Wafter and substructure for use in manufacturing electronic component packages
05/19/2011	US20110115078 Flip chip package
05/19/2011	US20110115077 Method for Reducing Voids in a Copper-Tin Interface and Structure Formed Thereby

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