H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2011
05/25/2011	CN102077343A Leadframe and method for manufacturing the same
05/25/2011	CN102077342A Monolithic structurally complex heat sink designs
05/25/2011	CN102077341A Packaged semiconductor product and method for manufacture thereof
05/25/2011	CN102077325A Film forming method and processing system
05/25/2011	CN102077323A Wiring structure, thin film transistor substrate, method for manufacturing thin film transistor substrate, and display device
05/25/2011	CN102076734A Modified resin composition, method for producing the same, and curable resin composition containing the same
05/25/2011	CN102076601A Mems device with independent rotation in two axes of rotation
05/25/2011	CN102076205A A heat radiation apparatus and a manufacturing method for the same
05/25/2011	CN102076203A Heat radiator for press packaging and cooling and packaging stack
05/25/2011	CN102074567A Backside illuminated imaging sensor with reinforced pad structure
05/25/2011	CN102074560A Semiconductor device
05/25/2011	CN102074559A SiP (Session Initiation Protocol) system integrated-level IC (Integrated Circuit) chip packaging part and manufacturing method thereof
05/25/2011	CN102074556A Semiconductor device and manufacturing method thereof
05/25/2011	CN102074555A Device and interconnect in flip chip architecture
05/25/2011	CN102074553A Semiconductor component with dielectric layer stack
05/25/2011	CN102074552A Semiconductor device packages and manufacturing methods thereof
05/25/2011	CN102074551A Semiconductor device packages and manufacturing method thereof
05/25/2011	CN102074550A Chip for measuring ohmic contact degradation of semiconductor device and method
05/25/2011	CN102074549A Interconnect with flexible dielectric layer
05/25/2011	CN102074548A Circuit layout structure
05/25/2011	CN102074547A Fuse structure
05/25/2011	CN102074546A Electronic device with fuse structure and method for repairing the same
05/25/2011	CN102074545A Integrated circuit element, semiconductor element and semiconductor technology
05/25/2011	CN102074544A Through-silicon via structure and a process for forming the same
05/25/2011	CN102074543A Packaging pedestal for semiconductor
05/25/2011	CN102074542A Double-flat integrated circuit (IC) chip packaging part with short pins and manufacturing method thereof
05/25/2011	CN102074541A Carrier-free pin-free grid-array IC (Integrated Circuit) chip packaging part and production method thereof
05/25/2011	CN102074540A Matrix dual in-line package (DIP) lead frame, integrated circuit (IC) packages based on frame and production method of IC packages
05/25/2011	CN102074539A Package for semiconductor devices
05/25/2011	CN102074538A Semiconductor device and lead frame thereof
05/25/2011	CN102074537A Chip packaging cell
05/25/2011	CN102074536A Power semiconductor device and manufacturing method therefor
05/25/2011	CN102074535A Electronic chip and substrate for providing insulating protection among conductive points
05/25/2011	CN102074534A Micro PCB radio frequency module and packaging method thereof
05/25/2011	CN102074533A Heat transfer unit for heat dissipation of electronic chip
05/25/2011	CN102074532A 热沉 Heat sink
05/25/2011	CN102074531A Object fixing jig and fixing device group thereof
05/25/2011	CN102074530A External cooling cap or board packaging structure of base-island embedded chip assembling lock hole radiating block
05/25/2011	CN102074529A Package structure of printed circuit board, normal chip, locking hole, radiating block and external radiator
05/25/2011	CN102074528A Encapsulation structure for heat radiator with upright chip, heat radiation block with lock hole and externally connected convex column of printed circuit board chip
05/25/2011	CN102074527A Package structure with exposed inner pins, chip, inverted locking hole, radiating block and external radiator
05/25/2011	CN102074526A Encapsulation structure of resin circuit board, positive chip, lock hole, radiating block and external radiator
05/25/2011	CN102074525A Upright packaging structure for radiating-block external radiator of printed circuit board chip
05/25/2011	CN102074524A Encapsulation structure of resin circuit board, inverted chip, lock hole, radiating block and external radiator
05/25/2011	CN102074523A Encapsulation structure of resin circuit board, inverted chip, lock hole, radiating block, convex column and external radiator
05/25/2011	CN102074522A Package structure with printed circuit boards (PCBs), chip, inverted locking hole, radiating block, convex column and external radiator
05/25/2011	CN102074521A Package structure of printed circuit board, flip-chip, radiating block and external radiator
05/25/2011	CN102074520A Encapsulation structure of resin circuit board, inverted chip and surface-bulged or fully coated radiating block
05/25/2011	CN102074519A Flip chip package structure with radiating block on printed circuit board (PCB)
05/25/2011	CN102074518A Semiconductor chip assembly with post/base heat spreader and conductive trace
05/25/2011	CN102074517A Ball grid array (BGA) package structure
05/25/2011	CN102074516A Semiconductor device packages and methods for manufacturing the same
05/25/2011	CN102074515A Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
05/25/2011	CN102074514A Encapsulation element and manufacturing method thereof
05/25/2011	CN102074513A Quad flat no-lead chip encapsulation structure and method
05/25/2011	CN102074512A Ultrathin tube shell
05/25/2011	CN102074511A Flip chip package and manufacturing method thereof
05/25/2011	CN102074510A Contact-mat array
05/25/2011	CN102074509A Integrated circuit chip packaging body and physical-layer interface arrangement assembly
05/25/2011	CN102074505A Liquid crystal on silicon (LCOS) device and manufacturing method thereof
05/25/2011	CN102074498A Integrated circuits and methods for forming the integrated circuits
05/25/2011	CN102074497A Semiconductor chip and method of manufacturing wafer stack package
05/25/2011	CN102074494A Thermosetting die-bonding film
05/25/2011	CN102074493A Thermosetting die bonding film
05/25/2011	CN102074487A 半导体组装结构与其形成方法 Structure and its method of forming a semiconductor assembly
05/25/2011	CN102074486A Method of forming an integrated circuit structure
05/25/2011	CN102074479A Semiconductor device and production method thereof
05/25/2011	CN102074272A Semiconductor device
05/25/2011	CN102072680A Boiling type radiator with high heat-conducting property
05/25/2011	CN102070735A Polymer, composition for protective layer, and patterning method using the same
05/25/2011	CN102069172A Composite casting method of aluminum cooling plate
05/25/2011	CN101800214B Construction method of anti-electromagnetic interference electronic module
05/25/2011	CN101771041B Complementary type SCR (Silicon Controlled Rectifier) structure by auxiliary triggering of PMOS (P-channel Metal Oxide Semiconductor) field effect transistors
05/25/2011	CN101728361B Structure of semiconductor device
05/25/2011	CN101673761B Semiconductor device and semiconductor subassembly
05/25/2011	CN101631896B Method of forming film, heat transfer member, power module, inverter for vehicle and vehicle
05/25/2011	CN101582394B Power MOSFET module with gate electrode resistance distribution
05/25/2011	CN101562165B Semiconductor device
05/25/2011	CN101545615B Light emitting diode surface light source device
05/25/2011	CN101542720B Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof
05/25/2011	CN101542717B Method of forming a micromechanical device with microfluidic lubricant channel
05/25/2011	CN101542701B Bonding method of three dimensional wafer lamination based on silicon through holes
05/25/2011	CN101536179B Lighting device package
05/25/2011	CN101471374B Image sensor and method for manufacturing the sensor
05/25/2011	CN101459375B Traction current transformer device
05/25/2011	CN101447503B Semiconductor device having capacitor element
05/25/2011	CN101425504B Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
05/25/2011	CN101419963B Wafer-wafer encapsulation body and manufacturing process therefor
05/25/2011	CN101383304B Slot type MOSFET and manufacturing method thereof
05/25/2011	CN101375651B Cooling apparatus of electronic device
05/25/2011	CN101335277B 半导体集成电路装置 The semiconductor integrated circuit device
05/25/2011	CN101320938B Multi-use power module
05/25/2011	CN101276811B Semiconductor device
05/25/2011	CN101271917B Antistatic structure of semiconductor lighting device and manufacturing method thereof
05/25/2011	CN101271880B Semiconductor device and method of manufacturing the same
05/25/2011	CN101271871B Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
05/25/2011	CN101221949B Face-centered cubic structure capacitor and manufacturing method thereof
05/25/2011	CN101086972B Multiple row exposed leads for mlp high density packages
05/24/2011	US7949983 High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
05/24/2011	US7948768 Tape circuit substrate with reduced size of base film

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