| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/26/2011 | US20110121459 Semiconductor interconnection |
| 05/26/2011 | US20110121458 Bonding Connection Between a Bonding Wire and a Power Semiconductor Chip |
| 05/26/2011 | US20110121457 Process for Reversing Tone of Patterns on Integrated Circuit and Structural Process for Nanoscale Production |
| 05/26/2011 | US20110121456 Techniques for Modular Chip Fabrication |
| 05/26/2011 | US20110121455 Semiconductor Devices Having Interconnection Structures |
| 05/26/2011 | US20110121454 Stack semiconductor package and method for manufacturing the same |
| 05/26/2011 | US20110121453 Semiconductor system-in-package and method for making the same |
| 05/26/2011 | US20110121452 Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers |
| 05/26/2011 | US20110121451 Electronic device and electronic apparatus |
| 05/26/2011 | US20110121450 Semiconductor device and fabrication method therefor |
| 05/26/2011 | US20110121449 Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP |
| 05/26/2011 | US20110121448 Semiconductor device and production method thereof |
| 05/26/2011 | US20110121447 Adhesive for connection of circuit member and semiconductor device using the same |
| 05/26/2011 | US20110121446 Fabrication of Atomic Scale Devices |
| 05/26/2011 | US20110121445 Semiconductor device and method for manufacturing the same |
| 05/26/2011 | US20110121444 Embedded chip packages |
| 05/26/2011 | US20110121443 Semiconductor device |
| 05/26/2011 | US20110121442 Package structure and package process |
| 05/26/2011 | US20110121441 Diode leadframe for solar module assembly |
| 05/26/2011 | US20110121440 Semiconductor device and lead frame thereof |
| 05/26/2011 | US20110121439 Semiconductor device with protruding component portion and method of packaging |
| 05/26/2011 | US20110121438 Extended under-bump metal layer for blocking alpha particles in a semiconductor device |
| 05/26/2011 | US20110121436 Method for forming dual high-k metal gate using photoresist mask and structures thereof |
| 05/26/2011 | US20110121433 Semiconductor chip and stacked semiconductor package having the same |
| 05/26/2011 | US20110121432 Semiconductor Device and Method of Forming Holes In Substrate to Interconnect Top Shield and Ground Shield |
| 05/26/2011 | US20110121427 Through-substrate vias with polymer fill and method of fabricating same |
| 05/26/2011 | US20110121426 Electronic device with fuse structure and method for repairing the same |
| 05/26/2011 | US20110121410 Semiconductor Contact Barrier |
| 05/26/2011 | US20110121395 Electrostatic discharge protection device for high voltage operation |
| 05/26/2011 | US20110121394 Chip and electrostatic discharge protection device thereof |
| 05/26/2011 | US20110121365 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 05/26/2011 | US20110121354 Method for Producing an Electronic Component and Electronic Component |
| 05/26/2011 | US20110121297 Wiring structure, thin film transistor substrate, method for manufacturing thin film transistor substrate, and display device |
| 05/26/2011 | US20110121295 Structure for Bumped Wafer Test |
| 05/26/2011 | US20110121294 Semiconductor device |
| 05/26/2011 | US20110121293 Apparatus and method for predetermined component placement to a target platform |
| 05/26/2011 | US20110121257 Growth of Single Crystal Nanowires |
| 05/26/2011 | US20110120689 Heat exchanger radiating fin structure and heat exchanger thereof |
| 05/26/2011 | US20110120679 Piezoelectric fan and cooling device |
| 05/26/2011 | DE10394263B4 Verfahren zur Herstellung einer integrierten Schaltung A method of fabricating an integrated circuit |
| 05/26/2011 | DE10358036B4 Verfahren zum Charakterisieren einer Tiefenstruktur in einem Substrat A method for characterizing a deep structure in a substrate |
| 05/26/2011 | DE102010051851A1 Dünnschichttransistor-Zusammensetzungen und damit verbundene Verfahren Thin-film transistor compositions and related methods |
| 05/26/2011 | DE102010051850A1 In Halbleiter-Packung-Anwendungen nützliche Interposerfilme und dazu in Beziehung stehende Verfahren In semiconductor packaging applications useful interposer movies and standing in relation to proceedings |
| 05/26/2011 | DE102010049625A1 Waferebenen-Halbleiterbauelement-Verbinder The wafer-level semiconductor device connector |
| 05/26/2011 | DE102009050178B3 Leistungshalbleitermodul mit einem eine dreidimensionale Oberflächenkontur aufweisenden Substrat sowie Herstellungsverfahren hierzu Power semiconductor module for this purpose with a three-dimensional surface contour containing substrate and manufacturing method |
| 05/26/2011 | DE102008022733B4 Funktionseinheit und Verfahren zu deren Herstellung Functional unit and methods for their preparation |
| 05/26/2011 | DE102007006706B4 Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu Circuitry with coupling device and manufacturing method therefor |
| 05/26/2011 | DE102006014145B4 Druck kontaktierte Anordnung mit einem Leistungsbauelement, einem Metallformkörper und einer Verbindungseinrichtung Pressure-contact arrangement with a power device, a metal mold body and a connecting means |
| 05/26/2011 | DE10160638B4 Halbleiterbauelement Semiconductor device |
| 05/25/2011 | EP2325882A1 Method for manufacturing semiconductor device |
| 05/25/2011 | EP2325881A1 Heat sink and cooling and packaging stack for press-packages |
| 05/25/2011 | EP2325880A2 Immersion cooling apparatus for a power semiconductor device |
| 05/25/2011 | EP2325879A2 Three-dimensional package module, method of fabricating the same, and method of fabricating passive device applied to the three-dimensional package module |
| 05/25/2011 | EP2325878A1 Wafer-scale encapsulation process of electronic devices |
| 05/25/2011 | EP2325876A2 Epoxy resin formulations for underfill applications |
| 05/25/2011 | EP2325875A1 Semiconductor device |
| 05/25/2011 | EP2325872A1 Bipolar semiconductor device and method for manufacturing same |
| 05/25/2011 | EP2325592A1 Method and fixture for manufacturing coplanar evaporators with multiple heat pipes and evaporator obtained by this method |
| 05/25/2011 | EP2325153A1 Process for production of aluminum-diamond composite |
| 05/25/2011 | EP2325150A1 Low temperature co-fired ceramic material, low temperature co-fired ceramic body, and multilayer ceramic substrate |
| 05/25/2011 | EP2324519A1 Contacting a device with a conductor |
| 05/25/2011 | EP2324515A2 Enhanced thermally isolated thermoelectrics |
| 05/25/2011 | EP2324512A2 Method of passivating and encapsulating cdte and czt segmented detectors |
| 05/25/2011 | EP2324500A1 System and method for excess voltage protection in a multi-die package |
| 05/25/2011 | EP2324499A1 Circuit for the parallel supplying of power during testing of a plurality of electronic devices integrated on a semiconductor wafer |
| 05/25/2011 | EP2324498A1 Method for making contactless portable objects |
| 05/25/2011 | EP2324497A1 3d chip-stack with fuse-type through silicon via |
| 05/25/2011 | EP2324379A1 Energy dissipating packages for high power operation of optical fiber components |
| 05/25/2011 | EP2324079A1 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device |
| 05/25/2011 | EP2324074A1 A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material |
| 05/25/2011 | EP2167869B1 Lighting device with pulsating fluid cooling |
| 05/25/2011 | EP2073254B1 Method of forming amorphous silica coating of low dielectric constant and amorphous silica coating of low dielectric constant obtained thereby |
| 05/25/2011 | CN201846563U Split heat pipe radiating device |
| 05/25/2011 | CN201846528U Printed circuit board with reliable welding spots, packaging device and packaging module |
| 05/25/2011 | CN201845780U Water cooled CCD (charge-coupled device) image sensor |
| 05/25/2011 | CN201845772U Miniaturized radiation-resistant detector assembly |
| 05/25/2011 | CN201845771U High-power module with novel encapsulating structure |
| 05/25/2011 | CN201845770U Integrated power semiconductor type power module |
| 05/25/2011 | CN201845769U Compact power module |
| 05/25/2011 | CN201845768U Electrostatic discharge protection structure |
| 05/25/2011 | CN201845767U Novel encapsulating structure of N-base diode anode-connected half-bridge in TO-220 |
| 05/25/2011 | CN201845766U Improved triode lead frame |
| 05/25/2011 | CN201845765U Lead frame for bearing chips |
| 05/25/2011 | CN201845764U Lead frame packaged by flip-chip small outline integrated circuit and packaging structure thereof |
| 05/25/2011 | CN201845763U IGBT (Insulated Gate Bipolar Translator) liquid cooling plate structure |
| 05/25/2011 | CN201845762U Temperature equilibrium plate |
| 05/25/2011 | CN201845761U Inorganic high-efficiency heat-pipe type heat radiator |
| 05/25/2011 | CN201845760U Fixing structure of radiator |
| 05/25/2011 | CN201845759U Radiator and radiating system |
| 05/25/2011 | CN201845758U Aluminium heat conducting plate |
| 05/25/2011 | CN201845757U Radiator buckling device |
| 05/25/2011 | CN201845756U Improved lead connecting structure for electric elements and substrate |
| 05/25/2011 | CN201845755U Electric crystal of stably arranged crystal plate |
| 05/25/2011 | CN201845754U Inverted chip packaging structure using carbon nano tube clusters as chip salient points |
| 05/25/2011 | CN201845290U Transferring rack for CPU (central processing unit) radiator |
| 05/25/2011 | CN201844724U Flat-plate soaking plate |
| 05/25/2011 | CN1913133B Method for preparing getter composition for screen printing |
| 05/25/2011 | CN102077704A Heat-management system for a cabinet containing electronic equipment |
| 05/25/2011 | CN102077700A Circuit module and method for manufacturing same |
| 05/25/2011 | CN102077345A Grounding system and apparatus |