| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 11/11/2014 | US8884442 Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact |
| 11/11/2014 | US8884441 Process of ultra thick trench etch with multi-slope profile |
| 11/11/2014 | US8884440 Integrated circuit device including through-silicon via structure having offset interface |
| 11/11/2014 | US8884439 Joining electrode, method of manufacturing the same, semiconductor device, and method of manufacturing the same |
| 11/11/2014 | US8884438 Magnetic microinductors for integrated circuit packaging |
| 11/11/2014 | US8884437 Electrical device with protruding contact elements and overhang regions over a cavity |
| 11/11/2014 | US8884436 Semiconductor device, memory system and method of manufacturing the semiconductor device |
| 11/11/2014 | US8884435 Semiconductor device |
| 11/11/2014 | US8884434 Method and system for improving reliability of a semiconductor device |
| 11/11/2014 | US8884433 Circuitry component and method for forming the same |
| 11/11/2014 | US8884432 Substrate and assembly thereof with dielectric removal for increased post height |
| 11/11/2014 | US8884431 Packaging methods and structures for semiconductor devices |
| 11/11/2014 | US8884430 Semiconductor device and method of confining conductive bump material during reflow with solder mask patch |
| 11/11/2014 | US8884429 Package structure having embedded electronic component and fabrication method thereof |
| 11/11/2014 | US8884427 Low CTE interposer without TSV structure |
| 11/11/2014 | US8884426 Semiconductor device including cooler |
| 11/11/2014 | US8884425 Thermal management in 2.5 D semiconductor packaging |
| 11/11/2014 | US8884424 Semiconductor package with single sided substrate design and manufacturing methods thereof |
| 11/11/2014 | US8884423 Image forming apparatus, chip, and chip package |
| 11/11/2014 | US8884422 Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture |
| 11/11/2014 | US8884421 Multi-chip package and method of manufacturing the same |
| 11/11/2014 | US8884420 Multichip device |
| 11/11/2014 | US8884419 Integrated circuit packaging configurations |
| 11/11/2014 | US8884418 Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps |
| 11/11/2014 | US8884416 Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip |
| 11/11/2014 | US8884415 IC package with stainless steel leadframe |
| 11/11/2014 | US8884414 Integrated circuit module with dual leadframe |
| 11/11/2014 | US8884413 Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture |
| 11/11/2014 | US8884411 Semiconductor device and manufacturing method thereof |
| 11/11/2014 | US8884410 Method for manufacturing a microelectronic package comprising at least one microelectronic device |
| 11/11/2014 | US8884409 Wafer backside doping for thermal neutron shielding |
| 11/11/2014 | US8884407 Devices for providing an electrical connection |
| 11/11/2014 | US8884405 Passivation scheme |
| 11/11/2014 | US8884403 Semiconductor die array structure |
| 11/11/2014 | US8884402 Circuit layout structure |
| 11/11/2014 | US8884400 Capacitor in Post-Passivation structures and methods of forming the same |
| 11/11/2014 | US8884399 Inductor device and fabrication method |
| 11/11/2014 | US8884398 Anti-fuse structure and programming method thereof |
| 11/11/2014 | US8884396 Semiconductor device and manufacturing method thereof |
| 11/11/2014 | US8884383 Semiconductor device and method of testing the same |
| 11/11/2014 | US8884377 Conductive line structures and methods of forming the same |
| 11/11/2014 | US8884343 System in package and method for manufacturing the same |
| 11/11/2014 | US8884339 Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process |
| 11/11/2014 | US8884338 Semiconductor integrated-circuit device with standard cells |
| 11/11/2014 | US8884324 Semiconductor light-emitting device |
| 11/11/2014 | US8884318 Semiconductor light emitting device having multi-cell array, light emitting module, and illumination apparatus |
| 11/11/2014 | US8884315 Semiconductor light emitting device and method of manufacturing the same |
| 11/11/2014 | US8884309 AC switch having compound semiconductor MOSFETs |
| 11/11/2014 | US8884289 Integrated mechanical device for electrical switching |
| 11/11/2014 | US8884288 Semiconductor structure with means for testing metal-insulator-metal capacitors |
| 11/11/2014 | US8884277 Thick film conductive composition and use thereof |
| 11/11/2014 | US8884165 Packaging device and base member for packaging |
| 11/11/2014 | US8883950 Silicone resin composition, encapsulating material, and light emitting diode device |
| 11/11/2014 | US8883913 Resin composition, resin film, semiconductor device, and production method thereof |
| 11/11/2014 | US8883883 Resin composition for encapsulating semiconductor and semiconductor device |
| 11/11/2014 | US8883647 Method of manufacturing of trench substrate |
| 11/11/2014 | US8883639 Semiconductor device having a nanotube layer and method for forming |
| 11/11/2014 | US8883634 Package interconnects |
| 11/11/2014 | US8883630 Method of forming contact holes |
| 11/11/2014 | US8883628 Electrical connection structure |
| 11/11/2014 | US8883627 Method for chip packaging |
| 11/11/2014 | US8883626 Interconnection structures and fabrication method thereof |
| 11/11/2014 | US8883625 Method for decomposing lines of an electronic circuit |
| 11/11/2014 | US8883615 Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes |
| 11/11/2014 | US8883610 Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines |
| 11/11/2014 | US8883608 Methods of manufacturing a semiconductor device |
| 11/11/2014 | US8883567 Process of making a stacked semiconductor package having a clip |
| 11/11/2014 | US8883566 Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure |
| 11/11/2014 | US8883565 Separation of semiconductor devices from a wafer carrier |
| 11/11/2014 | US8883564 Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member |
| 11/11/2014 | US8883562 Reconstituted wafer stack packaging with after-applied pad extensions |
| 11/11/2014 | US8883561 Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP |
| 11/11/2014 | US8883560 Manufacturing of a device including a semiconductor chip |
| 11/11/2014 | US8883559 Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP |
| 11/11/2014 | US8883541 Self-powered integrated circuit with multi-junction photovoltaic cell |
| 11/11/2014 | US8883287 Structured material substrates for flexible, stretchable electronics |
| 11/11/2014 | US8882276 Variable projector cooling apparatus and method |
| 11/11/2014 | US8881966 Method of manufacturing semiconductor device, and wire bonder |
| 11/11/2014 | US8881794 Cooling device |
| 11/11/2014 | US8881386 Power module production method, and power module produced thereby |
| 11/11/2014 | US8881382 Embedded printed circuit board and method of manufacturing the same |
| 11/11/2014 | US8881377 Method for determining a critical dimension at a plane of interest from a measurement taken at a test plane |
| 11/11/2014 | US8881370 Method of fabricating an inertial sensor |
| 11/06/2014 | US20140329386 Semiconductor package and method for manufacturing the same |
| 11/06/2014 | US20140329383 Semiconductor device with embedded heat spreading |
| 11/06/2014 | US20140329382 Method of fabricating semiconductor device having bump |
| 11/06/2014 | US20140329381 TSV Backside Reveal Structure and Exposing Process |
| 11/06/2014 | US20140329362 QFN/SON-Compatible Package |
| 11/06/2014 | US20140329361 Method for Mounting a Semiconductor Chip on a Carrier |
| 11/06/2014 | US20140329358 Electronic devices and components for high efficiency power circuits |
| 11/06/2014 | US20140328523 Chip package and method for forming the same |
| 11/06/2014 | US20140328130 Integrated circuit with bump connection scheme |
| 11/06/2014 | US20140328039 Systems and methods for void reduction in a solder joint |
| 11/06/2014 | US20140328032 Chip arrangement, chip card arrangement and method for manufacturing a chip arrangement |
| 11/06/2014 | US20140328023 Semiconductor package having emi shielding function and heat dissipation function |
| 11/06/2014 | US20140327157 Semiconductor device and method for manufacturing same |
| 11/06/2014 | US20140327156 Semiconductor package and method of manufacturing the same |
| 11/06/2014 | US20140327155 Semiconductor package and method of manufacturing the same |
| 11/06/2014 | US20140327153 Standard cell connection for circuit routing |
| 11/06/2014 | US20140327152 Chip package |