| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/01/2011 | CN101465365B Method of manufacturing non-volatility electric impedance memory |
| 06/01/2011 | CN101393901B Semiconductor device |
| 06/01/2011 | CN101388377B Silicon chip mark, implementing and reading method thereof |
| 06/01/2011 | CN101375650B Liquid-cooled heat radiation device |
| 06/01/2011 | CN101326634B Semiconductor device |
| 06/01/2011 | CN101322232B Solder deposition and thermal processing of thin-die thermal interface material |
| 06/01/2011 | CN101290915B 布局电路 The layout of the circuit |
| 06/01/2011 | CN101221942B Semiconductor device designing method |
| 06/01/2011 | CN101217154B A grid electrode drive circuit structure and display panel |
| 05/31/2011 | US7952880 Graphics card and heat dissipation method thereof |
| 05/31/2011 | US7952873 Passive conductive cooling module |
| 05/31/2011 | US7952442 Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure |
| 05/31/2011 | US7952434 Semiconductor device |
| 05/31/2011 | US7952213 Overlay mark arrangement for reducing overlay shift |
| 05/31/2011 | US7952212 Applications of smart polymer composites to integrated circuit packaging |
| 05/31/2011 | US7952211 Semiconductor assembly with component pads attached on die back side |
| 05/31/2011 | US7952210 Semiconductor package and fabrication method thereof |
| 05/31/2011 | US7952209 Integrated circuit package system with pad to pad bonding |
| 05/31/2011 | US7952208 Substrate, manufacturing method thereof, method for manufacturing semiconductor device |
| 05/31/2011 | US7952207 Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening |
| 05/31/2011 | US7952206 Solder bump structure for flip chip semiconductor devices and method of manufacture therefore |
| 05/31/2011 | US7952204 Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same |
| 05/31/2011 | US7952203 Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby |
| 05/31/2011 | US7952202 Method of embedding passive component within via |
| 05/31/2011 | US7952201 Semiconductor device including stacked semiconductor chips |
| 05/31/2011 | US7952200 Semiconductor device including a copolymer layer |
| 05/31/2011 | US7952199 Circuit board including solder ball land having hole and semiconductor package having the circuit board |
| 05/31/2011 | US7952198 BGA package with leads on chip |
| 05/31/2011 | US7952197 Electrical component |
| 05/31/2011 | US7952196 Affordable high performance high frequency multichip module fabrication and apparatus |
| 05/31/2011 | US7952195 Stacked packages with bridging traces |
| 05/31/2011 | US7952194 Silicon interposer-based hybrid voltage regulator system for VLSI devices |
| 05/31/2011 | US7952193 Method and apparatus for deploying a liquid metal thermal interface for chip cooling |
| 05/31/2011 | US7952192 Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof |
| 05/31/2011 | US7952191 Semiconductor device |
| 05/31/2011 | US7952190 Fabrication of microelectronic devices |
| 05/31/2011 | US7952189 Hermetic packaging and method of manufacture and use therefore |
| 05/31/2011 | US7952188 Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip |
| 05/31/2011 | US7952187 System and method of forming a wafer scale package |
| 05/31/2011 | US7952186 Semiconductor package land grid array substrate and plurality of first and second electrodes |
| 05/31/2011 | US7952185 Semiconductor device with hollow structure |
| 05/31/2011 | US7952183 High capacity memory with stacked layers |
| 05/31/2011 | US7952181 Wiring substrate for a multi-chip semiconductor device |
| 05/31/2011 | US7952180 Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit |
| 05/31/2011 | US7952179 Semiconductor package having through holes for molding back side of package |
| 05/31/2011 | US7952178 Package for an integrated circuit |
| 05/31/2011 | US7952177 Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads |
| 05/31/2011 | US7952176 Integrated circuit packaging system and method of manufacture thereof |
| 05/31/2011 | US7952175 Lead frame, semiconductor package including the lead frame and method of forming the lead frame |
| 05/31/2011 | US7952174 Method and apparatus providing air-gap insulation between adjacent conductors using nanoparticles |
| 05/31/2011 | US7952169 Isolation circuit |
| 05/31/2011 | US7952168 Substrate strip for semiconductor packages |
| 05/31/2011 | US7952137 Trench semiconductor device and method of making the same |
| 05/31/2011 | US7952123 Thin film transistor substrate and display device |
| 05/31/2011 | US7952120 Semiconductor device |
| 05/31/2011 | US7952112 RGB thermal isolation substrate |
| 05/31/2011 | US7951729 Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereor, and material for coupling a dielectric layer and a metal layer in a semiconductor device |
| 05/31/2011 | US7951713 Method of forming metal wiring in semiconductor device |
| 05/31/2011 | US7951712 Interconnections having double capping layer and method for forming the same |
| 05/31/2011 | US7951705 Multilayered cap barrier in microelectronic interconnect structures |
| 05/31/2011 | US7951704 Memory device peripheral interconnects and method of manufacturing |
| 05/31/2011 | US7951703 Interconnections for integrated circuits |
| 05/31/2011 | US7951681 Substrate-triggered bipolar junction transistor and ESD protection circuit |
| 05/31/2011 | US7951646 Solder ball landpad design to improve laminate performance |
| 05/31/2011 | US7951467 Cladding material and its manufacturing method, press-forming method, and heat sink using cladding material |
| 05/31/2011 | US7951301 Method for producing a ceramic printed-circuit board |
| 05/31/2011 | CA2416574C Silver containing copper alloy |
| 05/26/2011 | WO2011063247A2 Interposer films useful in semiconductor packaging applications, and methods relating thereto |
| 05/26/2011 | WO2011063238A1 Wire wrap compositions and methods relating thereto |
| 05/26/2011 | WO2011063229A1 Coverlay compositions and methods relating thereto |
| 05/26/2011 | WO2011063215A1 Assemblies comprising a polyimide film and an electrode, and methods relating thereto |
| 05/26/2011 | WO2011063204A1 Thermally and dimensionally stable polyimide films and methods relating thereto |
| 05/26/2011 | WO2011063166A2 Hybrid package construction with wire bond and through silicon vias |
| 05/26/2011 | WO2011062845A1 Devices with crack stops |
| 05/26/2011 | WO2011062666A1 Extended under-bump metal layer for blocking alpha particles in a semiconductor device |
| 05/26/2011 | WO2011062242A1 Sensor device and method of manufacture thereof |
| 05/26/2011 | WO2011062072A1 Electronic device |
| 05/26/2011 | WO2011062069A1 Cobalt film forming material and cobalt film forming method |
| 05/26/2011 | WO2011061989A1 Device substrate and method for manufacturing same |
| 05/26/2011 | WO2011061906A1 Semiconductor device |
| 05/26/2011 | WO2011061883A1 Semiconductor device |
| 05/26/2011 | WO2011061879A1 Semiconductor device and method for manufacturing same |
| 05/26/2011 | WO2011061779A1 Heat dissipating device and method for manufacturing heat dissipating device |
| 05/26/2011 | WO2011061695A2 Apparatus and method for processing a substrate |
| 05/26/2011 | WO2010138415A3 Semiconductor die attachment method using non-conductive screen print and dispense adhesive |
| 05/26/2011 | US20110124190 Method for manufacturing a semiconductor device |
| 05/26/2011 | US20110122592 First-level interconnects with slender columns, and processes of forming same |
| 05/26/2011 | US20110122578 Electronic device with heat dissipation module |
| 05/26/2011 | US20110122353 Active matrix substrate, display device, television apparatus, manufacturing method of an active matrix substrate, and manufacturing method of a display device |
| 05/26/2011 | US20110121848 Probe wafer, probe device, and testing system |
| 05/26/2011 | US20110121469 Passivation layer surface topography modifications for improved integrity in packaged assemblies |
| 05/26/2011 | US20110121468 Semiconductor package and method of making same |
| 05/26/2011 | US20110121467 Semiconductor device metal programmable pooling and dies |
| 05/26/2011 | US20110121466 Integrated circuit package system with warp-free chip |
| 05/26/2011 | US20110121465 Package stacking system with mold contamination prevention and method for manufacturing thereof |
| 05/26/2011 | US20110121464 Semiconductor Device and Method of Forming Electrical Interconnect with Stress Relief Void |
| 05/26/2011 | US20110121463 Semiconductor package, semiconductor device and methods of the same |
| 05/26/2011 | US20110121462 Semiconductor chip and semiconductor package including the same |
| 05/26/2011 | US20110121461 Semiconductor device and method of packaging a semiconductor device with a clip |
| 05/26/2011 | US20110121460 Semiconductor device having a multilayer interconnection structure |