| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/02/2011 | US20110127543 Semiconductor device |
| 06/02/2011 | US20110126903 Photovoltaic device |
| 06/01/2011 | EP2328173A1 Integrated battery and IC |
| 06/01/2011 | EP2328172A1 A power-electronic arrangement |
| 06/01/2011 | EP2328171A1 Method of producing dram integrated circuit device |
| 06/01/2011 | EP2327098A2 Method and apparatus for enhancing the triggering of an electrostatic discharge protection device |
| 06/01/2011 | EP2327097A1 Electronic component and method for the production thereof |
| 06/01/2011 | EP2327096A1 Improvements in or relating to solid-state lasers |
| 06/01/2011 | EP2327095A1 Semiconductor arrangement and method for producing a semiconductor arrangement |
| 06/01/2011 | EP2327094A1 Signal delivery in stacked device |
| 06/01/2011 | EP2327093A1 Stacked device identification assignment |
| 06/01/2011 | EP2327092A1 Corrosion control of stacked integrated circuits |
| 06/01/2011 | EP2326951A1 Apparatus and method for molecule detection using nanopores |
| 06/01/2011 | EP2326686A1 Curable organopolysiloxane composition and semiconductor device |
| 06/01/2011 | EP1987535B1 Method of making vias |
| 06/01/2011 | EP1819477B1 Method for welding two welding parts by means of a fillet weld |
| 06/01/2011 | EP1676471B1 Electronic device and method of manufacturing thereof |
| 06/01/2011 | EP1579155B1 Method and system for cooling high power density devices |
| 06/01/2011 | DE202011004472U1 Vapor-Chamber-Mikrokühler Vapor-Chamber-micro-cooler |
| 06/01/2011 | DE202011004469U1 Kühlrippenaufbau eines Kühlkörpers Fin structure of a heat sink |
| 06/01/2011 | DE202011004466U1 Dünne Wärmeplatte Thin plate heat |
| 06/01/2011 | DE202011004464U1 Kühlstruktur Cooling structure |
| 06/01/2011 | DE202011000346U1 Kühlkörpermodul Heat sink module |
| 06/01/2011 | DE112006000717B4 Chip-Scale-Packung und Herstellungsverfahren Chip scale package and manufacturing processes |
| 06/01/2011 | DE102010060798A1 Halbleitervorrichtung und Verfahren zum Verpacken einer Halbleitervorrichtung mit einer Klemme A semiconductor device and method of packaging a semiconductor device having a terminal |
| 06/01/2011 | DE102009056308A1 Metallisch kontaktiertes Substrat sowie Verfahren zu dessen Herstellung Metallic-contacted substrate and to processes for the preparation thereof |
| 06/01/2011 | DE102009056122A1 Verfahren zur Kontaktierung eines Chips A method for contacting a chip |
| 06/01/2011 | DE102009055717A1 Sensormodul und Herstellungsverfahren eines Sensormoduls Sensor module and manufacturing method of a sensor module |
| 06/01/2011 | DE102009047235A1 Schaltungseinrichtung und Leistungsschaltkreis mit der Schaltungseinrichtung Circuit, and power circuit with the circuit device |
| 06/01/2011 | DE102009034138B4 Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement Power semiconductor module having a sandwich with a power semiconductor component |
| 06/01/2011 | DE102008046188B4 Chip-Leiterplatten-Anordnung und Verfahren zum Herstellen einer Chip-Leiterplatten-Anordnung Chip circuit board assembly and method of manufacturing a chip PCB assembly |
| 06/01/2011 | DE102008016424B4 Verfahren mit einem Bilden einer Kontaktloshöffnung und eines Grabens in einer dielektrischen Schicht mit kleinem ε A process with a forming a Kontaktloshöffnung and a trench in a dielectric layer with a small ε |
| 06/01/2011 | CN201854541U Radiating assisting device for coolant of electronic element |
| 06/01/2011 | CN201854535U Mainboard heat sink unit and set top box with same |
| 06/01/2011 | CN201854533U Electronic device |
| 06/01/2011 | CN201853705U Mounting device for RC (resistor-capacitor) absorption circuit |
| 06/01/2011 | CN201853701U High-power brake unit |
| 06/01/2011 | CN201853700U Array type double in-line package (DIP) lead frame and integrated circuit (IC) encapsulating piece of frame |
| 06/01/2011 | CN201853699U Anti-crack and anti-seepage integrated circuit lead wire framework |
| 06/01/2011 | CN201853698U Short-pin triode lead frame |
| 06/01/2011 | CN201853697U Straight plate type thin triode lead frame |
| 06/01/2011 | CN201853696U Lead wire frame body for triodes which are arrayed and combined densely and compactly |
| 06/01/2011 | CN201853695U Power diode lead frame |
| 06/01/2011 | CN201853694U Multiple anti-cracking triode lead frame |
| 06/01/2011 | CN201853693U Triode lead frame |
| 06/01/2011 | CN201853692U Chip lead frame with dual in-line type packaging structure |
| 06/01/2011 | CN201853691U Lead frame of chip-on-lead package structure |
| 06/01/2011 | CN201853690U Electronic component with pin coated with soldering tin |
| 06/01/2011 | CN201853689U Integrated circuit encapsulation and application circuit board |
| 06/01/2011 | CN201853688U Radiating structure |
| 06/01/2011 | CN1808710B Thin film transistor array panel and method for manufacturing the same |
| 06/01/2011 | CN102084509A Aligned multiple emitter package |
| 06/01/2011 | CN102084482A Method of fabricating a semiconductor package or circuit assembly using a fluxing underfill composition applied to solder contact points in a dip process |
| 06/01/2011 | CN102084481A Planar electrical power electronic modules for high-temperature applications, and corresponding production methods |
| 06/01/2011 | CN102084480A Packaging device and base member for package |
| 06/01/2011 | CN102083930A Adhesive encapsulating composition and electronic devices made therewith |
| 06/01/2011 | CN102083886A Primer resin for semiconductor device, and semiconductor device |
| 06/01/2011 | CN102083881A Modified epoxy resin, epoxy resin compositions and cured articles |
| 06/01/2011 | CN102083582A Au-Ga-In brazing filler metal |
| 06/01/2011 | CN102083296A Heat radiating device |
| 06/01/2011 | CN102083293A Heat radiating device |
| 06/01/2011 | CN102083292A Heat radiating module |
| 06/01/2011 | CN102082373A Chip-on-board (COB) storing device |
| 06/01/2011 | CN102082220A LED and manufacturing process thereof |
| 06/01/2011 | CN102082181A Thin film transistor structure of pixel circuit for organic light emitting device |
| 06/01/2011 | CN102082160A Resistive random access memory and manufacturing method thereof |
| 06/01/2011 | CN102082149A Ballast structure for input and output ESD (Electro-Static Discharge) protection of full-metal silicide |
| 06/01/2011 | CN102082148A ESD (electrostatic discharge) protection circuit and manufacturing method thereof |
| 06/01/2011 | CN102082143A Figure filler structure inserted about inductor |
| 06/01/2011 | CN102082139A Semiconductor device having a multilayer interconnection structure |
| 06/01/2011 | CN102082138A Conductive structure and integrated circuit assembly |
| 06/01/2011 | CN102082137A Semiconductor device, print plate and semiconductor package |
| 06/01/2011 | CN102082136A Radiating device |
| 06/01/2011 | CN102082135A Heat radiating device |
| 06/01/2011 | CN102082134A Packaging structure of base island-embedded chip upright heat dissipation block external radiator |
| 06/01/2011 | CN102082133A Temperature-controlled radiator |
| 06/01/2011 | CN102082132A High-power semiconductor module structure and package thereof |
| 06/01/2011 | CN102082131A Chip package and fabrication method thereof |
| 06/01/2011 | CN102082130A Semiconductor package piece and manufacturing method thereof |
| 06/01/2011 | CN102082129A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/01/2011 | CN102082128A Semiconductor package and method of mounting semiconductor die to opposite sides of tsv substrate |
| 06/01/2011 | CN102082120A Chip package and fabrication method thereof |
| 06/01/2011 | CN102082115A Aluminum interconnection structure and method for forming aluminum interconnection structure |
| 06/01/2011 | CN102082107A Method and device for measuring temperature of chip |
| 06/01/2011 | CN102082105A Thermal wind sensor based on anodic bonding technology and preparation method thereof |
| 06/01/2011 | CN102082104A Method for manufacturing semiconductor device |
| 06/01/2011 | CN102082102A Semiconductor device and method of forming compliant stress relief buffer |
| 06/01/2011 | CN102082073A Production device, production method, test apparatus and integrated circuit package |
| 06/01/2011 | CN102080939A Heat-radiating component and method of manufacturing the same |
| 06/01/2011 | CN101814464B Composite phase change integrated cooling heat dissipation method and device for micro slot group of silicon controlled thyristor device |
| 06/01/2011 | CN101697054B A pixel design for a liquid crystal display capable of increasing opening rate |
| 06/01/2011 | CN101672462B LED radiator |
| 06/01/2011 | CN101661982B LED packager |
| 06/01/2011 | CN101632172B Structure for cooling semiconductor element |
| 06/01/2011 | CN101621044B Chip lug structure and manufacturing method thereof |
| 06/01/2011 | CN101562163B Semiconductor encapsulation structure by taking lead frame as substrate and applicable lead frame thereof |
| 06/01/2011 | CN101556838B Anisotropic conductive film |
| 06/01/2011 | CN101527278B Through via process and method for forming wafer stack |
| 06/01/2011 | CN101496168B Substrate and process for semiconductor flip chip package |
| 06/01/2011 | CN101467349B Wave demultiplexer |