H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2011
06/07/2011	US7956449 Stacked integrated circuit package system
06/07/2011	US7956448 Stacked structures and methods of fabricating stacked structures
06/07/2011	US7956447 Wafer scale die handling
06/07/2011	US7956446 Semiconductor device and method
06/07/2011	US7956445 Packaged integrated circuit having gold removed from a lead frame
06/07/2011	US7956444 Semiconductor device having electrode pad, and wireless circuit device including the semiconductor device
06/07/2011	US7956443 Through-wafer interconnects for photoimager and memory wafers
06/07/2011	US7956442 Backside connection to TSVs having redistribution lines
06/07/2011	US7956439 Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same
06/07/2011	US7956427 Nanosensors
06/07/2011	US7956419 Trench IGBT with depletion stop layer
06/07/2011	US7956418 ESD protection devices
06/07/2011	US7956399 Semiconductor device with low buried resistance and method of manufacturing such a device
06/07/2011	US7956385 Circuit for protecting a transistor during the manufacture of an integrated circuit device
06/07/2011	US7956384 Closed cell configuration to increase channel density for sub-micron planar semiconductor power device
06/07/2011	US7956365 Alternating current light emitting device with plural conductors of electrodes for coupling to adjacent light emitting unit
06/07/2011	US7956359 Contact structure and semiconductor device
06/07/2011	US7956357 Test pads coupled with leads unconnected with die pads
06/07/2011	US7956347 Integrated modulating retro-reflector
06/07/2011	US7955973 Method and apparatus for improvements in chip manufacture and design
06/07/2011	US7955966 Injection molded solder ball method
06/07/2011	US7955963 Dry etching method for semiconductor device
06/07/2011	US7955953 Method of forming stacked die package
06/07/2011	US7955906 Methods and systems for thermal-based laser processing a multi-material device
06/07/2011	US7955905 Methods and systems for thermal-based laser processing a multi-material device
06/07/2011	US7955903 Method of suppressing overflowing of an encapsulation resin in a semiconductor module
06/07/2011	US7955902 Manufacturing method of semiconductor device with surface mounting terminals
06/07/2011	US7955901 Method for producing a power semiconductor module comprising surface-mountable flat external contacts
06/07/2011	US7955884 Semiconductor packages
06/03/2011	WO2011066106A1 Embedded chip packages
06/03/2011	WO2011065544A1 Semiconductor device, three-dimensionally mounted semiconductor device, semiconductor module, electronic equipment, and manufacturing method therefor
06/03/2011	WO2011065485A1 Wiring substrate, imaging device and imaging device module
06/03/2011	WO2011065457A1 Laminate and manufacturing method for same
06/03/2011	WO2011065365A1 Epoxy resin composition for sealing semiconductors, and semiconductor devices
06/03/2011	WO2011065322A1 Method for manufacturing light emitting diode unit
06/03/2011	WO2011065321A1 Method for manufacturing light emitting diode unit
06/03/2011	WO2011065245A1 Cooling device for electronic component
06/03/2011	WO2011065155A1 Curable resin composition
06/03/2011	WO2011065154A1 Curable resin composition
06/03/2011	WO2011065044A1 Curable resin composition and cured product thereof
06/03/2011	WO2011064971A1 Production method for electronic device, electronic device, production method for electronic device package, and electronic device package
06/03/2011	WO2011064937A1 Semiconductor device and method for manufacturing same
06/03/2011	WO2011064873A1 Semiconductor device and method of producing same
06/03/2011	WO2011064841A1 Cooling structure of semiconductor device
06/03/2011	WO2011064817A1 Semiconductor device and method for manufacturing same
06/03/2011	WO2011064480A1 Mounting electronic components assembled by means of a clip in a package
06/03/2011	WO2011063713A1 Thermoelectric cooling apparatus of photonic integrated circuits
06/03/2011	WO2011043869A3 Semiconductor device having a copper plug
06/03/2011	WO2011041051A3 Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets
06/03/2011	WO2011035943A3 Cooling module for cooling electronic components
06/03/2011	WO2011006015A3 Techniques providing fiducial markers for failure analysis in a semiconductor die
06/03/2011	WO2008099940A9 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device
06/03/2011	CA2687016A1 Thermal conducting principle and device for prestressed-clamping type multi-layered structure
06/02/2011	US20110130891 Heatsink with a plurality of fans
06/02/2011	US20110129995 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
06/02/2011	US20110128668 Electrode of semiconductor device and method for fabricating capacitor
06/02/2011	US20110128520 Alignment systems and methods for lithographic systems
06/02/2011	US20110128399 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera
06/02/2011	US20110127681 Chip package and fabrication method thereof
06/02/2011	US20110127680 Spacer, and its manufacturing method
06/02/2011	US20110127679 Stacked Structure of Semiconductor Packages Including Through-Silicon Via and Inter-Package Connector, and Method of Fabricating the Same
06/02/2011	US20110127678 Integrated circuit packaging system with embedded circuitry and post
06/02/2011	US20110127677 Method of manufacturing semiconductor device, and semiconductor device
06/02/2011	US20110127676 Lead pin for semiconductor package and semiconductor package
06/02/2011	US20110127675 Laminate electronic device
06/02/2011	US20110127674 Layer structure for electrical contacting of semiconductor components
06/02/2011	US20110127673 Wiring structure and method
06/02/2011	US20110127672 Semiconductor package having a stacked wafer level package and method for fabricating the same
06/02/2011	US20110127671 Semiconductor device
06/02/2011	US20110127670 Chip package and manufacturing method thereof
06/02/2011	US20110127669 Solder structure, method for forming the solder structure, and semiconductor module including the solder structure
06/02/2011	US20110127668 Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
06/02/2011	US20110127667 Adhesive for connection of circuit member and semiconductor device using the same
06/02/2011	US20110127666 Chip package and fabrication method thereof
06/02/2011	US20110127665 Integrated circuit module
06/02/2011	US20110127664 Electronic package including high density interposer and circuitized substrate assembly utilizing same
06/02/2011	US20110127663 Magnetic particle-based composite materials for semiconductor packages
06/02/2011	US20110127662 Integrated circuit packaging system with stackable package and method of manufacture thereof
06/02/2011	US20110127661 Integrated circuit packaging system with flip chip and method of manufacture thereof
06/02/2011	US20110127660 Methods and materials for the reduction and control of moisture and oxygen in oled devices
06/02/2011	US20110127659 Package including an interposer having at least one topological feature
06/02/2011	US20110127658 Muti Thickness Lead Frame
06/02/2011	US20110127657 Wiring circuit structure and manufacturing method for semiconductor device using the structure
06/02/2011	US20110127656 Semiconductor-device mounted board and method of manufacturing the same
06/02/2011	US20110127655 Semiconductor device
06/02/2011	US20110127654 Semiconductor Package and Manufacturing Methods Thereof
06/02/2011	US20110127653 Package system with a shielded inverted internal stacking module and method of manufacture thereof
06/02/2011	US20110127649 3d interconnection structure and method of manufacturing the same
06/02/2011	US20110127648 Heat Spreader Structures in Scribe Lines
06/02/2011	US20110127647 Semiconductor device and method for making the same
06/02/2011	US20110127646 Wafer and method for forming the same
06/02/2011	US20110127645 Wafer and method for forming the same
06/02/2011	US20110127644 Wafer and method for forming the same
06/02/2011	US20110127643 Method and apparatus for conformable polishing
06/02/2011	US20110127642 Package including at least one topological feature on an encapsulant material to resist out-of-plane deformation
06/02/2011	US20110127637 Nanopillar E-Fuse Structure and Process
06/02/2011	US20110127636 Integrated passive device assembly
06/02/2011	US20110127635 Integrated BEOL Thin Film Resistor
06/02/2011	US20110127631 Solid-state imaging device, method for manufacturing solid-state imaging device, method for manufacturing solid-state imaging element, and semiconductor device
06/02/2011	US20110127626 Fabrication and Integration of Devices with Top and Bottom Electrodes Including Magnetic Tunnel Junctions

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