H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2011
06/08/2011	CN102088015A Semiconductor packaging piece and manufacture method thereof
06/08/2011	CN102088014A 3D (Three Dimensional) integrated circuit structure, semiconductor device and forming methods thereof
06/08/2011	CN102088013A Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
06/08/2011	CN102088012A Electronic component package body and manufacturing method thereof
06/08/2011	CN102088011A Interface structure for copper-copper peeling integrity
06/08/2011	CN102088010A Packaging structure of resin circuit board, chip and inverted heat dissipation block externally provided with radiator
06/08/2011	CN102088009A Paddle-exposed and chip-upright packaging structure for heat dissipation block with locking holes
06/08/2011	CN102088008A Inner-pin exposed and chip-inverted packaging structure for heat dissipation block with locking hole
06/08/2011	CN102088007A Packaging structure of printed plate board, chip and inverted T-shaped or rectangular radiating block with locking hole
06/08/2011	CN102088006A Packaging structure with resin circuit board, chip and inverted radiating block with locking hole
06/08/2011	CN102088005A Semiconductor device with filter circuit
06/08/2011	CN102088004A Integrated circuit element and flip chip package
06/08/2011	CN102087996A Method for manufacturing integrated circuit with thickened top and sub-top metals, and laminated inductor
06/08/2011	CN102087984A Molybdenum electrode lead structure of micro-diode and welding method
06/08/2011	CN102087983A Packaging and laminating method, packaging and laminating structure and circuit board system thereof
06/08/2011	CN102087975A Semiconductor device and manufacturing method thereof
06/08/2011	CN102087912A Laminated differential inductor with top layer metal and second layer metal of equal thickness
06/08/2011	CN102087911A Unequal-width on-chip stacked inductor with metals of unequal thicknesses
06/08/2011	CN102087909A Multi-path laminated inductor with inner path and outer path current compensation function
06/08/2011	CN102087908A Stack type differential inductor
06/08/2011	CN102087907A Laminated inductor for enhancing mutual inductance by using metal alignment
06/08/2011	CN102086364A Conductive silver paste for microelectronic packaging and preparation method thereof
06/08/2011	CN101794771B SIP (Session Initiation Protocol) chip and SOC (System On Chip) thereof
06/08/2011	CN101677116B Encapsulating method and encapsulating module for LED chip
06/08/2011	CN101622708B Semiconductor module and inverter apparatus
06/08/2011	CN101616567B Heat sink
06/08/2011	CN101605443B Heat dissipation device and heat dissipater thereof
06/08/2011	CN101599472B Semiconductor encapsulation structure with front face electricity conductivity but not base plate and producing method thereof
06/08/2011	CN101582409B Backend interconnect scheme with middle dielectric layer having improved strength
06/08/2011	CN101562190B Semiconductor apparatus and fabrication method of the same
06/08/2011	CN101562160B IC card packaging part and production method thereof
06/08/2011	CN101534626B Thermal module combination and radiator combination thereof
06/08/2011	CN101520165B Light emitting diode lighting device
06/08/2011	CN101490811B Method for manufacturing semiconductor device
06/08/2011	CN101483173B Semiconductor cooling structure
06/08/2011	CN101457914B LED lamp
06/08/2011	CN101453859B Loop type heat pipe radiator and manufacturing method thereof
06/08/2011	CN101423751B Thermal interfacial material and its preparation method
06/08/2011	CN101419973B TFT pixel construction implemented by third photo etching and manufacturing method thereof
06/08/2011	CN101408300B LED light fitting with heat radiation structure
06/08/2011	CN101405860B Aluminum bump bonding for fine aluminum wire
06/08/2011	CN101373758B Shield wiring structure
06/08/2011	CN101370371B Heat radiation model set and radiator used for the same
06/08/2011	CN101351876B Strip for integrated circuit packages having a maximized usable area and strip position recognition method
06/08/2011	CN101351108B Combination of radiating device
06/08/2011	CN101345241B Semiconductor device
06/08/2011	CN101330000B Semiconductor wafer with id mark, equipment for and method of manufacturing semiconductor device from them
06/08/2011	CN101325167B Method of manufacturing a semiconductor device having an even coating thickness and related device
06/08/2011	CN101315915B 半导体装置 Semiconductor device
06/08/2011	CN101309572B Heat radiating device
06/08/2011	CN101309568B Fastener
06/08/2011	CN101304044B Semiconductor device and method of forming the same
06/08/2011	CN101292348B Stackable wafer or die packaging with enhanced thermal and device performance
06/08/2011	CN101271913B Optical device, camera module, mobile phone, digital still camera, and medical endoscope
06/08/2011	CN101255959B Integration type LED array light source and method for manufacturing the same
06/08/2011	CN101252292B Integrated circuit device and electronic instrument
06/08/2011	CN101242730B Heat radiator
06/08/2011	CN101232022B Semiconductor device comprising a barrier insulating layer and related method
06/08/2011	CN101217859B Cooling system
06/08/2011	CN101212884B Heat radiator
06/08/2011	CN101197338B Semiconductor module, method for manufacturing semiconductor modules and mobile device
06/08/2011	CN101186802B Epoxy resin composition for multi-chip package and multi-chip package using same
06/08/2011	CN101180728B Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip
06/08/2011	CN101179082B The thin fime transistor plate and method for making the same
06/08/2011	CN101179071B Semiconductor integrated circuit and multi-chip module
06/08/2011	CN101165099B Heat stable aryl polysiloxane compositions
06/08/2011	CN101155493B Heat radiating device
06/08/2011	CN101154658B Chip having module unit and memory chip having several functional blocks
06/08/2011	CN101140914B Semiconductor switching module optimized for resistance to short circuits and housing thereof
06/08/2011	CN101110386B Process for improving the interconnect structures and resulting structure
06/08/2011	CN101098608B Heat radiator
06/08/2011	CN101064293B Package for optical device and method of manufacturing the same
06/08/2011	CN101005024B Method of treatment of porous dielectric films to reduce damage during cleaning
06/07/2011	USRE42429 Semiconductor module with serial bus connection to multiple dies
06/07/2011	US7957137 Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
06/07/2011	US7956671 Circuit structure and method for programming and re-programming a low power, multiple states, electronic fuse (e-fuse)
06/07/2011	US7956517 MEMS structure having a stress inverter temperature-compensated resonator member
06/07/2011	US7956475 Step cavity for enhanced drop test performance in ball grid array package
06/07/2011	US7956474 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types
06/07/2011	US7956473 Semiconductor device
06/07/2011	US7956472 Packaging substrate having electrical connection structure and method for fabricating the same
06/07/2011	US7956471 Mold and substrate for use with mold
06/07/2011	US7956470 Semiconductor device
06/07/2011	US7956467 Semiconductor device and method of manufacturing the same
06/07/2011	US7956466 Structure for interconnect structure containing various capping materials for electrical fuse and other related applications
06/07/2011	US7956465 Reducing resistivity in interconnect structures of integrated circuits
06/07/2011	US7956464 Sputtering target and semiconductor device manufactured using the same
06/07/2011	US7956463 Large grain size conductive structure for narrow interconnect openings
06/07/2011	US7956462 Semiconductor device and manufacturing method thereof
06/07/2011	US7956461 Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer
06/07/2011	US7956460 Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device
06/07/2011	US7956459 Semiconductor device and method of assembly
06/07/2011	US7956458 Metal clad fiber optics for enhanced heat dissipation
06/07/2011	US7956457 System and apparatus for venting electronic packages and method of making same
06/07/2011	US7956456 Thermal interface material design for enhanced thermal performance and improved package structural integrity
06/07/2011	US7956455 RF power transistor package
06/07/2011	US7956454 Wiring board and ceramic chip to be embedded
06/07/2011	US7956453 Semiconductor package with patterning layer and method of making same
06/07/2011	US7956452 Flip chip packages
06/07/2011	US7956450 Multi-chip package

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