| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/09/2011 | US20110133329 Semiconductor device and method of manufacturing the same |
| 06/09/2011 | US20110133328 Semiconductor device having heat radiating configuration |
| 06/09/2011 | US20110133327 Semiconductor package of metal post solder-chip connection |
| 06/09/2011 | US20110133326 Reducing Plating Stub Reflections in a Chip Package Using Resistive Coupling |
| 06/09/2011 | US20110133325 Integrated circuit packaging system with interconnect and method of manufacture thereof |
| 06/09/2011 | US20110133324 Multi-chip stacked package and its mother chip to save interposer |
| 06/09/2011 | US20110133323 Semiconductor device with sealed semiconductor chip |
| 06/09/2011 | US20110133322 Leadframe for leadless package, structure and manufacturing method using the same |
| 06/09/2011 | US20110133321 Semiconductor device and manufacturing method thereof |
| 06/09/2011 | US20110133320 Semiconductor package and method of manufacturing the same |
| 06/09/2011 | US20110133319 Auxiliary leadframe member for stabilizing the bond wire process |
| 06/09/2011 | US20110133318 SiP SUBSTRATE |
| 06/09/2011 | US20110133317 Semiconductor device |
| 06/09/2011 | US20110133316 Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof |
| 06/09/2011 | US20110133315 System support for electronic components and method for production thereof |
| 06/09/2011 | US20110133311 Semiconductor device and method of manufacturing semiconductor device |
| 06/09/2011 | US20110133309 Semiconductor device and manufacturing method therefor |
| 06/09/2011 | US20110133307 Damage propagation barrier |
| 06/09/2011 | US20110133303 MIM/MIS structure with praseodymium titanate or praseodymium oxide as insulator material |
| 06/09/2011 | US20110133296 Semiconductor device, and communication apparatus and electronic apparatus having the same |
| 06/09/2011 | US20110133254 Crosstalk reduction in electrical interconnects using differential signaling |
| 06/09/2011 | US20110133201 Electronic circuit |
| 06/09/2011 | US20110133186 Process for manufacturing a semiconductor wafer having soi-insulated wells and semiconductor wafer thereby manufactured |
| 06/09/2011 | US20110133185 Semiconductor device formation substrate and semiconductor device manufacturing method |
| 06/09/2011 | US20110133184 Semiconductor device |
| 06/09/2011 | US20110132582 Fan module and heat dissipation device incorporating the same |
| 06/09/2011 | US20110132449 Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices |
| 06/09/2011 | DE202011004473U1 Flaches Wärmerohr und dessen Herstellungsverfahren Flat heat pipe and its manufacturing method |
| 06/09/2011 | DE202011004460U1 Wärmerohr Heat pipe |
| 06/09/2011 | DE202011002341U1 Wärmeaustauscher mit Fluidteilung Heat exchanger with fluid division |
| 06/09/2011 | DE202011002244U1 Wärmeaustauscher Heat exchanger |
| 06/09/2011 | DE202010013239U1 Befestigungsanordnung eines Wärmeableitmoduls Mounting arrangement of a Wärmeableitmoduls |
| 06/09/2011 | DE112007000478B4 Intergrierte Schaltung mit einem Thermoelement Intergrated circuit including a thermocouple |
| 06/09/2011 | DE112004002138B4 Optobauteil-Gehäusekonstruktion Optocomponent housing construction |
| 06/09/2011 | DE102010062419A1 Bereichsunterteiltes Substrat und Halbleiterbauelement Range Divided substrate and semiconductor device |
| 06/09/2011 | DE102010060503A1 Laminatelektronikbauelement Laminate electronic component |
| 06/09/2011 | DE102010051765A1 Package mit einem Unterfüllmaterial in einem Teil eines Bereichs zwischen dem Package und einem Substrat oder einem anderen Package Package with an underfill material in a part of a region between the package and a substrate or a different package |
| 06/09/2011 | DE102010042046A1 Leistungshalbleitervorrichtung für Zündvorrichtung Power semiconductor device for primer |
| 06/09/2011 | DE102009057416A1 Power semiconductor module, has heat conductive paste layer that is provided with number of bars spaced along longitudinal central line of module, where bars are tapered from longitudinal central line at both ends |
| 06/09/2011 | DE102009057146A1 Druckkontaktiertes Leistungshalbleitermodul mit Hybriddruckspeicher Pressure-contacted power semiconductor module with hybrid accumulator |
| 06/09/2011 | DE102009057145A1 Druckkontaktiertes Leistungshalbleitermodul mit teilweise bandartigen Lastanschlusselementen Pressure-contacted power semiconductor module with partial band-like load connection elements |
| 06/09/2011 | DE102009056663A1 Metallisierung mit hoher Leistungsverträglichkeit und hoher elektrischer Leitfähigkeit Metallization with high power compatibility and high electrical conductivity |
| 06/09/2011 | DE102009056562A1 Integrated circuit part, has metallic regions provided above gate region resting on covering layers, partially arranged between strip conductors and not connected with drain-contact, source-contact or gate-contact |
| 06/09/2011 | DE102009056290A1 Device for cooling e.g. micro processor, arranged on printed circuit board i.e. graphic card, of computer, has connecting unit i.e. blind hole, cooperating with another connecting unit i.e. thread, for removable mounting of coolers |
| 06/09/2011 | DE102009053472A1 Elektronische Baugruppe und Verfahren zu deren Herstellung An electronic assembly and methods for their preparation |
| 06/09/2011 | DE102009047670A1 Schaltungseinrichtung mit einem Halbleiter-Bauelement Circuit means comprising a semiconductor device |
| 06/09/2011 | DE102009047599A1 Elektromechanischer Mikroschalter zur Schaltung eines elektrischen Signals, mikroelektromechanisches System, integrierte Schaltung und Verfahren zur Herstellung einer integrierten Schaltung The micro electromechanical switch for switching an electrical signal, microelectromechanical system, integrated circuit and methods for making an integrated circuit |
| 06/09/2011 | DE102009047592A1 Silicon sub-carrier manufacturing method for installing e.g. electronic device, on substrate, involves applying electrically conductive material on insulation layer to form through-connection from one side to another side of substrate |
| 06/09/2011 | DE102009047506A1 Sensor mit einem Sensorgehäuse Sensor with a sensor casing |
| 06/09/2011 | DE102009047438A1 Leuchtvorrichtung und Verfahren zum Kontaktieren einer Leuchtvorrichtung A lighting apparatus and method for contacting a lighting device |
| 06/09/2011 | DE102009047374A1 Method for manufacturing micro and/or nano chip carrier component, involves arranging chip on carrier, and applying pressure on chip against carrier, so that adhesive layer is formed between chip and carrier |
| 06/09/2011 | DE102009047352A1 Schichtaufbau zu elektrischen Kontaktierung von Halbleiterbauelementen Layer structure for electrically contacting semiconductor devices |
| 06/09/2011 | DE102005047566C5 Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu Arrangement with a power semiconductor device and a housing and manufacturing method therefor |
| 06/08/2011 | EP2330873A1 Electronic module |
| 06/08/2011 | EP2330621A1 Package on package method, structure and associated PCB system |
| 06/08/2011 | EP2330618A1 Rebuilt wafer assembly |
| 06/08/2011 | EP2329702A1 Thermally conductive gel packs |
| 06/08/2011 | EP2329698A1 Mitigation of whiskers in sn-films |
| 06/08/2011 | EP2329525A1 Heat sink blockage detector |
| 06/08/2011 | EP2329524A2 Method of patterning a metal on a vertical sidewall of an excavated feature, method of forming an embedded mim capacitor using same, and embedded memory device produced thereby |
| 06/08/2011 | EP2329337A1 Heat exchanger device and method for heat removal or transfer |
| 06/08/2011 | EP2329057A2 Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom |
| 06/08/2011 | EP2193701B1 Directly injected forced convection cooling for electronics |
| 06/08/2011 | EP2010500B1 Arrangement for contacting power semiconductors to a cooling surface |
| 06/08/2011 | EP1866962B1 Carbon nanotube bond pad structure and manufacturing method thereof |
| 06/08/2011 | EP1785441B1 Epoxy resin composition, products of curing thereof, material for the encapsulation of semiconductors, novel phenol resin, novel epoxy resin, process for production of novel phenol resin and process for production of novel epoxy resin |
| 06/08/2011 | EP1374652B1 Shunt power connection for an integrated circuit package |
| 06/08/2011 | EP1194886B2 Chip card with a flexible chip |
| 06/08/2011 | CN201860522U Case with Internally balanced heat transferring and dissipating structure |
| 06/08/2011 | CN201859876U Heat radiating structure of IGBT module and device |
| 06/08/2011 | CN201859875U 8N lead wire framework |
| 06/08/2011 | CN201859874U 7P lead wire framework |
| 06/08/2011 | CN201859873U Radiating device |
| 06/08/2011 | CN201859872U Air-cooled radiator for IGBT (insulated gate bipolar transistor) |
| 06/08/2011 | CN201859871U Radiating device with vortex generators |
| 06/08/2011 | CN201859870U Radiating device with vortex generators |
| 06/08/2011 | CN201859869U Fixed seat structure |
| 06/08/2011 | CN201859868U Heat radiation body |
| 06/08/2011 | CN201859867U Packaging structure for integrated circuit |
| 06/08/2011 | CN201859866U Semiconductor packaging device |
| 06/08/2011 | CN1955209B Method of producing high molecular weight organopolysiloxane, compositon comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof |
| 06/08/2011 | CN1930683B Conductive material compositions, apparatus, systems, and methods |
| 06/08/2011 | CN1901179B Tape wiring substrate and chip-on-film package using the same |
| 06/08/2011 | CN1894156B Method to test the hermeticity of a sealed cavity of microelement and the microelement to implementing the method |
| 06/08/2011 | CN1883018B High frequency thin film electrical circuit element |
| 06/08/2011 | CN1881241B Non-contact data carrier and method of fabricating the same |
| 06/08/2011 | CN1769364B Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 06/08/2011 | CN1759643B Cooling structure for electronic equipment |
| 06/08/2011 | CN102090156A Electronic assembly and method for the production thereof |
| 06/08/2011 | CN102089894A Heat exchanger for a thermoelectric thin layer element |
| 06/08/2011 | CN102089879A Heat-conductive noise suppression sheet |
| 06/08/2011 | CN102089826A Proximity optical memory module |
| 06/08/2011 | CN102089581A Remote cooling by combining heat pipe and resonator for synthetic jet cooling |
| 06/08/2011 | CN102088835A Conduction holder of fan and heat radiating device with same |
| 06/08/2011 | CN102088822A PCB (printed circuit board) substrate with welding spot self-protection function and manufacturing process of pad of PCB substrate |
| 06/08/2011 | CN102088241A Stacked inductor-electronic package assembly and technique for manufacturing the same |
| 06/08/2011 | CN102088056A Economical minaturized assembly and connection technology for optoelectronic modules |
| 06/08/2011 | CN102088035A Trench MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) and manufacturing method thereof |
| 06/08/2011 | CN102088025A Thin film transistor substrate and method of manufacturing the same |
| 06/08/2011 | CN102088019A Three-dimensional laminated element with an interconnect structure and manufacturing method thereof |