| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/14/2011 | US7961474 Heat dissipation device and power module |
| 06/14/2011 | US7961472 Electric circuit device, electric circuit module, and power converter |
| 06/14/2011 | US7961471 Image processing apparatus with heat dissipating structure |
| 06/14/2011 | US7961462 Use of vortex generators to improve efficacy of heat sinks used to cool electrical and electro-optical components |
| 06/14/2011 | US7960847 Packaging structure of SIP and a manufacturing method thereof |
| 06/14/2011 | US7960846 Semiconductor device having improved solder joint and internal lead lifetimes |
| 06/14/2011 | US7960845 Flexible contactless wire bonding structure and methodology for semiconductor device |
| 06/14/2011 | US7960844 3-dimensional flash memory device, method of fabrication and method of operation |
| 06/14/2011 | US7960843 Chip arrangement and method of manufacturing a chip arrangement |
| 06/14/2011 | US7960842 Structure of high performance combo chip and processing method |
| 06/14/2011 | US7960841 Through-hole via on saw streets |
| 06/14/2011 | US7960840 Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level |
| 06/14/2011 | US7960839 Semiconductor interconnection line and method of forming the same |
| 06/14/2011 | US7960838 Interconnect structure |
| 06/14/2011 | US7960837 Semiconductor package |
| 06/14/2011 | US7960836 Redundant micro-loop structure for use in an integrated circuit physical design process and method of forming the same |
| 06/14/2011 | US7960835 Fabrication of metal film stacks having improved bottom critical dimension |
| 06/14/2011 | US7960834 Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body |
| 06/14/2011 | US7960832 Integrated circuit arrangement with layer stack |
| 06/14/2011 | US7960831 Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same |
| 06/14/2011 | US7960830 Electronic assembly having a multilayer adhesive structure |
| 06/14/2011 | US7960829 Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates |
| 06/14/2011 | US7960828 Carrier frame for electronic components and production method for electronic components |
| 06/14/2011 | US7960827 Thermal via heat spreader package and method |
| 06/14/2011 | US7960826 Dielectric layer structure |
| 06/14/2011 | US7960825 Chip package and method for fabricating the same |
| 06/14/2011 | US7960824 Semiconductor device including power supply pad and trunk wiring which are arranged at the same layer level |
| 06/14/2011 | US7960823 Semiconductor device with different sized ESD protection elements |
| 06/14/2011 | US7960822 Package on package substrate |
| 06/14/2011 | US7960820 Semiconductor package |
| 06/14/2011 | US7960819 Leadframe-based packages for solid state emitting devices |
| 06/14/2011 | US7960818 Conformal shield on punch QFN semiconductor package |
| 06/14/2011 | US7960817 Semiconductor power module with flexible circuit leadframe |
| 06/14/2011 | US7960816 Semiconductor package with passive device integration |
| 06/14/2011 | US7960815 Leadframe design for QFN package with top terminal leads |
| 06/14/2011 | US7960814 Stress relief of a semiconductor device |
| 06/14/2011 | US7960806 Sub-mount, light emitting diode package and manufacturing method thereof |
| 06/14/2011 | US7960797 Semiconductor devices including fine pitch arrays with staggered contacts |
| 06/14/2011 | US7960767 System for programmable gate array with sensor array |
| 06/14/2011 | US7960764 Semiconductor device manufacturing method and semiconductor device |
| 06/14/2011 | US7960760 Electrically programmable fuse |
| 06/14/2011 | US7960759 Integrated circuit layout pattern for cross-coupled circuits |
| 06/14/2011 | US7960746 Low resistance electrode and compound semiconductor light emitting device including the same |
| 06/14/2011 | US7960732 Thin film transistor array panel and manufacturing method thereof |
| 06/14/2011 | US7960728 Method of manufacturing TFT substrate and TFT substrate |
| 06/14/2011 | US7960657 Electrical device |
| 06/14/2011 | US7960489 Interlayer insulating film, method for forming the same and polymer compositon |
| 06/14/2011 | US7960290 Method of fabricating a semiconductor device |
| 06/14/2011 | US7960272 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging |
| 06/14/2011 | US7960271 Semiconductor device and method of manufacturing the same |
| 06/14/2011 | US7960270 Method for fabricating circuit component |
| 06/14/2011 | US7960215 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
| 06/14/2011 | US7960212 Structure of high performance combo chip and processing method |
| 06/14/2011 | US7960211 Semiconductor system-in-package and method for making the same |
| 06/14/2011 | US7960209 Semiconductor device assembly process |
| 06/14/2011 | US7960190 Temporary package for at-speed functional test of semiconductor chip |
| 06/14/2011 | US7959830 Articles comprising high-electrical-conductivity nanocomposite material and method for fabricating same |
| 06/14/2011 | US7958935 Low-profile thermosyphon-based cooling system for computers and other electronic devices |
| 06/14/2011 | US7958934 Counter-stream-mode oscillating-flow heat transport apparatus |
| 06/14/2011 | US7958629 Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components |
| 06/09/2011 | WO2011068913A1 Methods and apparatus for inductors with integrated passive and active elements |
| 06/09/2011 | WO2011068888A1 Pre-stressed gamma densitometer window and method of fabrication |
| 06/09/2011 | WO2011068777A2 Slotted configuration for optimized placement of micro-components using adhesive bonding |
| 06/09/2011 | WO2011068677A1 Compact media player |
| 06/09/2011 | WO2011068597A1 Use of calcium oxide as a water scavenger in solar module applications |
| 06/09/2011 | WO2011068092A1 Epoxy resin composition |
| 06/09/2011 | WO2011067885A1 Semiconductor device |
| 06/09/2011 | WO2011067882A1 Semiconductor integrated circuit and semiconductor device provided with the same, and electronic equipment |
| 06/09/2011 | WO2011067281A1 Metallization having high power compatibility and high electrical conductivity |
| 06/09/2011 | WO2011067276A1 Heterostructure for electronic power components, optoelectronic or photovoltaic components |
| 06/09/2011 | WO2011067085A1 Sealed electronic housing and method for the sealed assembly of such a housing |
| 06/09/2011 | WO2011067053A1 High-speed ceramic modules with hybrid referencing scheme |
| 06/09/2011 | WO2011066863A1 Semiconductor chip with backside metallization and arrangement of said chip on a carrier |
| 06/09/2011 | WO2011066749A1 Double fan structure |
| 06/09/2011 | WO2011066728A1 Comound material accumulation type of whole enclosing gate cmos field effect transistor |
| 06/09/2011 | WO2011019805A3 Heatsink having one or more ozone catalyzing fins |
| 06/09/2011 | WO2010141778A3 Apparatus and method for frequency generation |
| 06/09/2011 | US20110136297 Integrated circuit chip that supports through-chip electromagnetic communication |
| 06/09/2011 | US20110135015 Cooling devices in semiconductor packages |
| 06/09/2011 | US20110134608 Semiconductor device |
| 06/09/2011 | US20110133880 Integrated circuit inductor with integrated vias |
| 06/09/2011 | US20110133827 Semiconductor integrated circuit device |
| 06/09/2011 | US20110133347 Method and apparatus of providing overlay |
| 06/09/2011 | US20110133346 Adhesive for connection of circuit member and semiconductor device using the same |
| 06/09/2011 | US20110133345 Manufacturing method for electronic device |
| 06/09/2011 | US20110133344 Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices |
| 06/09/2011 | US20110133343 Semiconductor device |
| 06/09/2011 | US20110133342 Wiring board, manufacturing method of the wiring board, and semiconductor package |
| 06/09/2011 | US20110133341 Semiconductor package and method of manufacturing the same |
| 06/09/2011 | US20110133340 Package substrate and semiconductor apparatus |
| 06/09/2011 | US20110133339 Semiconductor Structure and Method for Making the Same |
| 06/09/2011 | US20110133338 Conductor bump method and apparatus |
| 06/09/2011 | US20110133337 Area reduction for surface mount package chips |
| 06/09/2011 | US20110133336 Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device |
| 06/09/2011 | US20110133335 Through-Silicon Via With Air Gap |
| 06/09/2011 | US20110133334 Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch |
| 06/09/2011 | US20110133333 Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers, and methods of fabricating same |
| 06/09/2011 | US20110133332 Package substrate and method of fabricating the same |
| 06/09/2011 | US20110133331 Interface structure for copper-copper peeling integrity |
| 06/09/2011 | US20110133330 Low temperature curing compositions |