| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/15/2011 | CN102097431A Chip and electro-static discharge (ESD) protection element thereof |
| 06/15/2011 | CN102097428A Integrated circuit wafer and integrated circuit wafer cutting method |
| 06/15/2011 | CN102097427A Laminate Electronic Device |
| 06/15/2011 | CN102097417A Integrated power semiconductor power module |
| 06/15/2011 | CN102097416A High-power module with novel packaging structure |
| 06/15/2011 | CN102097415A Semiconductor packaging piece and manufacture method thereof |
| 06/15/2011 | CN102097414A Semiconductor device with marked conduction columns |
| 06/15/2011 | CN102097413A Structure and method for testing integrity of grid oxide layer and dielectric layer |
| 06/15/2011 | CN102097412A Embedded bit line structure, field effect transistor structure with the same and method of fabricating the same |
| 06/15/2011 | CN102097411A Semiconductor packaging structure and packaging method thereof |
| 06/15/2011 | CN102097410A Lead structure of coating with enhanced welding strength |
| 06/15/2011 | CN102097409A Semiconductor device and method for manufacturing the same |
| 06/15/2011 | CN102097408A Wafer level semiconductor device connector |
| 06/15/2011 | CN102097407A Semiconductor package and manufacturing method thereof |
| 06/15/2011 | CN102097406A Encapsulation insulating clad structure of single grain size semiconductor element and clad method |
| 06/15/2011 | CN102097405A Electronic component and inspection system |
| 06/15/2011 | CN102097404A Wafer level chip scale packaging structure with low substrate resistance and manufacturing method thereof |
| 06/15/2011 | CN102097403A Chip heat sink and chip cooling device with same |
| 06/15/2011 | CN102097402A DC (Direct Current) device for equalizing pressure of converter valve waterway |
| 06/15/2011 | CN102097401A Semiconductor element cooling apparatus |
| 06/15/2011 | CN102097400A Seamless combinatorial structure of duct heaters |
| 06/15/2011 | CN102097399A Heat conduction for chip stacks and 3-D circuits |
| 06/15/2011 | CN102097398A Packaging structure with resin circuit boards, normally assembled chip and radiating block |
| 06/15/2011 | CN102097397A Device including package and system and its method |
| 06/15/2011 | CN102097396A Stress buffer to protect device features |
| 06/15/2011 | CN102097395A Substrate structure with embedded chip |
| 06/15/2011 | CN102097394A Semiconductor device and method for manufacturing the same |
| 06/15/2011 | CN102097393A Semiconductor device |
| 06/15/2011 | CN102097392A Mounting device of conductive ball |
| 06/15/2011 | CN102097391A Power semiconductor module |
| 06/15/2011 | CN102097366A Active area bonding compatible high current structures |
| 06/15/2011 | CN102097359A Contact hole and method for etching same |
| 06/15/2011 | CN102097347A Manufacturing method of semiconductor integrated circuit device |
| 06/15/2011 | CN102097346A Power semiconductor package |
| 06/15/2011 | CN102097345A Method for directly depositing metal line patterns on surface of insulating base material |
| 06/15/2011 | CN102097344A Producing method of semiconductor device |
| 06/15/2011 | CN102097343A Wire bonding method for copper wire and support plate pad and structure |
| 06/15/2011 | CN102097339A Semiconductor device and method of manufacturing the same |
| 06/15/2011 | CN102097336A Semiconductor structure and manufacturing method thereof |
| 06/15/2011 | CN102097335A Packaging structure and packaging process thereof |
| 06/15/2011 | CN102097333A Method for designing circuit board, circuit board and electronic device |
| 06/15/2011 | CN102097332A Conduction hole structure of encapsulation substrate and manufacturing method thereof |
| 06/15/2011 | CN102097330A Conduction structure of encapsulation substrate and manufacturing method thereof |
| 06/15/2011 | CN102097329A Embedded conduction structure of encapsulation substrate and manufacturing method thereof |
| 06/15/2011 | CN102097324A Semiconductor component and manufacturing method thereof |
| 06/15/2011 | CN102097301A Semiconductor device and method of forming an inductor on polymer matrix composite substrate |
| 06/15/2011 | CN102097287A Method for monitoring chip groove depth and wafer |
| 06/15/2011 | CN102097284A Control method and device for making alignment marks |
| 06/15/2011 | CN102096256A 像素阵列结构 Pixel array structure |
| 06/15/2011 | CN102095888A Heat-type wind-speed and wind-direction sensor with heat insulation structure and preparation method thereof |
| 06/15/2011 | CN102095323A Flat-panel vapor chamber |
| 06/15/2011 | CN102093559A Electronic packaging polyimide material and synthesizing method thereof |
| 06/15/2011 | CN102093408A Benzocyclobutene substituted annular siloxane monomer as well as preparation method and application of benzocyclobutene substituted cyclic annular siloxane monomer |
| 06/15/2011 | CN101840902B Direct chip placing lead frame structure and production method thereof |
| 06/15/2011 | CN101714564B Image sensor device with opaque coating |
| 06/15/2011 | CN101697343B Film encapsulation method |
| 06/15/2011 | CN101681880B Semiconductor device |
| 06/15/2011 | CN101676630B LED bulb |
| 06/15/2011 | CN101656239B Bonding welding disk lowering parasitic capacitance and preparing method thereof |
| 06/15/2011 | CN101651181B Light-emitting diode |
| 06/15/2011 | CN101635291B Mini-size package lead frame structure and processing method thereof |
| 06/15/2011 | CN101626007B Ultrathin pre-plating layer lead frame and preparation method thereof |
| 06/15/2011 | CN101621068B Image sensor |
| 06/15/2011 | CN101615584B Packaging method of chip reconfiguration structure |
| 06/15/2011 | CN101599496B Base plate and mother base plate of thin-film transistor |
| 06/15/2011 | CN101599480B Semiconductor chip encapsulating structure |
| 06/15/2011 | CN101573791B High-z structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels |
| 06/15/2011 | CN101566329B Method for applying ultravacuum heat sink to modular high-power LED street lamp |
| 06/15/2011 | CN101533784B Light emitting diode encapsulating structure and production method thereof |
| 06/15/2011 | CN101527298B Circuit board having conductive shield member and semiconductor package using the same |
| 06/15/2011 | CN101527288B Contact point structure and jointing structure |
| 06/15/2011 | CN101521194B High-speed photoelectric subassembly |
| 06/15/2011 | CN101510533B Novel microelectronic device radiator |
| 06/15/2011 | CN101500393B Heat radiating module |
| 06/15/2011 | CN101494966B Radiating module with dedusting mechanism and combination of electronic device and radiating module |
| 06/15/2011 | CN101483168B Molding mode SIM card encapsulation construction based on metal frame and encapsulation method thereof |
| 06/15/2011 | CN101465299B Method for manufacturing grind used in encapsulation structure of chip reconfiguration |
| 06/15/2011 | CN101460040B Heat radiating device and electronic device having the heat radiating device |
| 06/15/2011 | CN101427365B Semiconductor sensor device and method for manufacturing same |
| 06/15/2011 | CN101416304B Heat conducting paste for improving thermal contact, usage method of heat conduction connector provided by heat conducting paste and device thereof |
| 06/15/2011 | CN101373748B Wafer-class encapsulation structure and preparation method thereof |
| 06/15/2011 | CN101345234B Electronic module and fabrication method thereof |
| 06/15/2011 | CN101334965B El display panel, power supply line drive apparatus, and electronic device |
| 06/15/2011 | CN101325174B Method for forming Ti film and TiN film, contact structure, computer readable storing medium and computer program |
| 06/15/2011 | CN101321799B Liquid resin composition for electronic element and electronic element device |
| 06/15/2011 | CN101217135B Package structure membrane of flip chip package |
| 06/15/2011 | CN101202262B Semiconductor device and method for manufacturing the same |
| 06/15/2011 | CN101189717B Printed wiring board with built-in semiconductor element and method for manufacturing same |
| 06/15/2011 | CN101177234B Electronic device and method for manufacturing thereof |
| 06/15/2011 | CN101154343B Display device |
| 06/15/2011 | CN101115351B Electronic components packaging structure |
| 06/15/2011 | CN101102658B Heat sink arrangement, electric motor, housing part, and springy clip |
| 06/15/2011 | CN101084250B Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition |
| 06/15/2011 | CN101055871B Semiconductor storage device |
| 06/15/2011 | CN101049056B Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method |
| 06/15/2011 | CN101026183B Display device and manufacturing method, method of prevention of connect piece and Share electrode short circuit |
| 06/15/2011 | CN101026178B Heat efficiency reduced minimum phase change memory and its making method |
| 06/15/2011 | CN101026173B Semiconductor device and method for manufacturing same |
| 06/14/2011 | USRE42457 Methods of packaging an integrated circuit and methods of forming an integrated circuit package |
| 06/14/2011 | US7961478 Integrated circuit, and a mobile phone having the integrated circuit |