| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/16/2011 | US20110140264 Semiconductor device and manufacturing method thereof |
| 06/16/2011 | US20110140263 Semiconductor Device and Method of Forming PIP with Inner Known Good Die Interconnected with Conductive Bumps |
| 06/16/2011 | US20110140262 Module package with embedded substrate and leadframe |
| 06/16/2011 | US20110140261 Integrated circuit packaging system with interconnect and method of manufacture thereof |
| 06/16/2011 | US20110140260 Chip assembly with chip-scale packaging |
| 06/16/2011 | US20110140259 Integrated circuit packaging system with stacking interconnect and method of manufacture thereof |
| 06/16/2011 | US20110140258 Integrated circuit packaging system with package stacking and method of manufacture thereof |
| 06/16/2011 | US20110140257 Printed Circuit Board having Embedded Dies and Method of Forming Same |
| 06/16/2011 | US20110140256 Semiconductor device, substrate and semiconductor device manufacturing method |
| 06/16/2011 | US20110140255 Semiconductor die package including ic driver and bridge |
| 06/16/2011 | US20110140254 Panel Based Lead Frame Packaging Method And Device |
| 06/16/2011 | US20110140253 Dap ground bond enhancement |
| 06/16/2011 | US20110140252 Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof |
| 06/16/2011 | US20110140251 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof |
| 06/16/2011 | US20110140250 Leadframe for semiconductor package |
| 06/16/2011 | US20110140249 Tie bar and mold cavity bar arrangements for multiple leadframe stack package |
| 06/16/2011 | US20110140248 Semiconductor device and manufacturing method thereof |
| 06/16/2011 | US20110140247 Integrated circuit packaging system with shielded package and method of manufacture thereof |
| 06/16/2011 | US20110140245 Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures |
| 06/16/2011 | US20110140237 Semiconductor package |
| 06/16/2011 | US20110140236 Integrated Circuit with Pads Connected by an Under-Bump Metallization and Method for Production Thereof |
| 06/16/2011 | US20110140235 Semiconductor device and method of manufacturing semiconductor device |
| 06/16/2011 | US20110140234 Fuse of semiconductor device and method for forming the same |
| 06/16/2011 | US20110140232 Methods of forming a thermal conduction region in a semiconductor structure and structures resulting therefrom |
| 06/16/2011 | US20110140231 Integrated microelectronic device with through-vias |
| 06/16/2011 | US20110140214 Pattern arrangement method, silicon wafer and semiconductor device |
| 06/16/2011 | US20110140185 Semiconductor integrated circuit device and manufacture thereof |
| 06/16/2011 | US20110140126 Heat conduction for chip stacks and 3-d circuits |
| 06/16/2011 | US20110140105 Semiconductor device and method of manufacturing the same |
| 06/16/2011 | US20110140104 Embedded structure for passivation integrity testing |
| 06/16/2011 | DE112009001746T5 Verpackung eines eingebetteten Chips und Verfahrensablauf unter Verwendung eines vorgeformten Trägers Packaging an embedded chips and procedure using a preformed carrier |
| 06/16/2011 | DE112009001448T5 Verfahren zum Herstellen eines Keramikformkörpers A method of manufacturing a ceramic formed body |
| 06/16/2011 | DE10392224T5 Drucksensor, Elektroikkomponente für Durchflussmesser und Verfahren zum Herstellen derselben Pressure sensor, Elektroikkomponente for flowmeters and methods for manufacturing the same |
| 06/16/2011 | DE10227344B4 Verfahren zum Herstellen von Kontaktlöchern für einen Kondensator einer Halbleitervorrichtung A method for producing of contact holes for a capacitor of a semiconductor device |
| 06/16/2011 | DE102010060502A1 Elektronische Steuervorrichtung für Leistungs-MOS-Feldeffekttransistor Electronic control device for power MOS field effect transistor |
| 06/16/2011 | DE102010043904A1 Leistungselektroniksubstrat für direkte Substratkühlung Power electronics substrate for direct substrate cooling |
| 06/16/2011 | DE102010042583A1 Leistungshalbleitervorrichtung für Zündvorrichtung Power semiconductor device for primer |
| 06/16/2011 | DE102009047703A1 Electronic circuit for use in automotive area, has heat producing component exhibiting housing side that is connected with printed circuit board by attachment element, which separates housing side regarding heat transfer from circuit board |
| 06/16/2011 | DE102009039677B4 Verfahren und Vorrichtung zur Unterstützung von Green-IT und energieautarker Systeme Method and apparatus for supporting Green IT and energy self-sufficient systems |
| 06/16/2011 | DE102006058694B4 Leistungshalbleitermodul mit Kontaktfedern Power semiconductor module with contact springs |
| 06/16/2011 | DE102004014911B4 Zweiseitig kühlendes Halbleitermodul Two-sided cooling semiconductor module |
| 06/16/2011 | DE10019888B4 Transparente elektronische Bauelementanordnung und Verfahren zu ihrer Herstellung Transparent electronic component assembly and process for their preparation |
| 06/15/2011 | EP2334159A1 Coupling modules of an electronic device |
| 06/15/2011 | EP2334158A1 Bridge coupling of modules in an electronic device |
| 06/15/2011 | EP2333831A1 Packaging an electronic device |
| 06/15/2011 | EP2333829A2 Enhanced Thermally Isolated Thermoelectrics |
| 06/15/2011 | EP2333828A1 High-frequency circuit package, and sensor module |
| 06/15/2011 | EP2333826A1 Magnetic memory element and storage device using same |
| 06/15/2011 | EP2333825A2 Microelectronic device integrated with crosslinks |
| 06/15/2011 | EP2333797A1 Inductor structure |
| 06/15/2011 | EP2333476A1 Heat exchanger and method of manufacturing same |
| 06/15/2011 | EP2332173A1 Method and device for cooling electronic components generating heat using a coolant |
| 06/15/2011 | EP2332095A1 Surface sensor |
| 06/15/2011 | EP2331454A1 Process of fabricating microfluidic device chips and chips formed thereby |
| 06/15/2011 | EP1644974B1 Method of forming pecvd silicon-rich oxide layer for reduced uv charging in an eeprom |
| 06/15/2011 | EP1587705B1 Integrated component |
| 06/15/2011 | EP1477048B1 Method for embedding a component in a base |
| 06/15/2011 | CN201869481U Aluminum profile for radiator |
| 06/15/2011 | CN201868422U Cascade wafer structure |
| 06/15/2011 | CN201868419U Lead frame for manufacture of semiconductor discrete devices |
| 06/15/2011 | CN201868418U Shaped copper strip for lead frame |
| 06/15/2011 | CN201868417U Lead for diode |
| 06/15/2011 | CN201868416U Encapsulating structure of power semiconductor part |
| 06/15/2011 | CN201868415U Air-cooled heat radiator section |
| 06/15/2011 | CN201868414U Heat pipe radiator |
| 06/15/2011 | CN201868413U Temperature-equalizing heat conductor structure |
| 06/15/2011 | CN201868412U Modified radiating structure for TO-series products |
| 06/15/2011 | CN201868411U 散热器 Heat sink |
| 06/15/2011 | CN201868410U Heat radiation device of multidirectional sound wave transmission heat source |
| 06/15/2011 | CN201868409U Thin-type radiating flip-chip packaging structure |
| 06/15/2011 | CN201868396U Insulated pull rod of power semiconductor and pressing device thereof |
| 06/15/2011 | CN1970675B Resin composition for sealing optical device , its cured product and method of sealing semiconductor element |
| 06/15/2011 | CN1929137B High density hybrid Metal-Oxide -Semiconductor Field Effect Transistor device |
| 06/15/2011 | CN1918583B Electronic device |
| 06/15/2011 | CN1855467B Semiconductor device and method of manufacturing same |
| 06/15/2011 | CN1820928B Lid made of resin for case for accommodating solid-state imaging device and manufacture method of the same |
| 06/15/2011 | CN1765162B Ceramic multilayer substrate |
| 06/15/2011 | CN1664683B 电子电路 Electronic circuit |
| 06/15/2011 | CN1645991B 多层印刷电路板 Multilayer printed circuit board |
| 06/15/2011 | CN102099912A Method and apparatus for forming i/o clusters in integrated circuits |
| 06/15/2011 | CN102099911A Embedded die package and process flow using a pre-molded carrier |
| 06/15/2011 | CN102099910A Power electronics device |
| 06/15/2011 | CN102099909A Semiconductor device and manufacturing method |
| 06/15/2011 | CN102099908A Getter precursors for hermetically sealed packaging |
| 06/15/2011 | CN102099905A 半导体装置及显示装置 The semiconductor device and display device |
| 06/15/2011 | CN102099904A Methods and systems for packaging integrated circuits with thin metal contacts |
| 06/15/2011 | CN102099861A Memory system and method using stacked memory device dice, and system using the memory system |
| 06/15/2011 | CN102099848A Active matrix substrate, display panel, display device, and active matrix substrate manufacturing method |
| 06/15/2011 | CN102099282A Method for packaging semiconductors at a wafer level |
| 06/15/2011 | CN102098901A Heat radiating device |
| 06/15/2011 | CN102098900A Electronic device and heat radiating device thereof |
| 06/15/2011 | CN102098899A Heat radiating device |
| 06/15/2011 | CN102098898A General serial bus device |
| 06/15/2011 | CN102098876A Manufacturing process for circuit substrate |
| 06/15/2011 | CN102098872A Pad structure and manufacturing method thereof |
| 06/15/2011 | CN102097920A Absorption circuit for high-power power electronic power device |
| 06/15/2011 | CN102097809A Thyristor valve block of static var compensator (SVC) |
| 06/15/2011 | CN102097495A Integrated circuit, capacitor and its formation method |
| 06/15/2011 | CN102097472A Process for forming a wiring film, a transistor, and an electronic device |
| 06/15/2011 | CN102097433A Trench metal-oxide semiconductor field effect transistor (MOSFET) and manufacture method thereof |