H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2011
06/22/2011	CN101253246B Insulating liquid die-bonding agent and semiconductor device
06/22/2011	CN101188243B 薄膜晶体管面板及其制造方法 The thin film transistor panel and manufacturing method
06/22/2011	CN101183670B Semiconductor device, stacked semiconductor device and interposer substrate
06/22/2011	CN101154577B Semiconductor device and method of manufacturing the same
06/22/2011	CN101151683B Conductor powder and process for producing the same, and electrically conductive resin composition
06/22/2011	CN101131999B Semiconductor integrated circuit and testing method of same
06/22/2011	CN101083243B Integrated circuit package and its manufacture method
06/21/2011	US7965511 Cross-flow thermal management device and method of manufacture thereof
06/21/2011	US7965507 Heat dissipation device having a fan holder thereon
06/21/2011	US7965506 Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder
06/21/2011	US7965368 Display device comprising a semiconductor chip including a first terminal which overlaps a first and second line, the first terminal connected to the first line and overlapping and insulated from the second line
06/21/2011	US7964975 Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
06/21/2011	US7964974 Electronic chip package with reduced contact pad pitch
06/21/2011	US7964973 Chip structure
06/21/2011	US7964972 Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same
06/21/2011	US7964969 Semiconductor device having via connecting between interconnects
06/21/2011	US7964968 Semiconductor integrated circuit
06/21/2011	US7964967 High surface area aluminum bond pad for through-wafer connections to an electronic package
06/21/2011	US7964966 Via gouged interconnect structure and method of fabricating same
06/21/2011	US7964965 Forming thick metal interconnect structures for integrated circuits
06/21/2011	US7964964 Method of packaging and interconnection of integrated circuits
06/21/2011	US7964963 Semiconductor package and method for manufacturing semiconductor package
06/21/2011	US7964962 Method of manufacturing a semiconductor apparatus
06/21/2011	US7964961 Chip package
06/21/2011	US7964960 Semiconductor device having non parallel cleavage planes in a substrate and supporting substrate
06/21/2011	US7964959 Semiconductor chip, method of fabricating the same and stacked package having the same
06/21/2011	US7964958 Heatsink structure for solid-state image sensor
06/21/2011	US7964957 Circuit substrate, circuit device and manufacturing process thereof
06/21/2011	US7964956 Circuit packaging and connectivity
06/21/2011	US7964955 Electronic device package and electronic equipment
06/21/2011	US7964954 Integrated circuit having a semiconductor sensor device with embedded column-like spacers
06/21/2011	US7964953 Stacked type chip package structure
06/21/2011	US7964952 Stacked semiconductor package assembly having hollowed substrate
06/21/2011	US7964951 Multi-die semiconductor package with heat spreader
06/21/2011	US7964950 Electronic parts packaging structure and method of manufacturing the same
06/21/2011	US7964949 Tenon-and-mortise packaging structure
06/21/2011	US7964948 Chip stack, chip stack package, and method of forming chip stack and chip stack package
06/21/2011	US7964947 Stacking packages with alignment elements
06/21/2011	US7964946 Semiconductor package having discrete components and system containing the package
06/21/2011	US7964945 Glass cap molding package, manufacturing method thereof and camera module
06/21/2011	US7964944 System on package of a mobile RFID interrogator
06/21/2011	US7964943 Light emitting device
06/21/2011	US7964942 Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same
06/21/2011	US7964941 Semiconductor device and manufacturing method of the same
06/21/2011	US7964940 Chip package with asymmetric molding
06/21/2011	US7964939 Semiconductor device and method of manufacturing same
06/21/2011	US7964938 Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig
06/21/2011	US7964937 Multilayer dielectric substrate and semiconductor package
06/21/2011	US7964936 Electronic device package with electromagnetic compatibility (EMC) coating thereon
06/21/2011	US7964934 Fuse target and method of forming the fuse target in a copper process flow
06/21/2011	US7964893 Forming ESD diodes and BJTs using FinFET compatible processes
06/21/2011	US7964494 Integrated connection arrangements
06/21/2011	US7964472 Method of producing semiconductor device
06/21/2011	US7964256 Housing shell for an electronic device
06/21/2011	US7963628 Method for the printing of homogeneous electronic material with a multi-ejector print head
06/16/2011	WO2011072225A1 Printed circuit board having embedded dies and method of forming same
06/16/2011	WO2011071780A1 Chip assembly with chip-scale packaging
06/16/2011	WO2011071726A2 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
06/16/2011	WO2011071626A1 Power electronic assembly with slotted heatsink
06/16/2011	WO2011071603A2 Module package with embedded substrate and leadframe
06/16/2011	WO2011071600A2 Thin foil for use in packaging integrated circuits
06/16/2011	WO2011071566A1 Tie bar and mold cavity bar arrangements for multiple leadframe stack package
06/16/2011	WO2011071508A1 Igbt cooling method
06/16/2011	WO2011071111A1 Resin substrate with built-in electronic component and electronic circuit module
06/16/2011	WO2011070944A1 Active matrix substrate and display device
06/16/2011	WO2011070739A1 Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device using epoxy resin composition
06/16/2011	WO2011070735A1 Electronic device
06/16/2011	WO2011070694A1 Semiconductor device and method for manufacturing same
06/16/2011	WO2011070495A1 Electronic component with protection casing and related production method
06/16/2011	WO2011070087A1 Packaging an electronic device
06/16/2011	WO2011069828A1 Electronic control device
06/16/2011	WO2011069737A1 Circuit device comprising a semiconductor component
06/16/2011	WO2011069307A1 Method and system for detecting led's life
06/16/2011	WO2011025579A3 Electronic package system
06/16/2011	US20110143137 Composite Nanorods
06/16/2011	US20110140289 Resin composition for encapsulating optical semiconductor element and optical semiconductor device
06/16/2011	US20110140288 Systems and Methods Employing a Physically Asymmetric Semiconductor Device Having Symmetrical Electrical Behavior
06/16/2011	US20110140287 Integrated circuit packaging system with bond wire pads and method of manufacture thereof
06/16/2011	US20110140286 Multilayer wiring substrate mounted with electronic component and method for manufacturing the same
06/16/2011	US20110140285 Semiconductor Device
06/16/2011	US20110140284 Optoelectronic component
06/16/2011	US20110140283 Integrated circuit packaging system with a stackable package and method of manufacture thereof
06/16/2011	US20110140282 Semiconductor device and semiconductor device manufacturing method
06/16/2011	US20110140281 Substrate for electronic device, stack for electronic device, electronic device, and method for manufacturing the same
06/16/2011	US20110140280 Semiconductor apparatus capable of error revision using pin extension technique and design method therefor
06/16/2011	US20110140279 Semiconductor structure incorporating multiple nitride layers to improve thermal dissipation away from a device and a method of forming the structure
06/16/2011	US20110140278 Optical proximity correction aware integrated circuit design optimization
06/16/2011	US20110140277 Semiconductor device
06/16/2011	US20110140276 Interlayer insulating film, interconnection structure, and methods of manufacturing the same
06/16/2011	US20110140275 Semiconductor device and manufacturing method of the same
06/16/2011	US20110140274 Forming thick metal interconnect structures for integrated circuits
06/16/2011	US20110140273 Semiconductor Devices Including Voltage Switchable Materials for Over-Voltage Protection
06/16/2011	US20110140272 Ball Grid Array Package Enhanced With a Thermal and Electrical Connector
06/16/2011	US20110140271 integrated circuit chip with pyramid or cone-shaped conductive pads for flexible c4 connections and a method of forming the integrated circuit chip
06/16/2011	US20110140270 Semiconductor mounting substrate and method for manufacturing the same
06/16/2011	US20110140269 Semiconductor device and method for manufacturing the same
06/16/2011	US20110140268 High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same
06/16/2011	US20110140267 Electronic device package and method for fabricating the same
06/16/2011	US20110140266 Electrostatic capacitance-type input device and method of manufacturing thereof
06/16/2011	US20110140265 Packaging of Silicon Wafers and Mating Pieces

1 ... 491 492 493 494 495 496 497 498 499 500 501 502 503 504 505 506 507 508 509 510 511 ... 2262