| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/22/2011 | EP2337071A2 Fringe capacitor circuit |
| 06/22/2011 | EP2337070A1 Electronic device with non-linear resistive field grading and method for its manufacturing |
| 06/22/2011 | EP2337069A2 Semiconductor device |
| 06/22/2011 | EP2337068A1 Pre-soldered leadless package |
| 06/22/2011 | EP2337067A2 Making TSV interconnection structures composed of an insulating contour and a conducting area located in the contour and separate from the contour |
| 06/22/2011 | EP2337065A1 Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet |
| 06/22/2011 | EP2337063A1 On chip integrated inductor and manufacturing method therefor |
| 06/22/2011 | EP2335282A1 Systems and methods for enabling esd protection on 3-d stacked devices |
| 06/22/2011 | EP2335281A1 Electrical circuit component carrier |
| 06/22/2011 | EP2335280A1 Power semiconductor device adaptive cooling assembly |
| 06/22/2011 | EP2334728A2 Conductive compositions and methods of using them |
| 06/22/2011 | EP2250671B1 Integrated circuit with mosfet fuse element |
| 06/22/2011 | EP2005487B1 System and method for producing a solar cell array |
| 06/22/2011 | EP1032030B1 Flip chip bump bonding |
| 06/22/2011 | DE102010063455A1 Flansch für Halbleiterchip Flange for semiconductor chip |
| 06/22/2011 | DE102010060801A1 Halbleitervorrichtung mit vorstehendem Bauteilabschnitt und Verfahren zum Verpacken desselben Of the same semiconductor device with the above component section and method of packaging |
| 06/22/2011 | DE102010000694A1 Leistungshalbleitermodul The power semiconductor module |
| 06/22/2011 | DE102009055089A1 Circuit arrangement for use in controller of motor vehicle, has electrical switch partially provided with covering layer, perylene layer partially formed under covering layer, and base layer partially provided below perylene layer |
| 06/22/2011 | DE102009054784A1 Halbleiterchip und Verfahren zum Herstellen eines Halbleiterchips Semiconductor chip and method of manufacturing a semiconductor chip |
| 06/22/2011 | DE102009054745A1 Semiconductor component, has test structure arranged on sides of substrate, and contact pair provided with two contacts that are arranged in predetermined distance to each other on substrate |
| 06/22/2011 | DE102009054742A1 Organische lichtemittierende Vorrichtung mit homogener Temperaturverteilung Organic light-emitting device with a homogeneous temperature distribution |
| 06/22/2011 | DE102008045036B4 Verringern kritischer Abmessungen von Kontaktdurchführungen und Kontakten über der Bauteilebene von Halbleiterbauelementen Decreasing critical dimensions of vias and contacts on the device layer of semiconductor devices |
| 06/22/2011 | DE102005043270B4 Vorrichtung zur Temperaturüberwachung von planaren Feldeffekttransistoren sowie zugehöriges Herstellungsverfahren Temperature monitoring device of planar field-effect transistors and manufacturing method thereof |
| 06/22/2011 | DE10066445B4 Halbleitervorrichtung mit Abstrahlungs-Struktur A semiconductor device having radiating structure |
| 06/22/2011 | CN201877834U Thyristor valve block of static var compensator (SVC) |
| 06/22/2011 | CN201877436U 肖特基二极管 Schottky diodes |
| 06/22/2011 | CN201877433U 快恢复二极管 Fast Recovery Diode |
| 06/22/2011 | CN201877425U High-voltage silicon stack |
| 06/22/2011 | CN201877424U Chip on board (COB) of U disk |
| 06/22/2011 | CN201877423U Two-wire-system non-polarity 485 chip |
| 06/22/2011 | CN201877422U Novel heat transfer device |
| 06/22/2011 | CN201877421U Aluminum section of heat radiator |
| 06/22/2011 | CN201877420U Heat transfer device |
| 06/22/2011 | CN201877419U Radiator |
| 06/22/2011 | CN201877418U Air cooling radiator section |
| 06/22/2011 | CN201877417U Circular radiator |
| 06/22/2011 | CN201877416U Heat radiator with curved heat conducting pipes |
| 06/22/2011 | CN201877415U Radiator having heat conduction pipe and radiating fin |
| 06/22/2011 | CN1993427B Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter |
| 06/22/2011 | CN1894790B Method for adhering getter material to a surface for use in electronic devices |
| 06/22/2011 | CN1663120B Electronic component comprising a multilayer substrate |
| 06/22/2011 | CN102106198A Semiconductor device and method for manufacturing same |
| 06/22/2011 | CN102105983A 半导体装置 Semiconductor device |
| 06/22/2011 | CN102105982A Semiconductor device comprising a chip internal electrical test structure allowing electrical measurements during the fabrication process |
| 06/22/2011 | CN102105981A Semiconductor package with integrated interference shielding and method of manufacture therof |
| 06/22/2011 | CN102105980A A cooling device for cooling a semiconductor die |
| 06/22/2011 | CN102105979A Corrosion control of stacked integrated circuits |
| 06/22/2011 | CN102105971A Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein |
| 06/22/2011 | CN102105969A Semiconductor device |
| 06/22/2011 | CN102105537A 树脂组合物 Resin composition |
| 06/22/2011 | CN102105418A Silicon nitride board, method for manufacturing the silicon nitride board, and silicon nitride circuit board and semiconductor module using the silicon nitride board |
| 06/22/2011 | CN102105037A Electronic device and installation method thereof |
| 06/22/2011 | CN102105035A Radiating module |
| 06/22/2011 | CN102105034A Fixing bracket and radiating device using same |
| 06/22/2011 | CN102104071A Power metal-oxide-semiconductor field effect transistor (MOSFET) and manufacturing method thereof |
| 06/22/2011 | CN102104049A Thin film transistor substrate and the method thereof |
| 06/22/2011 | CN102104048A MOS (Metal Oxide Semiconductor) type ESD (Electro-Static Discharge) protection structure for silicon on insulator technology and manufacturing method thereof |
| 06/22/2011 | CN102104047A Nonvolatile semiconductor memory device and method for producing the same |
| 06/22/2011 | CN102104046A High-voltage device with multilayer gate structure and manufacturing method thereof |
| 06/22/2011 | CN102104043A Semiconductor device |
| 06/22/2011 | CN102104037A Luminous device with integrated circuit and manufacturing method thereof |
| 06/22/2011 | CN102104035A Stacked semiconductor packages, methods of fabricating the same, and systems employing the same |
| 06/22/2011 | CN102104034A Three-dimensional semiconductor device |
| 06/22/2011 | CN102104033A Three-dimensional mixed signal chip stacking package body and preparation method thereof |
| 06/22/2011 | CN102104032A Surface-mount LED with specific bracket and production process thereof |
| 06/22/2011 | CN102104031A Single pad-exposed lead frame with double-pad structure |
| 06/22/2011 | CN102104030A Rebuilt wafer assembly |
| 06/22/2011 | CN102104029A Integrated circuit patch for being attached on smart card |
| 06/22/2011 | CN102104028A Semiconductor plastic-sealed body and layered scanning method |
| 06/22/2011 | CN102104011A Electronic element packager and manufacturing method thereof |
| 06/22/2011 | CN102104010A Module structural member capable of improving isolation voltage VISO and reducing crusting thermal resistance Rthjc |
| 06/22/2011 | CN102104007A Method and equipment for manufacturing special circuit board |
| 06/22/2011 | CN102103921A Stacked structure of spiral inductor |
| 06/22/2011 | CN102103644A Chip with version number and method for modifying version number of chip |
| 06/22/2011 | CN102101910A Polymer, manufacturing method of same, optical element having same and optoelectronic device having same |
| 06/22/2011 | CN101826494B Heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and preparation method |
| 06/22/2011 | CN101752375B Groove type power MOS device with improved terminal protective structure |
| 06/22/2011 | CN101691920B Heat dissipation module of high-power LED lamp |
| 06/22/2011 | CN101661926B Chip package |
| 06/22/2011 | CN101661917B Chip packaging structure of resin core column |
| 06/22/2011 | CN101651129B Structure for repairing a line defect of an organic light emitting display and a method of repairing the defect |
| 06/22/2011 | CN101634788B Conductive film connection structure and Tft array panel including same |
| 06/22/2011 | CN101609821B High-power semiconductor multi-tube high-performance positioning fixture |
| 06/22/2011 | CN101605445B Heat transfer unit without liquid injection pipe and manufacture method thereof |
| 06/22/2011 | CN101587900B Flexible display device and manufacturing method thereof |
| 06/22/2011 | CN101569247B Methods of patterning a deposit metal on a substrate |
| 06/22/2011 | CN101515574B Chip package substrate, chip package body, and method for manufacturing chip package body |
| 06/22/2011 | CN101514782B Led lamp moudle |
| 06/22/2011 | CN101513141B Manufacturing method of soldered circuit board |
| 06/22/2011 | CN101499432B Stacked semiconductor device and method |
| 06/22/2011 | CN101471375B Image sensor and method for manufacturing the sensor |
| 06/22/2011 | CN101459212B Solid illuminating element |
| 06/22/2011 | CN101447463B Semiconductor wafer having a multi-layer wiring structure |
| 06/22/2011 | CN101416277B Method and system for treating a dielectric film |
| 06/22/2011 | CN101410973B Wafer-level chip scale package and method for fabricating and using the same |
| 06/22/2011 | CN101409258B Optical sensor and manufacturing method thereof |
| 06/22/2011 | CN101371353B Electronic device package, module and electronic device |
| 06/22/2011 | CN101317268B Stacked multi-chip package with EMI shielding |
| 06/22/2011 | CN101299439B High pressure resistant constant-current source device and production method |
| 06/22/2011 | CN101268548B Microelectronic packages and methods therefor |