Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2014
11/18/2014US8887663 Method and apparatus for fabrication of carbon nanotubes using an electrostatically charged substrate and liner
11/18/2014US8887383 Electrode structure and method for forming bump
11/13/2014US20140335686 Laser ablation tape for solder interconnect formation
11/13/2014US20140335678 Environmentally-assisted technique for transferring devices onto non-conventional substrates
11/13/2014US20140335668 Contact landing pads for a semiconductor device and methods of making same
11/13/2014US20140335660 Bonding structure and method
11/13/2014US20140335659 Method of manufacturing semiconductor device
11/13/2014US20140335657 Stack packages having fastening element and halogen-free inter-package connector
11/13/2014US20140335655 Integrated circuit package system with mounting structure
11/13/2014US20140335643 Method for producing a photovoltaic module
11/13/2014US20140335635 Electronic assemblies including a subassembly film and methods of producing the same
11/13/2014US20140335308 Sapphire substrate
11/13/2014US20140334103 Cooled electric unit
11/13/2014US20140333571 Pixel matrix, touch display device and drving method thereof
11/13/2014US20140333505 Semiconductor package having integrated antenna pad
11/13/2014US20140333006 Apparatus for molding a semiconductor wafer and process therefor
11/13/2014US20140332987 Curable resin composition and cured product thereof
11/13/2014US20140332986 Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP
11/13/2014US20140332985 Chip package and manufacturing method thereof
11/13/2014US20140332984 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
11/13/2014US20140332983 Stacked chip package and method for forming the same
11/13/2014US20140332982 Stacked Packages and Microelectronic Assemblies Incorporating the Same
11/13/2014US20140332981 Low-stress vias
11/13/2014US20140332980 Methods of forming 3-d circuits with integrated passive devices
11/13/2014US20140332979 Architecture of Spare Wiring Structures for Improved Engineering Change Orders
11/13/2014US20140332978 Optical wiring substrate, manufacturing method of optical wiring substrate and optical module
11/13/2014US20140332977 Semiconductor device
11/13/2014US20140332976 Semiconductor package and fabrication method thereof
11/13/2014US20140332975 Multichip integration with through silicon via (tsv) die embedded in package
11/13/2014US20140332974 Providing a void-free filled interconnect structure in a layer of a package substrate
11/13/2014US20140332972 Composite reconstituted wafer structures
11/13/2014US20140332971 Method and layout of an integrated circuit
11/13/2014US20140332969 Chip package and method for forming the same
11/13/2014US20140332968 Chip package
11/13/2014US20140332967 Bit cell with double patterened metal layer structures
11/13/2014US20140332966 Epoxy-amine underfill materials for semiconductor packages
11/13/2014US20140332965 High Performance Refractory Metal / Copper Interconnects To Eliminate Electromigration
11/13/2014US20140332964 Interconnect structures containing nitrided metallic residues
11/13/2014US20140332963 Interconnect with hybrid metallization
11/13/2014US20140332962 Device and Method for Reducing Contact Resistance of a Metal
11/13/2014US20140332961 Cu/CuMn BARRIER LAYER AND FABRICATING METHOD THEREOF
11/13/2014US20140332960 Interconnect structures containing nitrided metallic residues
11/13/2014US20140332959 Method of manufacturing semiconductor device and semiconductor device
11/13/2014US20140332957 Semiconductor package and manufacturing method thereof
11/13/2014US20140332956 Integrated circuit package with spatially varied solder resist opening dimension
11/13/2014US20140332955 Integrated Circuit Package System with Removable Backing Element Having Plated Terminal Leads and Method of Manufacture Thereof
11/13/2014US20140332954 Semiconductor Device
11/13/2014US20140332953 Chip arrangement, and method for forming a chip arrangement
11/13/2014US20140332952 Semiconductor structure and method for testing the same
11/13/2014US20140332951 Semiconductor device
11/13/2014US20140332950 Semiconductor device
11/13/2014US20140332949 Method for creating a selective solder seal interface for an integrated circuit cooling system
11/13/2014US20140332948 Thermal management in 2.5 d semiconductor packaging
11/13/2014US20140332947 Packages and methods for packaging
11/13/2014US20140332946 Semiconductor package and stacked semiconductor package having the same
11/13/2014US20140332944 Resin-encapsulated semiconductor device and its manufacturing method
11/13/2014US20140332943 Barrel-plating quad flat no-lead (qfn) packaging structures and method for manufacturing the same
11/13/2014US20140332941 System, method and apparatus for leadless surface mounted semiconductor package
11/13/2014US20140332940 Quad Flat No-Lead Integrated Circuit Package and Method for Manufacturing the Package
11/13/2014US20140332939 Dual Lead Frame Semiconductor Package and Method of Manufacture
11/13/2014US20140332938 Microelectronic devices and methods for manufacturing microelectronic devices
11/13/2014US20140332937 Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
11/13/2014US20140332936 Package arrangement and method of forming the same
11/13/2014US20140332935 MgO-Based Coating for Electrically Insulating Semiconductive Substrates and Production Method Thereof
11/13/2014US20140332934 Substrates for semiconductor devices
11/13/2014US20140332930 Integrated circuit device and configuration method thereof
11/13/2014US20140332929 Forming semiconductor chip connections
11/13/2014US20140332926 Composite reconstituted wafer structures
11/13/2014US20140332924 E-fuse with hybrid metallization
11/13/2014US20140332923 E-fuse with hybrid metallization
11/13/2014US20140332922 Programmable electrical fuse with temperature gradient between anode and cathode
11/13/2014US20140332908 Chip package and method for forming the same
11/13/2014US20140332904 System and methods for converting planar design to finfet design
11/13/2014US20140332878 Semiconductor device and a manufacturing method of the same
11/13/2014US20140332871 Semiconductor device having jumper pattern and blocking pattern
11/13/2014US20140332867 Semiconductor device and manufacturing method thereof
11/13/2014US20140332866 Semiconductor device
11/13/2014US20140332865 Semiconductor device
11/13/2014US20140332856 Vertical electronic fuse
11/13/2014US20140332853 Method and apparatus for reduced parasitics and improved multi-finger transistor thermal impedance
11/13/2014US20140332813 Semiconductor device
11/13/2014US20140332770 Chip on film including different wiring pattern, flexible display device including the same, and method of manufacturing flexible display device
11/13/2014US20140332583 Wire bonding apparatus
11/13/2014US20140332251 Metal Wiring and Method of Manufacturing the Same, and Metal Wiring Substrate and Method of Manufacturing the Same
11/13/2014US20140331462 Packaging Process Tools and Packaging Methods for Semiconductor Devices
11/11/2014US8886277 Micro-electrode array package using liquid crystal polymer and manufacturing method thereof
11/11/2014US8885389 Continuous mesh three dimensional non-volatile storage with vertical select devices
11/11/2014US8885383 Flash memory and layout method thereof
11/11/2014US8885356 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
11/11/2014US8885344 Semiconductor device
11/11/2014US8885342 Thermal management for electronic device housing
11/11/2014US8885336 Mounting structure and method for dissipating heat from a computer expansion card
11/11/2014US8884712 Oscillator
11/11/2014US8884630 Active pin connection monitoring system and method
11/11/2014US8884448 Flip chip interconnection with double post
11/11/2014US8884447 Semiconductor device and method of manufacturing the same
11/11/2014US8884446 Semiconductor packages
11/11/2014US8884445 Semiconductor chip and stacked semiconductor package having the same
11/11/2014US8884444 Nonvolatile memory device and manufacturing method thereof
11/11/2014US8884443 Substrate for semiconductor package and process for manufacturing
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