| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/28/2011 | US7968807 Package having a plurality of mounting orientations |
| 06/28/2011 | US7968800 Passive component incorporating interposer |
| 06/28/2011 | US7968431 Diffusion region routing for narrow scribe-line devices |
| 06/28/2011 | US7968397 Semiconductor device and method of manufacturing the same |
| 06/28/2011 | US7968374 Layered chip package with wiring on the side surfaces |
| 06/28/2011 | US7968369 Microelectronic devices and microelectronic support devices, and associated assemblies and methods |
| 06/28/2011 | US7968196 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 06/28/2011 | US7968187 Surface coating |
| 06/28/2011 | US7967943 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 06/28/2011 | US7967942 Polymer matrices for polymer solder hybrid materials |
| 06/28/2011 | US7967047 Film splicer |
| 06/27/2011 | DE202011100014U1 Kühler für Leuchtdiode Radiator for LED |
| 06/24/2011 | DE202011100013U1 Kühlmodul Cooling module |
| 06/23/2011 | WO2011075491A1 Via structure integrated in electronic substrate |
| 06/23/2011 | WO2011075418A1 Circuit board with via trace connection and method of making the same |
| 06/23/2011 | WO2011075265A2 Apparatus and method for embedding components in small-form-factor, system-on-packages |
| 06/23/2011 | WO2011075263A1 Panel based lead frame packaging method and device |
| 06/23/2011 | WO2011074589A1 Etchant and method for manufacturing semiconductor device using same |
| 06/23/2011 | WO2011074541A1 Electronic component package |
| 06/23/2011 | WO2011074520A1 Method for producing electronic device, electronic device, method for producing electronic device package, and electronic device package |
| 06/23/2011 | WO2011074504A1 Photocurable moistureproof insulating coating material |
| 06/23/2011 | WO2011074283A1 Capacitor-equipped wiring substrate and component-equipped wiring substrate |
| 06/23/2011 | WO2011074221A1 Semiconductor device |
| 06/23/2011 | WO2011073908A1 On chip integrated inductor and manufacturing method therefor |
| 06/23/2011 | WO2011073635A1 On- gate contacts in a mos device |
| 06/23/2011 | WO2011073057A1 System to improve coreless package connections and associated methods |
| 06/23/2011 | WO2011072528A1 Mos-type esd protection structure for silicon-on-insulator technologies and method thereof |
| 06/23/2011 | WO2011072364A1 Integrated transmit and receive modules for a coherent optical transmission system |
| 06/23/2011 | WO2008076661A3 Ceramic package substrate with recessed device |
| 06/23/2011 | US20110149463 Electronic device |
| 06/23/2011 | US20110148543 Integrated Circuit With Inductive Bond Wires |
| 06/23/2011 | US20110148454 Semiconductor wafer, semiconductor circuit, substrate for testing and test system |
| 06/23/2011 | US20110147955 Silicone resin composition and a cured product thereof |
| 06/23/2011 | US20110147954 Semiconductor device, and resin composition used for semiconductor device |
| 06/23/2011 | US20110147953 Microelectronic assembly with joined bond elements having lowered inductance |
| 06/23/2011 | US20110147952 Dicing die-bonding film |
| 06/23/2011 | US20110147951 Wiring substrate and semiconductor device |
| 06/23/2011 | US20110147950 Metallization layer structure for flip chip package |
| 06/23/2011 | US20110147949 Hybrid integrated circuit device |
| 06/23/2011 | US20110147948 Forming method and structure of porous low-k layer, interconnect process and interconnect structure |
| 06/23/2011 | US20110147947 Semiconductor device and method for fabricating the same |
| 06/23/2011 | US20110147946 Wafer-level stack package and method of fabricating the same |
| 06/23/2011 | US20110147945 Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process |
| 06/23/2011 | US20110147944 Planarising damascene structures |
| 06/23/2011 | US20110147943 Wafer level surface passivation of stackable integrated circuit chips |
| 06/23/2011 | US20110147942 Method of manufacturing semiconductor memory device and semiconductor memory device |
| 06/23/2011 | US20110147941 Semiconductor apparatus and manufacturing method thereof |
| 06/23/2011 | US20110147940 Electroless cu plating for enhanced self-forming barrier layers |
| 06/23/2011 | US20110147939 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias |
| 06/23/2011 | US20110147938 Conductive via hole and method for forming conductive via hole |
| 06/23/2011 | US20110147937 Method of manufacturing semiconductor device and semiconductor device |
| 06/23/2011 | US20110147936 Semiconductor device and damascene structure |
| 06/23/2011 | US20110147935 Method and system for binding halide-based contaminants |
| 06/23/2011 | US20110147934 Metal Plugged Substrates with No Adhesive Between Metal and Polyimide |
| 06/23/2011 | US20110147933 Multiple surface finishes for microelectronic package substrates |
| 06/23/2011 | US20110147932 Contact-based encapsulation |
| 06/23/2011 | US20110147931 Lead frame land grid array with routing connector trace under unit |
| 06/23/2011 | US20110147930 Semiconductor Component of Semiconductor Chip Size with Flip-Chip-Like External Contacts |
| 06/23/2011 | US20110147929 Through mold via polymer block package |
| 06/23/2011 | US20110147928 Microelectronic assembly with bond elements having lowered inductance |
| 06/23/2011 | US20110147927 Semiconductor device and method for fabricating the same |
| 06/23/2011 | US20110147926 Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier |
| 06/23/2011 | US20110147925 Pre-soldered leadless package |
| 06/23/2011 | US20110147924 Wiring substrate and method of manufacturing the same |
| 06/23/2011 | US20110147923 Surface Mounting Integrated Circuit Components |
| 06/23/2011 | US20110147922 Structures and methods to reduce maximum current density in a solder ball |
| 06/23/2011 | US20110147921 Flange for Semiconductor Die |
| 06/23/2011 | US20110147920 Apparatus and method for embedding components in small-form-factor, system-on-packages |
| 06/23/2011 | US20110147919 Window ball grid array (bga) semiconductor packages |
| 06/23/2011 | US20110147918 Electronic device and method of producing the same |
| 06/23/2011 | US20110147917 Integrated circuit package with embedded components |
| 06/23/2011 | US20110147916 Semiconductor Chip Device with Solder Diffusion Protection |
| 06/23/2011 | US20110147915 Combined power mesh transition and signal overpass/underpass |
| 06/23/2011 | US20110147914 Clad Solder Thermal Interface Material |
| 06/23/2011 | US20110147913 Microelectronic package and method for a compression-based mid-level interconnect |
| 06/23/2011 | US20110147912 Methods and apparatuses to stiffen integrated circuit package |
| 06/23/2011 | US20110147911 Stackable circuit structures and methods of fabrication thereof |
| 06/23/2011 | US20110147909 Semicondcutor chip stack and manufacturing method thereof |
| 06/23/2011 | US20110147908 Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package Assembly |
| 06/23/2011 | US20110147907 Active plastic bridge chips |
| 06/23/2011 | US20110147906 Integrated circuit packaging system with embedded interconnect and method of manufacture thereof |
| 06/23/2011 | US20110147905 Semiconductor device and method of manufacturing the same |
| 06/23/2011 | US20110147904 Semiconductor device, electronic apparatus using the semiconductor device, and method of manufacturing the semiconductor device |
| 06/23/2011 | US20110147903 Leadframe Circuit and Method Therefor |
| 06/23/2011 | US20110147902 Integrated Circuit Comprising Light Absorbing Adhesive |
| 06/23/2011 | US20110147901 Integrated circuit packaging system with package stacking and method of manufacture thereof |
| 06/23/2011 | US20110147900 Dielectric layer for flash memory device and method for manufacturing thereof |
| 06/23/2011 | US20110147898 Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer |
| 06/23/2011 | US20110147897 Offset field grid for efficient wafer layout |
| 06/23/2011 | US20110147895 Apparatus and Method for Controlling Semiconductor Die Warpage |
| 06/23/2011 | US20110147886 Semiconductor device with fuse and method for fabricating the same |
| 06/23/2011 | US20110147885 Formation of improved soi substrates using bulk semiconductor wafers |
| 06/23/2011 | US20110147882 Semiconductor device and method for fabricating the same |
| 06/23/2011 | US20110147853 Method of Forming an Electrical Fuse and a Metal Gate Transistor and the Related Electrical Fuse |
| 06/23/2011 | US20110147845 Remote Doped High Performance Transistor Having Improved Subthreshold Characteristics |
| 06/23/2011 | US20110147803 Gas Sensor And Flip-Chip Method For Its Manufacture |
| 06/23/2011 | US20110147788 Semiconductor device with a light emitting semiconductor die |
| 06/23/2011 | US20110147782 Optical device and method of manufacturing the same |
| 06/23/2011 | US20110147752 Semiconductor device and manufacturing method thereof |
| 06/23/2011 | US20110147064 Boron nitride agglomerated powder |