Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2011
06/29/2011CN102108184A Epoxy resin composition and application thereof
06/29/2011CN101834181B SCR (Silicon Controlled Rectifier) circuit with auxiliary triggering of NMOS (N-channel Metal Oxide Semiconductor)
06/29/2011CN101777553B Power transistor chip with built-in junction field effect transistor and application circuit thereof
06/29/2011CN101752372B Complementary type SCR (semiconductor control rectifier) structure triggered by help of NPN (negative-positive-negative) bipolar-junction transistors
06/29/2011CN101677094B Thin film transistor (TFT) performance testing device, manufacturing method thereof and TFT performance testing method
06/29/2011CN101663750B RFID label and method for manufacturing same
06/29/2011CN101661920B Chip packaging carrying plate and making method thereof
06/29/2011CN101615614B Integrated circuit structure
06/29/2011CN101569968B Silver alloy bonding wire for packing wires and manufacturing method thereof
06/29/2011CN101556939B Ceramic encapsulated base and manufacture method thereof
06/29/2011CN101546745B Chip interconnect swizzle mechanism
06/29/2011CN101545621B Illumination device and radiation structure thereof
06/29/2011CN101540309B Semiconductor chip package and manufacturing methods thereof
06/29/2011CN101539283B LED fixture
06/29/2011CN101521221B 有机发光显示装置 The organic light emitting display device
06/29/2011CN101517750B Electronic device module comprising an ethylene multi-block copolymer
06/29/2011CN101504932B Semiconductor device and manufacturing method
06/29/2011CN101479848B 供电网络 Supply network
06/29/2011CN101471325B 半导体器件 Semiconductor devices
06/29/2011CN101409291B Nonvolatile semiconductor storage device, and method for controlling nonvolatile semiconductor storage device
06/29/2011CN101403485B LED luminous element for integrated control device
06/29/2011CN101393873B Device comprising stacked semiconductor chips and manufacture method thereof
06/29/2011CN101388382B Staggered offset stacking encapsulation construction having omnibus bar of metal welding pad in conductive wire support
06/29/2011CN101378642B Combination of radiating device
06/29/2011CN101373747B Device with through-hole interconnection and method for manufacturing the same
06/29/2011CN101364609B Light emitting display device and method of fabricating the same
06/29/2011CN101351107B Back board combination for heat radiator
06/29/2011CN101349413B LED lamp
06/29/2011CN101339919B Semiconductor device and method for fabricating the same
06/29/2011CN101307183B Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
06/29/2011CN101291570B Heat pipe radiator and manufacturing method thereof
06/29/2011CN101281908B Semiconductor device equipped with thin-film circuit elements
06/29/2011CN101267709B Printed circuit board with embedded capacitor
06/29/2011CN101222836B Direct conduction-Peltier effect refrigeration mixed cooling method and device
06/29/2011CN101221925B Method of manufacturing liquid crystal display
06/29/2011CN101221592B Heuristic method for optimizing and configuring vertical through hole in VLSI multi-layer power supply network
06/29/2011CN101207996B Radiator assembly
06/29/2011CN101193533B Radiator combination
06/29/2011CN101179075B High-voltage-withstanding semiconductor device and fabrication method thereof
06/29/2011CN101174606B Tape carrier, tape carrier for liquid crystal display device, and liquid crystal display device
06/29/2011CN101150943B Heat radiation device and its fan fixing part
06/29/2011CN101145530B Electronic packages with fine particle wetting and non-wetting zones
06/29/2011CN101086985B Block water cooling power semiconductor part
06/29/2011CN101064306B Semiconductor integrated circuit and system lsi including the same
06/28/2011US7969728 Heat dissipation device with a fan holder attached with a position-adjustable air guiding member
06/28/2011US7969028 Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device
06/28/2011US7969027 Semiconductor device encapsulated with resin composition
06/28/2011US7969026 Flexible carrier for high volume electronic package fabrication
06/28/2011US7969025 Electric power semiconductor device
06/28/2011US7969024 Semiconductor package with joint reliability, entangled wires including insulating material
06/28/2011US7969023 Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof
06/28/2011US7969022 Die-to-die wire-bonding
06/28/2011US7969021 Bonding wire for semiconductor device and method for producing the same
06/28/2011US7969020 Die stacking apparatus and method
06/28/2011US7969019 Module with stacked semiconductor devices
06/28/2011US7969018 Stacked semiconductor chips with separate encapsulations
06/28/2011US7969016 Self-aligned wafer or chip structure, and self-aligned stacked structure
06/28/2011US7969015 Inverse chip connector
06/28/2011US7969014 Power layout of integrated circuits and designing method thereof
06/28/2011US7969013 Through silicon via with dummy structure and method for forming the same
06/28/2011US7969012 Semiconductor device and method for manufacturing the same
06/28/2011US7969011 MIIM diodes having stacked structure
06/28/2011US7969008 Semiconductor device with improved pads
06/28/2011US7969007 Semiconductor device and manufacturing method thereof
06/28/2011US7969006 Integrated circuit chips with fine-line metal and over-passivation metal
06/28/2011US7969005 Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor
06/28/2011US7969004 Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
06/28/2011US7969003 Bump structure having a reinforcement member
06/28/2011US7969002 Integrated circuit packages incorporating an inductor and methods
06/28/2011US7969001 Method and system for intra-chip waveguide communication
06/28/2011US7968999 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
06/28/2011US7968998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
06/28/2011US7968997 Semiconductor device
06/28/2011US7968995 Integrated circuit packaging system with package-on-package and method of manufacture thereof
06/28/2011US7968994 Memory modules and systems including the same
06/28/2011US7968993 Stacked semiconductor device and semiconductor memory device
06/28/2011US7968992 Multi-chip package structure and method of fabricating the same
06/28/2011US7968991 Stacked package module and board having exposed ends
06/28/2011US7968990 Semiconductor device and method of fabricating the same
06/28/2011US7968989 Multi-package slot array
06/28/2011US7968988 Power semiconductor module having a thermally conductive base plate on which at least four substrates are arranged in at least one single row
06/28/2011US7968987 Carbon dioxide gettering for a chip module assembly
06/28/2011US7968986 Lid structure for microdevice and method of manufacture
06/28/2011US7968984 Universal pad arrangement for surface mounted semiconductor devices
06/28/2011US7968983 Semiconductor device
06/28/2011US7968982 Thermal enhanced upper and dual heat sink exposed molded leadless package
06/28/2011US7968981 Inline integrated circuit system
06/28/2011US7968980 Support member for mounting a semiconductor device, conductive materials, and its manufacturing method
06/28/2011US7968979 Integrated circuit package system with conformal shielding and method of manufacture thereof
06/28/2011US7968978 Microwave integrated circuit package and method for forming such package
06/28/2011US7968977 Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
06/28/2011US7968976 Guard ring extension to prevent reliability failures
06/28/2011US7968974 Scribe seal connection
06/28/2011US7968967 One-time-programmable anti-fuse formed using damascene process
06/28/2011US7968966 Semiconductor device with fuse and a method of manufacturing the same
06/28/2011US7968965 Semiconductor device and method for fabricating the same
06/28/2011US7968962 Semiconductor fabrication method and system
06/28/2011US7968918 Semiconductor package
06/28/2011US7968906 Substrate-triggered bipolar junction transistor and ESD protection circuit
06/28/2011US7968883 Image detector