| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/30/2011 | US20110156035 Disguising test pads in a semiconductor package |
| 06/30/2011 | US20110156034 Repair circuit and repair method of semiconductor apparatus |
| 06/30/2011 | US20110156033 Method and system for tracing die at unit level |
| 06/30/2011 | US20110156032 Method of repairing probe pads |
| 06/30/2011 | US20110156031 Semiconductor device |
| 06/30/2011 | DE10201557B4 Behälter zur Verdampfungskühlung sowie Verfahren zum Evakuieren und Befüllen des Behälters Container for evaporative cooling and method for evacuating and filling the container |
| 06/30/2011 | DE102010020900B3 Verfahren zur Herstellung von Leistungshalbleitersubstraten A process for producing power semiconductor substrates |
| 06/30/2011 | DE102010009984A1 Verstärkerbaustein mit einem Kompensationselement Amplifier module with a compensation element |
| 06/30/2011 | DE102010000092A1 Halbleiterpackage mit wedge-gebondetem Chip Semiconductor package with wedge-Bonded chip |
| 06/30/2011 | DE102009059951A1 Handgranatenzünder Hand grenade fuse |
| 06/30/2011 | DE102009059304A1 Electronic/optical component i.e. electronic sensor, for use as catheter for examining hollow organs of e.g. animals, has wedge-shaped nano-objects penetrated into insulation to mount electrical or optical conductor on component |
| 06/30/2011 | DE102009059303A1 Verfahren zur Herstellung eines elektronischen Bauteils und nach diesem Verfahren hergestelltes elektronisches Bauteil A method of manufacturing an electronic component and electronic component manufactured according to this method |
| 06/30/2011 | DE102009055367A1 Cooling fin for cooling e.g. semiconductor component, has multiple reinforcing plates arranged between heat-conducting plates in horizontal or vertical direction and connected with inner surfaces of heat-conducting plates |
| 06/30/2011 | DE102008033410B4 Leistungselektronische Verbindungseinrichtung mit einem Leistungshalbleiterbauelement und Herstellungsverfahren hierzu Power electronic connection device with a power semiconductor device and manufacturing method therefor |
| 06/30/2011 | CA2782581A1 Method for the production of an electronic component and electronic component produced according to this method |
| 06/29/2011 | EP2339628A1 Integrated circuit identification process and corresponding integrated circuit |
| 06/29/2011 | EP2339627A1 Window interposed die packaging |
| 06/29/2011 | EP2339626A2 Semiconductor device and production method thereof |
| 06/29/2011 | EP2339625A2 Semiconductor device and fabrication method therefor |
| 06/29/2011 | EP2339624A2 Multi-layer interconnection structure manufacturing method thereof |
| 06/29/2011 | EP2339623A2 method for producing a non-planar element |
| 06/29/2011 | EP2339622A1 Wirebonding Process |
| 06/29/2011 | EP2339621A2 Method for flattening a heat dissipating tube and device for performing the same |
| 06/29/2011 | EP2339620A2 Semiconductor device |
| 06/29/2011 | EP2339619A2 Microwave integrated circuit provided with damping device for microphonic noise suppression. |
| 06/29/2011 | EP2339039A2 Copper alloy sheet for electric and electronic part |
| 06/29/2011 | EP2339038A2 Copper alloy sheet for electric and electronic part |
| 06/29/2011 | EP2338937A1 Composition for thermosetting silicone resin |
| 06/29/2011 | EP2338319A1 Electrically-conductive foam emi shield |
| 06/29/2011 | EP2338208A1 Wireless interconnect for an integrated circuit |
| 06/29/2011 | EP2338175A1 Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it |
| 06/29/2011 | EP2338174A1 Conductive emissions protection |
| 06/29/2011 | EP2338173A1 Substrate arrangement |
| 06/29/2011 | EP2338172A1 Method of reducing voids in encapsulant |
| 06/29/2011 | EP2338171A1 Method for making via interconnection |
| 06/29/2011 | EP2338170A1 Improved wafer level chip scale packaging |
| 06/29/2011 | EP2338169A1 Package with power and ground through via |
| 06/29/2011 | EP2338163A1 Improved metal-on-metal capacitor with diagonal feedline |
| 06/29/2011 | EP2337997A1 A system for heat conduction between two connectable members |
| 06/29/2011 | EP2024990B1 Method of increasing the quality factor of an inductor in a semiconductor device |
| 06/29/2011 | EP1984950B1 Component with integrated heating element and method for heating a semiconductor body |
| 06/29/2011 | EP1584101B1 Semiconductor package having non-ceramic based window frame |
| 06/29/2011 | EP1500041B1 Module for a data carrier with improved bump counterparts |
| 06/29/2011 | CN201887076U Combining improvement of base plate and heat dissipation structure |
| 06/29/2011 | CN201887040U QFN/DFN (quad flat non-lead/dual flat non-lead) packaged integrated circuit using PCB (printed circuit board) as substrate |
| 06/29/2011 | CN201887039U IC (integrated circuit) package substrate |
| 06/29/2011 | CN201887038U Electric module and electric converter |
| 06/29/2011 | CN201887037U Internal lead wire structure for encapsulating field-effect tube |
| 06/29/2011 | CN201887036U Active radiator |
| 06/29/2011 | CN201887035U Encapsulation structure for semiconductor chip |
| 06/29/2011 | CN1979833B Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device |
| 06/29/2011 | CN1930927B A method of creating electronic packages |
| 06/29/2011 | CN1913128B Methods of forming dual-damascene metal wiring patterns for integrated circuit devices and wiring patterns formed thereby |
| 06/29/2011 | CN1835654B Wiring board and method of manufacturing the same |
| 06/29/2011 | CN1691852B Organic electroluminescence device and manufacturing method thereof |
| 06/29/2011 | CN102113136A Method of passivating and encapsulating CdTe and CZT segmented detectors |
| 06/29/2011 | CN102113117A System and method for excess voltage protection in a multi-die package |
| 06/29/2011 | CN102113116A High q transformer disposed at least partly in a non-semiconductor substrate |
| 06/29/2011 | CN102113105A An integrated circuit comprising light absorbing adhesive |
| 06/29/2011 | CN102113100A Method for manufacturing semiconductor device |
| 06/29/2011 | CN102113096A Polishing solution for cmp, and method for polishing substrate using the polishing solution for cmp |
| 06/29/2011 | CN102112939A Heat exchanger device and method for heat removal or transfer |
| 06/29/2011 | CN102112575A Thermally conductive composition and manufacturing method therefor |
| 06/29/2011 | CN102112558A Organic-inorganic composite and manufacturing method therefor |
| 06/29/2011 | CN102112517A Resin composition for semiconductor encapsulation and semiconductor device using the same |
| 06/29/2011 | CN102112516A Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device |
| 06/29/2011 | CN102111985A Heat-dissipating device |
| 06/29/2011 | CN102111984A Heat dissipation device |
| 06/29/2011 | CN102111082A Power Converter |
| 06/29/2011 | CN102110759A Structure and method for packaging light-emitting diode (LED) |
| 06/29/2011 | CN102110692A Isolation structure of anti-radiation EEPROM (electrically erasable programmable read-only memory) array |
| 06/29/2011 | CN102110690A Three-dimensional semiconductor memory device |
| 06/29/2011 | CN102110688A Serial number generator and forming method thereof, and integrated circuit and forming method thereof |
| 06/29/2011 | CN102110685A Pixel structure and display panel |
| 06/29/2011 | CN102110684A Semiconductor capacitor device |
| 06/29/2011 | CN102110680A Power module assembly with reduced inductance |
| 06/29/2011 | CN102110679A Power semiconductor module with a substrate having a three dimensional surface contour and method for producing same |
| 06/29/2011 | CN102110678A Semiconductor package and manufacturing method thereof |
| 06/29/2011 | CN102110674A Semiconductor package |
| 06/29/2011 | CN102110673A Wafer level MMCM (microwave multichip module) packaging structure using photosensitive BCB (benzocyclobutene) as dielectric layer and method |
| 06/29/2011 | CN102110672A Chip-stacked package structure and method for manufacturing the same |
| 06/29/2011 | CN102110671A Electrostatic discharge (ESD) protection device |
| 06/29/2011 | CN102110670A Electronic assembly device and lead frame |
| 06/29/2011 | CN102110669A Composite dielectric layer and manufacturing method thereof |
| 06/29/2011 | CN102110668A Lead frame for packaging member to accommodate electronic component |
| 06/29/2011 | CN102110667A Device for wafer level electrical interconnection and extraction and processing method thereof |
| 06/29/2011 | CN102110666A Integrated circuit chip package and physical layer interface arrangement |
| 06/29/2011 | CN102110665A Fluid cooling type radiator |
| 06/29/2011 | CN102110664A Heat radiation structure for MOS transistors of high-power inverter |
| 06/29/2011 | CN102110663A Flexible semiconductor for refrigerating and heating |
| 06/29/2011 | CN102110662A High-power aluminum section heat radiator for charging machine |
| 06/29/2011 | CN102110661A Serial aluminum sheet type rectifier diode radiator component |
| 06/29/2011 | CN102110660A Semiconductor flip chip package and forming method thereof |
| 06/29/2011 | CN102110659A Semiconductor apparatus and probe test method thereof |
| 06/29/2011 | CN102110640A Method for treating metal fuse of single aluminium |
| 06/29/2011 | CN102110621A Insulated pull rod and pressing device for power semiconductor, and assembly method of pressing device |
| 06/29/2011 | CN102110617A Interposer films useful in semiconductor packaging applications, and methods relating thereto |
| 06/29/2011 | CN102110612A Semiconductor device and manufacturing method thereof |
| 06/29/2011 | CN102110517A Semiconductor differential inductance structure |
| 06/29/2011 | CN102109291A Metal and conductive plastic composite micro heat exchanger |