| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/05/2011 | US7972901 Chip package sealing method |
| 07/05/2011 | US7971793 Memory card |
| 07/05/2011 | US7971354 Method of manufacturing a multilayer printed wiring board |
| 07/04/2011 | DE202011000713U1 Spaltlose Verbindung von Wärmeleitrohren Gapless combination of heat pipes |
| 06/30/2011 | WO2011079121A1 Method of vertically mounting an integrated circuit |
| 06/30/2011 | WO2011078867A1 Surface mount spark gap |
| 06/30/2011 | WO2011078349A1 Many-up wiring substrate, wiring substrate, and electronic device |
| 06/30/2011 | WO2011078345A1 Through-wired substrate and manufacturing method therefor |
| 06/30/2011 | WO2011078335A1 Etchant and method for manufacturing semiconductor device using same |
| 06/30/2011 | WO2011078319A1 Semiconductor device, semiconductor wafer, and method for manufacturing a semiconductor device |
| 06/30/2011 | WO2011078114A1 Epoxy resin composition, process for production of assembly using same, and assembly |
| 06/30/2011 | WO2011077918A1 Circuit module |
| 06/30/2011 | WO2011077886A1 Interconnect-use electronic component and method for producing same |
| 06/30/2011 | WO2011077781A1 Semiconductor device and production method thereof |
| 06/30/2011 | WO2011077664A1 Semiconductor device |
| 06/30/2011 | WO2011076934A1 Window interposed die packaging |
| 06/30/2011 | WO2011076917A1 Device and method for identifying a wafer |
| 06/30/2011 | WO2011076788A1 Method for producing an infrared light detector |
| 06/30/2011 | WO2011076782A1 Method for producing an electronic component and electronic component produced according to said method |
| 06/30/2011 | WO2011076056A1 Chip with version number and method for modifying chip version number thereof |
| 06/30/2011 | WO2011075898A1 Heat conducting device for led and led lamp |
| 06/30/2011 | WO2011056309A3 Microelectronic package and method of manufacturing same |
| 06/30/2011 | US20110157445 Semiconductor device and method of manufacturing the same, and electronic apparatus |
| 06/30/2011 | US20110156599 Electronic module, methods of manufacturing and driving the same, and electronic instrument |
| 06/30/2011 | US20110156286 Semiconductor device and manufacturing method thereof |
| 06/30/2011 | US20110156285 Integrated alignment and overlay mark, and method for detecting errors of exposed positions thereof |
| 06/30/2011 | US20110156284 Device and method for alignment of vertically stacked wafers and die |
| 06/30/2011 | US20110156283 Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages |
| 06/30/2011 | US20110156281 Quad Flat No Lead (QFN) Package |
| 06/30/2011 | US20110156280 Dicing tape-integrated film for semiconductor back surface |
| 06/30/2011 | US20110156279 Film for flip chip type semiconductor back surface |
| 06/30/2011 | US20110156278 Film for flip chip type semiconductor back surface |
| 06/30/2011 | US20110156277 Dicing tape-integrated film for semiconductor back surface |
| 06/30/2011 | US20110156276 Patch on interposer assembly and structures formed thereby |
| 06/30/2011 | US20110156275 Integrated circuit packaging system having planar interconnect and method for manufacture thereof |
| 06/30/2011 | US20110156274 Semiconductor device |
| 06/30/2011 | US20110156273 Circuit substrate and method |
| 06/30/2011 | US20110156272 Multilayered Wiring Substrate |
| 06/30/2011 | US20110156271 Semiconductor module |
| 06/30/2011 | US20110156270 Contact elements of semiconductor devices formed on the basis of a partially applied activation layer |
| 06/30/2011 | US20110156269 Semiconductor package and stack semiconductor package having the same |
| 06/30/2011 | US20110156268 Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element |
| 06/30/2011 | US20110156267 Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element |
| 06/30/2011 | US20110156266 Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods |
| 06/30/2011 | US20110156265 Electronic component and method of manufacturing the same |
| 06/30/2011 | US20110156264 Semiconductor element built-in device |
| 06/30/2011 | US20110156263 Semiconductor device |
| 06/30/2011 | US20110156261 Integrated circuit package and method of making same |
| 06/30/2011 | US20110156260 Pad structure and integrated circuit chip with such pad structure |
| 06/30/2011 | US20110156259 Metal-to-contact overlay structures and methods of manufacturing the same |
| 06/30/2011 | US20110156258 Semiconductor device having through via and method for fabricating the same |
| 06/30/2011 | US20110156257 Semiconductor device and method for manufacturing the same |
| 06/30/2011 | US20110156256 Electromigration-resistant under-bump metallization of nickel-iron alloys for sn-rich solder bumps of pb-free flip-chip applications |
| 06/30/2011 | US20110156255 Carbon nanotube-based filler for integrated circuits |
| 06/30/2011 | US20110156254 Modified chip attach process |
| 06/30/2011 | US20110156253 Micro-bump structure |
| 06/30/2011 | US20110156252 Semiconductor package having electrical connecting structures and fabrication method thereof |
| 06/30/2011 | US20110156251 Semiconductor Package |
| 06/30/2011 | US20110156250 Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture |
| 06/30/2011 | US20110156249 Wafer-to-wafer stack with supporting pedestal |
| 06/30/2011 | US20110156248 Semiconductor device and method for manufacturing the same |
| 06/30/2011 | US20110156245 Method and Apparatus for Cooling an Integrated Circuit |
| 06/30/2011 | US20110156244 Heat sink and integrated circuit assembly using the same |
| 06/30/2011 | US20110156243 Semiconductor package |
| 06/30/2011 | US20110156242 Semiconductor package and method of manufacturing the same |
| 06/30/2011 | US20110156241 Package substrate and method of fabricating the same |
| 06/30/2011 | US20110156240 Reliable large die fan-out wafer level package and method of manufacture |
| 06/30/2011 | US20110156239 Method for manufacturing a fan-out embedded panel level package |
| 06/30/2011 | US20110156238 Semiconductor package having chip using copper process |
| 06/30/2011 | US20110156237 Fan-out chip scale package |
| 06/30/2011 | US20110156236 Thermally enhanced expanded wafer level package ball grid array structure and method of making the same |
| 06/30/2011 | US20110156235 Flip chip package having enhanced thermal and mechanical performance |
| 06/30/2011 | US20110156234 Self repairing ic package design |
| 06/30/2011 | US20110156233 Stack package |
| 06/30/2011 | US20110156231 Recessed and embedded die coreless package |
| 06/30/2011 | US20110156230 Multi-stacked semiconductor dice scale package structure and method of manufacturing same |
| 06/30/2011 | US20110156229 Semiconductor device and manufacturing method therefor |
| 06/30/2011 | US20110156228 Semiconductor device |
| 06/30/2011 | US20110156227 Semiconductor package structure |
| 06/30/2011 | US20110156226 Interposer and semiconductor device |
| 06/30/2011 | US20110156225 Semiconductor device and method of manufacturing the same |
| 06/30/2011 | US20110156224 Circuit-substrate laminated module and electronic apparatus |
| 06/30/2011 | US20110156221 Method For Producing Ceramic Passivation Layers on Silicon For Solar Cell Manufacture |
| 06/30/2011 | US20110156220 Manufacturing method of semiconductor device and semiconductor device |
| 06/30/2011 | US20110156219 Semiconductor device |
| 06/30/2011 | US20110156218 Chip package |
| 06/30/2011 | US20110156217 Power devices having reduced on-resistance and methods of their manufacture |
| 06/30/2011 | US20110156205 Integrated circuit device and electronic instrument |
| 06/30/2011 | US20110156200 Semiconductor device |
| 06/30/2011 | US20110156190 Electronic component |
| 06/30/2011 | US20110156180 Package structure having micro-electromechanical element and fabrication method thereof |
| 06/30/2011 | US20110156163 Structure of electrode pick up in LOCOS |
| 06/30/2011 | US20110156147 Electrostatic discharge protection device |
| 06/30/2011 | US20110156146 eFUSE ENABLEMENT WITH THIN POLYSILICON OR AMORPHOUS-SILICON GATE-STACK FOR HKMG CMOS |
| 06/30/2011 | US20110156106 Hermetic mems device and method for fabricating hermetic mems device and package structure of mems device |
| 06/30/2011 | US20110156103 Method and System to Reduce Area of Standard Cells |
| 06/30/2011 | US20110156102 Memory device and method of fabricating the same |
| 06/30/2011 | US20110156085 Semiconductor package |
| 06/30/2011 | US20110156078 Semiconductor light-emitting device and method for forming the same |
| 06/30/2011 | US20110156036 Method for detecting a void |