| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/06/2011 | CN102117797A Anti-single-particle irradiation reinforcement circuit of CMOS integrated circuit |
| 07/06/2011 | CN102117796A Copper interconnection structure of integrated circuit and preparation method thereof |
| 07/06/2011 | CN102117795A Electrode lead-out structure in insulation process |
| 07/06/2011 | CN102117794A Electrode lead-out structure in STI process |
| 07/06/2011 | CN102117793A Efuse macro |
| 07/06/2011 | CN102117792A Coating structure of three-terminal regulator frame |
| 07/06/2011 | CN102117791A Package structure and manufacturing method thereof, and method of manufacturing leadframe structure |
| 07/06/2011 | CN102117790A Lead wire framework |
| 07/06/2011 | CN102117789A Semiconductor chip packaging structure and packaging method |
| 07/06/2011 | CN102117788A Electronic chip with dredging gap and substrate |
| 07/06/2011 | CN102117787A Heat sink |
| 07/06/2011 | CN102117786A Elastic connecting structure of semiconductor power tube |
| 07/06/2011 | CN102117785A Semiconductor power device packaging structure |
| 07/06/2011 | CN102117784A Heat sink and integrated circuit assembly |
| 07/06/2011 | CN102117783A Heat-radiating device |
| 07/06/2011 | CN102117782A Composite buried element structure and manufacturing method thereof |
| 07/06/2011 | CN102117781A Bonding structure and method for manufacturing same |
| 07/06/2011 | CN102117775A Filling method and device for contact hole of complementary metal oxide semiconductor |
| 07/06/2011 | CN102117771A LED epitaxial wafer and LED chip as well as manufacturing method thereof |
| 07/06/2011 | CN102117770A Power devices having reduced on-resistance and methods of their manufacture |
| 07/06/2011 | CN102117765A Semiconductor device with buried gate and method for fabricating the same |
| 07/06/2011 | CN102117752A Lead frame package structure and manufacturing method thereof |
| 07/06/2011 | CN102116986A Electronic paper display device and manufacturing method thereof |
| 07/06/2011 | CN102116977A Array substrate and manufacturing method thereof |
| 07/06/2011 | CN102115833A Gold beryllium alloy material for semiconductor devices and preparation method and application thereof |
| 07/06/2011 | CN101794753B Method for preparing micro-system radiating device |
| 07/06/2011 | CN101728384B Protecting component for electrostatic discharge of grid insulating double-junction transistor |
| 07/06/2011 | CN101681852B Flip chip with interposer, and methods of making same |
| 07/06/2011 | CN101657898B Method and structure for making a top-side contact to a substrate |
| 07/06/2011 | CN101652859B Clamping assembly |
| 07/06/2011 | CN101651125B Light-emitting diode base structure with buried capacitor |
| 07/06/2011 | CN101621917B Heatsink |
| 07/06/2011 | CN101621063B Array base plate and scanning line repair method thereof |
| 07/06/2011 | CN101599497B Thin-film-transistor array substrate and forming method thereof |
| 07/06/2011 | CN101593973B Static discharging protection circuit |
| 07/06/2011 | CN101593746B Chip packaging structure |
| 07/06/2011 | CN101593744B Alignment mark and manufacture method thereof |
| 07/06/2011 | CN101586753B Light source unit and lighting system |
| 07/06/2011 | CN101578701B Cooling structure for semiconductor device |
| 07/06/2011 | CN101572248B Resistance memory and method for fabricating integrated circuit with same |
| 07/06/2011 | CN101572244B Circuitry component fabricating method |
| 07/06/2011 | CN101546759B Method for manufacturing an electronic module and an electronic module |
| 07/06/2011 | CN101536183B lead frame stripe, semiconductor device and method for manufacturing lead frame |
| 07/06/2011 | CN101536182B 半导体器件 Semiconductor devices |
| 07/06/2011 | CN101501841B Semiconductor device and method for manufacturing a semiconductor device |
| 07/06/2011 | CN101500372B Electronic appliance and heat radiation substrate |
| 07/06/2011 | CN101480685B Method for molding heat conduction pipe and structure thereof |
| 07/06/2011 | CN101465341B Stacked chip packaging structure |
| 07/06/2011 | CN101393906B Ion injection test body, ion injection region mask board and ion injection test method |
| 07/06/2011 | CN101389941B Method of producing electronic components and pressure sensor |
| 07/06/2011 | CN101388359B Adhesion improvement for low k dielectrics to conductive materials |
| 07/06/2011 | CN101336465B Low area screen printed metal contact structure and method |
| 07/06/2011 | CN101312615B Printed circuit board and manufacturing method thereof |
| 07/06/2011 | CN101290913B Electronic element component having compound material base |
| 07/06/2011 | CN101271877B Flip chip encapsulation structure and carrier thereof |
| 07/06/2011 | CN101252092B Multi-chip packaging structure and making method thereof |
| 07/06/2011 | CN101227813B Radiator |
| 07/06/2011 | CN101207971B Bonding sheet for capacitor and method for manufacturing capacitor built-in printing wiring board |
| 07/06/2011 | CN101189718B Reduced inductance interconnect for enhanced microwave and millimeter-wave systems |
| 07/06/2011 | CN101167194B A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device |
| 07/06/2011 | CN101031426B Integrated circuit and method for manufacturing |
| 07/05/2011 | USRE42514 Extreme low-K dielectric film scheme for advanced interconnects |
| 07/05/2011 | US7974102 Integrated circuit carrier assembly |
| 07/05/2011 | US7974097 Printed circuit board and heat sink |
| 07/05/2011 | US7974096 Three-dimensional thermal spreading in an air-cooled thermal device |
| 07/05/2011 | US7973629 Method for making high-performance RF integrated circuits |
| 07/05/2011 | US7973434 Power supply system employing conductive fluid |
| 07/05/2011 | US7973419 Semiconductor device and method of fabricating the same |
| 07/05/2011 | US7973418 Solder bump interconnect for improved mechanical and thermo-mechanical performance |
| 07/05/2011 | US7973417 Integrated circuit and method of fabricating the same |
| 07/05/2011 | US7973416 Thru silicon enabled die stacking scheme |
| 07/05/2011 | US7973414 Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same |
| 07/05/2011 | US7973413 Through-substrate via for semiconductor device |
| 07/05/2011 | US7973412 Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead |
| 07/05/2011 | US7973411 Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods |
| 07/05/2011 | US7973408 Semiconductor chip passivation structures and methods of making the same |
| 07/05/2011 | US7973407 Three-dimensional stacked substrate arrangements |
| 07/05/2011 | US7973406 Bump-on-lead flip chip interconnection |
| 07/05/2011 | US7973405 Integrated circuit for driving semiconductor device and power converter |
| 07/05/2011 | US7973404 Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device |
| 07/05/2011 | US7973402 LED light using phosphor coated LEDs |
| 07/05/2011 | US7973401 Stacked chip package with redistribution lines |
| 07/05/2011 | US7973400 Semiconductor package having improved heat spreading performance |
| 07/05/2011 | US7973399 Embedded chip package |
| 07/05/2011 | US7973398 Embedded chip package structure with chip support protruding section |
| 07/05/2011 | US7973397 Package substrate having embedded semiconductor chip and fabrication method thereof |
| 07/05/2011 | US7973396 Electronic price tag device, pop device, management system for electronic price tag device, and method and program for controlling management system for electronic price tag device |
| 07/05/2011 | US7973395 Semiconductor device using lead frame |
| 07/05/2011 | US7973394 Enhanced integrated circuit package |
| 07/05/2011 | US7973392 Electronic device and method for manufacturing structure for electronic device |
| 07/05/2011 | US7973391 Tapered dielectric and conductor structures and applications thereof |
| 07/05/2011 | US7973382 Semiconductor device |
| 07/05/2011 | US7973365 Integrated RF ESD protection for high frequency circuits |
| 07/05/2011 | US7973341 Fuse of semiconductor device |
| 07/05/2011 | US7973340 Semiconductor integrated circuit with improved power supply system |
| 07/05/2011 | US7973323 Semiconductor device and manufacturing method thereof, and camera module including the same |
| 07/05/2011 | US7973316 Semiconductor device and method for manufacturing semiconductor device |
| 07/05/2011 | US7973310 Semiconductor package structure and method for manufacturing the same |
| 07/05/2011 | US7973309 TEG pattern for detecting void in device isolation layer and method of forming the same |
| 07/05/2011 | US7972963 Polished semiconductor wafer and process for producing it |