| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/07/2011 | US20110163445 Electronic Packages With Fine Particle Wetting and Non-Wetting Zones |
| 07/07/2011 | US20110163444 Semiconductor device having elastic solder bump to prevent disconnection |
| 07/07/2011 | US20110163443 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
| 07/07/2011 | US20110163442 Method of manufacturing a plurality of ics and transponders |
| 07/07/2011 | US20110163441 Pb-free solder bumps with improved mechanical properties |
| 07/07/2011 | US20110163440 Semiconductor device |
| 07/07/2011 | US20110163439 Die bonding a semiconductor device |
| 07/07/2011 | US20110163438 Semiconductor device and manufacturing method of the same |
| 07/07/2011 | US20110163437 Semiconductor package and method of manufacturing the same |
| 07/07/2011 | US20110163436 Wiring board, semiconductor device and method for manufacturing the same |
| 07/07/2011 | US20110163435 Lead frame substrate and method of manufacturing the same, and semiconductor device |
| 07/07/2011 | US20110163434 Stacked power converter structure and method |
| 07/07/2011 | US20110163433 Lead frame substrate, manufacturing method thereof, and semiconductor apparatus |
| 07/07/2011 | US20110163432 Semiconductor device and method of manufacturing the same |
| 07/07/2011 | US20110163431 Semiconductor device and method of manufacturing the same |
| 07/07/2011 | US20110163430 Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof |
| 07/07/2011 | US20110163429 Semiconductor Chip Package Assembly with Deflection-Resistant Leadfingers |
| 07/07/2011 | US20110163428 Semiconductor packages with embedded heat sink |
| 07/07/2011 | US20110163427 Method and apparatus for directing molding compound flow and resulting semiconductor device packages |
| 07/07/2011 | US20110163426 Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration |
| 07/07/2011 | US20110163425 Semiconductor device |
| 07/07/2011 | US20110163423 Method for stacking serially-connected integrated circuits and multi-chip device made from same |
| 07/07/2011 | US20110163394 Semiconductor contact structure and method of fabricating the same |
| 07/07/2011 | US20110163392 Semiconductor device and method of manufacturing the same |
| 07/07/2011 | US20110163391 Wafer level stack die package |
| 07/07/2011 | US20110163384 Semiconductor device |
| 07/07/2011 | US20110163352 Monolithic multi-channel esd protection device |
| 07/07/2011 | US20110163345 Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing the same |
| 07/07/2011 | US20110163328 Optical semiconductor device |
| 07/07/2011 | US20110163312 Semiconductor-on-diamond devices and methods of forming |
| 07/07/2011 | US20110163051 Support structure of photovoltaic device |
| 07/07/2011 | US20110162873 Forming conductive features of electronic devices |
| 07/07/2011 | US20110162702 Quasi-pyramidal textured surfaces using phase-segregated masks |
| 07/07/2011 | DE112009002077T5 Verfahren und Vorrichtungen für einen integrierten Schaltkreis mit integrierter Energiespeichervorrichtung Methods and apparatus for an integrated circuit with integrated energy storage device |
| 07/07/2011 | DE10302611B4 Polierte Halbleiterscheibe und Verfahren zu deren Herstellung und Anordnung bestehend aus einer Halbleiterscheibe und einem Schild Polished semiconductor wafer and method for their production and assembly consisting of a semiconductor wafer and a shield |
| 07/07/2011 | DE10254756B4 Vorrichtung und Verfahren zur Erfassung von Stressmigrations-Eigenschaften Apparatus and method for detection of stress migration properties |
| 07/07/2011 | DE102010064258A1 Halbleiterbauelement mit Überstromschutz A semiconductor device having over-current protection |
| 07/07/2011 | DE102010064253A1 Halbleiterbauelement mit Detektion thermisch bedingter Fehler Semiconductor device with detection of thermally induced errors |
| 07/07/2011 | DE102010052071A1 Gehäusesysteme von Mikrosystemtechnik-Mikrofonen Housing systems of Microsystems Engineering microphones |
| 07/07/2011 | DE102010030041A1 Elektronische Vorrichtung, organische Licht-emittierende Vorrichtung und mehrschichtige Schutzstruktur An electronic device, organic light-emitting device and multi-layer protective structure |
| 07/07/2011 | DE102009060873A1 Integrated circuit e.g. scalable high speed current driver, for switching high current, has output terminal connected with electricity generating units, and supply and output terminals that are parallelly switched on substrate |
| 07/07/2011 | DE102009060750A1 Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung The optoelectronic semiconductor chip and method of manufacture |
| 07/07/2011 | DE102009055439A1 Halbleiterbauelement mit halbleiterbasierten e-Sicherungen mit besserer Programmiereffizienz durch erhöhte Metallagglomeration und/oder Hohlraumbildung A semiconductor device having semiconductor-based e-fuses with better programming efficiency due to increased metal agglomeration and / or cavitation |
| 07/07/2011 | DE102008038175B4 Halbleiteranordnung und Verfahren zur Herstellung von Halbleiteranordnungen A semiconductor device and process for producing semiconductor devices |
| 07/07/2011 | DE102007015292B4 Verfahren zur Herstellung eines Metall/Keramik-Verbindungssubstrats A method for producing a metal / ceramic bonding substrate |
| 07/07/2011 | DE102007009901B4 Technik zum Strukturieren unterschiedlich verspannter Schichten, die über Transistoren ausgebildet sind, durch verbesserte Ätzsteuerungsstrategien Technique for patterning differently strained layers, which are formed over the transistors, through improved Ätzsteuerungsstrategien |
| 07/07/2011 | CA2786143A1 Graphite-containing moulded body and method for the production thereof |
| 07/07/2011 | CA2786134A1 Layered composite material for use in a redox flow battery |
| 07/06/2011 | EP2341561A2 Bracket for supporting an LED |
| 07/06/2011 | EP2341535A1 Pressure-contacted high performance semiconductor module with hybrid pressure accumulator |
| 07/06/2011 | EP2341534A1 Power semiconductor module |
| 07/06/2011 | EP2341533A2 Module construction and connection technology by means of metal scrap web or bent stamping parts bent from a plane |
| 07/06/2011 | EP2341532A1 Power semiconductor module and semiconductor power converter provided with the same |
| 07/06/2011 | EP2341531A1 Semiconductor device and semiconductor device manufacturing method |
| 07/06/2011 | EP2341463A2 Data carrier/transmission device and method for manufacturing it |
| 07/06/2011 | EP2341030A2 Microelectromechanical system device and method of manufacturing the microelectromechanical system device |
| 07/06/2011 | EP2340694A1 Printed circuit board for harsh environments |
| 07/06/2011 | EP2340559A1 Pb-free solder bumps with improved mechanical properties |
| 07/06/2011 | EP2340558A1 Cooling arrangement |
| 07/06/2011 | EP2340557A1 Microelectronic package assembly, method for disconnecting a microelectronic package |
| 07/06/2011 | EP2340554A1 Methods and systems for material bonding |
| 07/06/2011 | EP2340553A1 Method for manufacturing a microelectronic package comprising at least one microelectronic device |
| 07/06/2011 | EP2340552A1 3d integration of a mim capacitor and a resistor |
| 07/06/2011 | EP2257616B1 Thermally conductive silicone grease composition |
| 07/06/2011 | EP1498015B1 Power converter module |
| 07/06/2011 | CN201894038U Structure for tightly connecting heat-pipe-type radiator and heat source |
| 07/06/2011 | CN201894035U Heat exchange structure with distribution function |
| 07/06/2011 | CN201894030U Structure for improving heat dissipation effect of heat conducting component |
| 07/06/2011 | CN201893688U Megawatt power conversion component |
| 07/06/2011 | CN201893346U Thin surface-mounted diode |
| 07/06/2011 | CN201893345U Dual-cross gate film transistor structure of pixel circuit of organic light-emitting device |
| 07/06/2011 | CN201893344U Dual-gate film transistor structure of pixel circuit of organic light-emitting device |
| 07/06/2011 | CN201893343U TFT structure for cross-shaped grid of pixel circuit of organic luminescent device |
| 07/06/2011 | CN201893337U Plate-type differential pair transistor |
| 07/06/2011 | CN201893336U Substrate structure |
| 07/06/2011 | CN201893335U Dual-chip integrated circuit lead frame |
| 07/06/2011 | CN201893334U Dual flat short-pin integrated circuit (IC) chip packaging part |
| 07/06/2011 | CN201893333U Novel integrated circuit frame structure |
| 07/06/2011 | CN201893332U Glass passivation high-voltage semiconductor rectifier |
| 07/06/2011 | CN201893331U Heat dissipation structure |
| 07/06/2011 | CN201893330U 叠层式散热器 Stacked radiators |
| 07/06/2011 | CN201893329U Improved radiator |
| 07/06/2011 | CN201893328U Radiating fin of heating element |
| 07/06/2011 | CN201893327U Heat radiation device |
| 07/06/2011 | CN201892439U Stacked water cooling radiator |
| 07/06/2011 | CN1971912B 半导体集成电路及其设计方法 Semiconductor integrated circuit and design method |
| 07/06/2011 | CN1855465B Display device |
| 07/06/2011 | CN1716596B Method for producing static discharging protection in micro module and relative microelectronic module |
| 07/06/2011 | CN1622334B Solid state imaging device and producing method thereof |
| 07/06/2011 | CN1607875B Display device and method for manufacturing same |
| 07/06/2011 | CN102119230A Display device, Cu alloy film for use in the display device, and Cu alloy sputtering target |
| 07/06/2011 | CN102119184A Thermosetting composition |
| 07/06/2011 | CN102118954A Miniature liquid cooling device |
| 07/06/2011 | CN102117827A Parasitic vertical PNP device in bipolar complementary metal oxide semiconductor (BiCMOS) process |
| 07/06/2011 | CN102117817A Ultrathin packaging structure and packaging method of image sensing chip |
| 07/06/2011 | CN102117803A Chip provided with high electrostatic discharge performance |
| 07/06/2011 | CN102117802A Integrated circuit layout structure modeled by applying chemical-mechanical lapping process |
| 07/06/2011 | CN102117800A Semiconductor chip stack and production method thereof |
| 07/06/2011 | CN102117799A Buried multi-chip semiconductor package structure and manufacturing method thereof |
| 07/06/2011 | CN102117798A Stack package |