| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/13/2011 | CN101180562B Optically enabled hybrid semiconductor package |
| 07/13/2011 | CN101127348B Plastic overmolded packages with molded lid attachments |
| 07/13/2011 | CN101064485B Electric circuit device, electric circuit module, and power converter |
| 07/13/2011 | CN101047165B Overlay mark arrangement for reducing overlay shift |
| 07/13/2011 | CN101034676B Methods for detecting charge effects during semiconductor processing |
| 07/13/2011 | CN101005108B Power type light emitting diode heat sink and its method |
| 07/12/2011 | US7979224 Configurable voltage regulator |
| 07/12/2011 | US7979148 Audio signal processing apparatus |
| 07/12/2011 | US7978478 Printed circuit board |
| 07/12/2011 | US7978473 Cooling apparatus with cold plate formed in situ on a surface to be cooled |
| 07/12/2011 | US7978472 Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof |
| 07/12/2011 | US7978070 Tamper respondent enclosure |
| 07/12/2011 | US7977848 Planar surface acoustic wave device, communication module, and communication apparatus |
| 07/12/2011 | US7977805 Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate |
| 07/12/2011 | US7977804 Ball-bump bonded ribbon-wire interconnect |
| 07/12/2011 | US7977803 Chip structure with bumps and testing pads |
| 07/12/2011 | US7977802 Integrated circuit packaging system with stacked die and method of manufacture thereof |
| 07/12/2011 | US7977801 Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method |
| 07/12/2011 | US7977799 Planar packageless semiconductor structure with via and coplanar contacts |
| 07/12/2011 | US7977798 Integrated circuit having a semiconductor substrate with a barrier layer |
| 07/12/2011 | US7977797 Integrated circuit with contact region and multiple etch stop insulation layer |
| 07/12/2011 | US7977796 Semiconductor device and multilayer wiring board |
| 07/12/2011 | US7977795 Semiconductor device, method of fabricating the same, and pattern generating method |
| 07/12/2011 | US7977794 Aluminum metal line of a semiconductor device and method of fabricating the same |
| 07/12/2011 | US7977793 Metal line of semiconductor device having a diffusion barrier with an amorphous TaBN layer and method for forming the same |
| 07/12/2011 | US7977792 Semiconductor device |
| 07/12/2011 | US7977791 Selective formation of boron-containing metal cap pre-layer |
| 07/12/2011 | US7977790 Semiconductor device and method of manufacturing the same |
| 07/12/2011 | US7977789 Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same |
| 07/12/2011 | US7977788 Contact structure having a compliant bump and a testing area |
| 07/12/2011 | US7977787 Semiconductor device |
| 07/12/2011 | US7977786 Saw debris reduction in MEMS devices |
| 07/12/2011 | US7977785 Electronic device including dies, a dielectric layer, and a encapsulating layer |
| 07/12/2011 | US7977784 Semiconductor package having redistribution layer |
| 07/12/2011 | US7977783 Wafer level chip size package having redistribution layers |
| 07/12/2011 | US7977782 Integrated circuit package system with dual connectivity |
| 07/12/2011 | US7977781 Semiconductor device |
| 07/12/2011 | US7977780 Multi-layer package-on-package system |
| 07/12/2011 | US7977779 Mountable integrated circuit package-in-package system |
| 07/12/2011 | US7977778 Integrated circuit package system with interference-fit feature |
| 07/12/2011 | US7977776 Multichip discrete package |
| 07/12/2011 | US7977775 Semiconductor device and manufacturing method of the same |
| 07/12/2011 | US7977774 Fusion quad flat semiconductor package |
| 07/12/2011 | US7977773 Leadframe including die paddle apertures for reducing delamination |
| 07/12/2011 | US7977771 Semiconductor device and method of manufacturing semiconductor device |
| 07/12/2011 | US7977770 Semiconductor device and method of manufacturing the same |
| 07/12/2011 | US7977766 Trench anti-fuse structures for a programmable integrated circuit |
| 07/12/2011 | US7977765 Antifuse circuit with well bias transistor |
| 07/12/2011 | US7977764 Semiconductor device |
| 07/12/2011 | US7977763 Chip package with die and substrate |
| 07/12/2011 | US7977700 Resin and metal semiconductor device package and semiconductor light-emitting device incorporating the package |
| 07/12/2011 | US7977597 Wire bonders and methods of wire-bonding |
| 07/12/2011 | US7977412 Epoxy resin composition and semiconductor device |
| 07/12/2011 | US7977239 Semiconductor device and method for fabricating the same |
| 07/12/2011 | US7977238 Method of manufacturing a semiconductor integrated circuit device |
| 07/12/2011 | US7977233 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium |
| 07/12/2011 | US7977230 Rectangular contact used as a low voltage fuse element |
| 07/12/2011 | US7977229 Method for fabricating resin-molded semiconductor device having posts with bumps |
| 07/12/2011 | US7977164 Fuse of a semiconductor memory device and repair process for the same |
| 07/12/2011 | US7977160 Semiconductor devices having stress relief layers and methods for fabricating the same |
| 07/12/2011 | US7977159 Memory chip and semiconductor device using the memory chip and manufacturing method of those |
| 07/12/2011 | US7977156 Chipstack package and manufacturing method thereof |
| 07/12/2011 | US7977124 Semiconductor device and method of designing the same |
| 07/12/2011 | US7976635 Dual substrate loadlock process equipment |
| 07/07/2011 | WO2011082428A1 Amorphous alloy seal and bonding |
| 07/07/2011 | WO2011082241A2 Microelectromechanical system having movable element integrated into leadframe-based package |
| 07/07/2011 | WO2011082214A2 Leadframe-based premolded package having acoustic air channel for microelectromechanical system (mems) device |
| 07/07/2011 | WO2011081844A2 Patch on interposer assembly and structures formed thereby |
| 07/07/2011 | WO2011081831A2 Hermetic electrical feedthrough |
| 07/07/2011 | WO2011081696A2 Dap ground bond enhancement |
| 07/07/2011 | WO2011081428A2 Pop package and manufacturing method thereof |
| 07/07/2011 | WO2011081249A1 Package module structure for high power device with metal substrate and method of manufacturing the same |
| 07/07/2011 | WO2011081202A1 Method for manufacturing an electronic component, electronic component, plasma treatment device, control program, and recording medium |
| 07/07/2011 | WO2011081166A1 Structure for disposing device and method for disposing device |
| 07/07/2011 | WO2011081130A1 Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method |
| 07/07/2011 | WO2011080827A1 Wiring structure and method for forming same |
| 07/07/2011 | WO2011080336A2 Graphite-containing moulded body and method for the production thereof |
| 07/07/2011 | WO2011080093A1 Power electronic module with non-linear resistive field grading and method for its manufacturing |
| 07/07/2011 | WO2011079899A1 Amplifier component comprising a compensation element |
| 07/07/2011 | WO2011079545A1 Light emitting diode packaging structure |
| 07/07/2011 | WO2011079474A1 White light luminescent device based on purple light leds |
| 07/07/2011 | WO2011031417A3 Electronic device submounts with thermally conductive vias and light emitting devices including the same |
| 07/07/2011 | WO2011025299A3 Heat sink including silicon carbide and manufacturing method thereof |
| 07/07/2011 | WO2010049087A8 A semiconductor device including a reduced stress configuration for metal pillars |
| 07/07/2011 | US20110164951 Apparatus and method for predetermined component placement to a target platform |
| 07/07/2011 | US20110163461 Electronic packaging |
| 07/07/2011 | US20110163460 Thermally Conductive Silicone Composition And Semiconductor Device |
| 07/07/2011 | US20110163459 Method for manufacturing a stacked semiconductor package, and stacked semiconductor package |
| 07/07/2011 | US20110163457 Integrated circuit micro-module |
| 07/07/2011 | US20110163456 Electronic device substrate, electronic device, method of manufacturing electronic device substrate, method of manufacturing electronic device, and electronic apparatus |
| 07/07/2011 | US20110163455 Tunnel Junction Via |
| 07/07/2011 | US20110163454 Electroless plating a nickle layer and a gold layer in a semiconductor device |
| 07/07/2011 | US20110163453 Semiconductor device and method for manufacturing the same |
| 07/07/2011 | US20110163452 Semiconductor device, method of manufacturing semiconductor device, and substrate processing apparatus |
| 07/07/2011 | US20110163451 Film forming method and processing system |
| 07/07/2011 | US20110163450 Integrated circuit line with electromigration barriers |
| 07/07/2011 | US20110163449 Superfilled metal contact vias for semiconductor devices |
| 07/07/2011 | US20110163448 Substrate having a transparent electrode and method for producing the same |
| 07/07/2011 | US20110163447 High-Purity Copper or High-Purity Copper Alloy Sputtering Target, Process for Manufacturing the Sputtering Target, and High-Purity Copper or High-Purity Copper Alloy Sputtered Film |
| 07/07/2011 | US20110163446 Method to generate airgaps with a template first scheme and a self aligned blockout mask and structure |